A kind of high-efficiency high-temperature-resistant heat-conducting underfill glue and preparation method thereof
An underfill and high temperature resistant technology, used in adhesives, epoxy resin adhesives, non-polymer adhesive additives, etc., can solve the problems affecting the efficiency and yield of packaging components, large thermal expansion deformation, poor high temperature resistance, etc. problem, to achieve the effect of small thermal expansion coefficient, fast flow rate and high glass transition temperature
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Embodiment 1
[0030] 1) Prepare a primary mixture: 240g of biphenyl epoxy resin YL-6121H (MITSUBISHI, Japan), 150g of alicyclic epoxy resin S-06E (SYNASIA, Nantong, China) and 30g of curing agent accelerator 2MZ-A (SHIKOKU, Japan) Add it into the reaction kettle, with the stirrer speed at 30-40rpm, the disperser at 200-300rpm, stir for 1-2h, add SE 6050-SQ (Japan Admatechs) 220g, AE2054-SML (Japan Admatechs) 80g, stir for 1-2 hours 2h, to obtain a mixture;
[0031] 2) Prepare the secondary mixture: take out the primary mixture prepared in step 1), put it into a three-roll mill for mixing, set the minimum distance between the three-roll mill to 20 μm, and set the ambient temperature to ≤25°C and the ambient humidity to ≤RH20% Under the condition, mix 1h, obtain secondary mixture;
[0032] 3) Preparation of high-efficiency high-temperature heat-resistant and thermally conductive underfill: combine the secondary mixture prepared in step 2) with 3 g of silane coupling agent Z-6940 (Dow Corning...
Embodiment 2
[0034] 1) Prepare a primary mixture: 90g of biphenyl epoxy resin YL-6677 (MITSUBISHI, Japan), 100g of phenolic epoxy resin EPALLOY-8330 (CVC in the United States), and alicyclic epoxy resin S-28E (SYNASIA, Nantong, China) Add 140g and 10g of curing agent accelerator K-54 (Air, USA) into the reaction kettle, stir with the agitator at 30-40rpm and disperser at 200-300rpm for 1-2h, then add SE 6050-SQ (Admatechs, Japan) 360g, PT-BN (Shanghai Pantian) 90g, stirred for 1-2 hours to obtain a primary mixture;
[0035] 2) Prepare the secondary mixture: take out the primary mixture prepared in step 1), put it into a three-roll mill for mixing, set the minimum distance between the three-roll mill to 20 μm, and set the ambient temperature to ≤25°C and the ambient humidity to ≤RH20% Under the condition, mix 1h, obtain secondary mixture;
[0036]3) Preparation of high-efficiency high-temperature heat-resistant and thermally conductive underfill: combine the secondary mixture prepared in s...
Embodiment 3
[0038] 1) Prepare a primary mixture: Alicyclic epoxy resin S-06E (SYNASIA, Nantong, China) 240g, glycidylamine epoxy resin MF8120 (Mitsui Group, Japan) 130g, and curing agent accelerator 2PHZ-CN (SHIKOKU, Japan) 30g Into the reaction kettle, the stirrer speed is 30-40rpm, the disperser is 200-300rpm, stirring for 1-2h, add SE6050-SQ (Japan Admatechs) 230g, AE 2054-SML (Japan Admatechs) 80g, MG-5 ( Japan STARMAG) 50g, stirred for 1-2h to obtain a primary mixture;
[0039] 2) Prepare the secondary mixture: take out the primary mixture prepared in step 1), put it into a three-roll mill for mixing, set the minimum distance between the three-roll mill to 20 μm, and set the ambient temperature to ≤25°C and the ambient humidity to ≤RH20% Under the condition, mix 1h, obtain secondary mixture;
[0040] 3) Preparation of high-efficiency high-temperature heat-resistant and thermally conductive underfill: combine the secondary mixture prepared in step 2), 3g of silane coupling agent KBM-...
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