Polyaniline epoxy silicone graphene heat dissipation electrostatic conductive paint

A technology of polyaniline epoxy and epoxy silicone, which is applied in conductive coatings, epoxy resin coatings, coatings, etc., can solve the problems affecting the performance and life of electronic products, the temperature rise of components and circuits, and insufficient heat dissipation. Achieve the effect of improving heat dissipation efficiency and its comprehensive performance, improving thermal conductivity and thermal radiation rate, and improving anti-corrosion performance

Inactive Publication Date: 2018-03-02
TIANJIN MEISHIBANG PAINT CHEM IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the heat dissipation capacity of the product is insufficient, the temperature of components and circuits will rise, which will cause thermal deformation and thermal failure of the equipment, affecting the performance and life of electronic products

Method used

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  • Polyaniline epoxy silicone graphene heat dissipation electrostatic conductive paint
  • Polyaniline epoxy silicone graphene heat dissipation electrostatic conductive paint
  • Polyaniline epoxy silicone graphene heat dissipation electrostatic conductive paint

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] Polyaniline epoxy organosilicon graphene heat-dissipating and conductive electrostatic coating, comprises main agent A and curing agent B, and the weight ratio of described main agent A and curing agent B is 3:1; Described main agent A comprises each of the following weight percentages: Components: epoxy silicone resin 43.0%, dispersant 1.4%, conductive titanium dioxide 24.4%, graphene 0.02%, carbon nanotube 0.2%, defoamer 0.34%, leveling agent 0.44%, polyaniline 0.2%, Surface modifier 2.0%, diluent 28.0%.

[0029] The curing agent is alicyclic amine.

[0030] The epoxy silicone resin is Degussa's silicone modified epoxy resin.

[0031] The dispersant is BYK-161 of BYK Company in Germany; the conductive titanium dioxide is FT-300 produced by Ishihara.

[0032] The defoamer is BYK-051 of BYK Company of Germany; the leveling agent is BYK-354 of BYK Company of Germany.

[0033] The carbon nanotubes are TNHC from Chengdu Institute of Organic Chemistry, Chinese Academy of...

Embodiment 2

[0047]Polyaniline epoxy organosilicon graphene heat-dissipating and conductive static coating, comprises main agent A and curing agent B, and the weight ratio of described main agent A and curing agent B is 5:1; Described main agent A comprises each of the following weight percentages: Components: epoxy silicone resin 45.5%, dispersant 1.7%, conductive titanium dioxide 29.8%, graphene 0.03%, carbon nanotube 0.3%, defoamer 0.25%, leveling agent 0.25%, polyaniline 0.6%, Surface modifier 2.5%, diluent 19.07%.

[0048] The curing agent is phenalkamine.

[0049] The epoxy silicone resin is Degussa's silicone modified epoxy resin.

[0050] The dispersant is BYK-161 of BYK Company in Germany; the conductive titanium dioxide is FT-300 produced by Ishihara.

[0051] The defoamer is BYK-051 of BYK Company of Germany; the leveling agent is BYK-354 of BYK Company of Germany.

[0052] The carbon nanotubes are TNHC from Chengdu Institute of Organic Chemistry, Chinese Academy of Sciences....

Embodiment 3

[0066] Polyaniline epoxy organosilicon graphene heat-dissipating and conductive electrostatic coating, comprises main agent A and curing agent B, and the weight ratio of described main agent A and curing agent B is 7:1; Described main agent A comprises each of following weight percent Components: epoxy silicone resin 48%, dispersant 2.0%, conductive titanium dioxide 30.0%, graphene 0.04%, carbon nanotube 0.4%, defoamer 0.3%, leveling agent 0.3%, polyaniline 0.6%, Surface modifier 3.0%, diluent 15.36%.

[0067] The curing agent is phenalkamine.

[0068] The epoxy silicone resin is Degussa's silicone modified epoxy resin.

[0069] The dispersant is BYK-161 of BYK Company in Germany; the conductive titanium dioxide is FT-300 produced by Ishihara.

[0070] The defoamer is BYK-051 of BYK Company of Germany; the leveling agent is BYK-354 of BYK Company of Germany.

[0071] The carbon nanotubes are TNHC from Chengdu Institute of Organic Chemistry, Chinese Academy of Sciences.

[...

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PUM

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Abstract

The invention provides a polyaniline epoxy silicone graphene heat dissipation electrostatic conductive paint. The coating mainly consists of epoxy silicone resin, graphene, carbon nanotubes, conductive titanium dioxide, polyaniline and other additives, wherein the epoxy silicone resin is coating resin with strong weather resistance and heat resistance, the polyaniline resin can greatly improve theheat radiation value and the electric conductivity of the coating, the graphene and the carbon nanotubes can further accelerate heat transfer, the conductive titanium dioxide has the effects of heatresistance, weather resistance, electric conduction and heat conduction, and the polyaniline, the carbon nanotubes, the graphene and the conductive titanium dioxide finally form a full three-dimensional network structure distribution of combination of points, lines and planes in fluid. The polyaniline epoxy silicone graphene heat dissipation coating provided by the invention has the characteristics of high heat radiation rate, high heat conductivity and low heat resistance, and simultaneously has the characteristics of polyaniline and epoxy silicone, thereby having a strong practical value.

Description

technical field [0001] The invention belongs to the fields of chemical industry and energy, and in particular relates to a polyaniline epoxy silicone graphene heat-dissipating and static-conductive coating. Background technique [0002] Modern electronic equipment is increasingly becoming a highly integrated system with high-density assembly, which makes the heat flux density of the product increasingly large. If the heat dissipation capacity of the product is insufficient, the temperature of components and circuits will rise, which will cause thermal deformation and thermal failure of the equipment, affecting the performance and life of electronic products. In the fields of metallurgy, petrochemical, ceramics, medicine and other industries, various industrial boilers, power plant boilers, flame furnaces and other furnaces are often involved. The heat dissipation performance is very important to the safety of personnel and the reliable operation of equipment. Therefore, how...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D163/00C09D5/24C09D7/61
CPCC08K2003/2241C09D5/24C09D163/00C08L79/02C08K3/22C08K3/04C08K7/24
Inventor 马翔宇王新征
Owner TIANJIN MEISHIBANG PAINT CHEM IND
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