Thermal conduction potting silica gel based on phase-changing microcapsule and preparation method of thermal conduction potting silica gel

A technology of phase-change microcapsules and heat-conducting potting, which is applied in the direction of chemical instruments and methods, adhesives, heat exchange materials, etc., can solve the problems of poor thermal conductivity, permeation migration, poor compatibility, etc., and achieve thermal conductivity and storage Good thermal temperature control performance, increase uniform dispersion, and ensure the effect of temperature uniformity

Active Publication Date: 2018-03-20
AEROSPACE INST OF ADVANCED MATERIALS & PROCESSING TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the heat conduction agent in the phase change composite material in this patent application is expanded graphite, which has limited adsorption capacity for phase change materials, and repeated use will cause serious problems of melt flow and permeation migration of phase change materials; in addition, expanded graphite heat conduction fillers It will seriously affect the insulation performance of potting silica gel, which is not conducive to the potting application in conductive occasions. As a thermal management system for power batteries, it has a great impact on the overall safety and reliability of power batteries, so it is not suitable for popularization and application; secondly, the The heat-conducting agent used in the heat-conducting silica gel in the patent application is alumina and magnesia, which have not undergone surface treatment, and the compatibility between the directly added filler and the silica gel matrix is ​​poor, resulting in the uniform dispersion of the heat-conducting filler in the silica gel matrix Poor performance, increased thermal resistance at the phase interface between filler / matrix, and poor thermal conductivity

Method used

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  • Thermal conduction potting silica gel based on phase-changing microcapsule and preparation method of thermal conduction potting silica gel
  • Thermal conduction potting silica gel based on phase-changing microcapsule and preparation method of thermal conduction potting silica gel
  • Thermal conduction potting silica gel based on phase-changing microcapsule and preparation method of thermal conduction potting silica gel

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preparation example Construction

[0033] The phase-change microcapsules described in the present invention can be commercially available phase-change microcapsules, for example, paraffin alkane can be used as the core material, urea-formaldehyde resin is used as the shell, and a thermally conductive filler is also contained. The thermally conductive filler is coated with paraffin wax in the urea-formaldehyde resin. The low-temperature heat-controlled phase-change microcapsules are added in the alkane process, and the heat-conducting filler is added in an amount of 5% to 30% of the paraffin alkane mass percentage. The specific preparation method of the low-temperature thermally controlled phase change microcapsules, for example, may include: the first step, paraffin alkane preheating; the second step, urea-formaldehyde resin prepolymer synthesis; the third step, styrene maleic anhydride resin solution , water and inorganic salt polymerization; the fourth step, the materials are mixed to obtain the mixture; the f...

Embodiment 1

[0050]① Weigh 7g of thermally conductive filler nano-alumina powder and 0.07g of silane coupling agent n-octyltriethoxysilane, prepare n-octyltriethoxysilane and water at a mass ratio of 1:3 to make a solution, add Proper amount of ethanol was mixed evenly and allowed to stand for 20 minutes. Slowly add the hydrolyzed silane coupling agent solution into the thermally conductive filler, stir well until it is uniformly dispersed, and heat and stir the mixed solution in a water bath at 65°C, so that the hydrolyzed silane coupling agent can perform surface treatment on the thermally conductive filler , to obtain a surface-treated thermally conductive filler mixture. Centrifuge the surface-treated thermally conductive filler mixture at a centrifugal speed of 1500r / min for 6 minutes for solid-liquid separation and separate the thermally conductive filler solid matter, and place the thermally conductive filler solid material in a 75°C drying oven for vacuum drying treatment After 13...

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Abstract

The invention relates to thermal conduction potting silica gel based on a phase-changing microcapsule and a preparation method of the thermal conduction potting silica gel. The thermal conduction potting silica gel is prepared from the following components by mass percent: 50 to 90 percent of dual-component potting silica gel, 5 to 25 percent of phase-changing microcapsules and 5 to 25 percent ofsurface-treated thermal conduction filler. The preparation method comprises the following steps: treating the surface of the thermal conduction filler; preparing the thermal conduction composite filler; preparing a component A and a component B in the dual-component potting silica gel; preparing a component A1 and a component B1 in the thermal conduction potting silica gel; and preparing the thermal conduction potting silica gel. According to the preparation method, the surface treatment is performed on the thermal conduction filler in the preparation process, so that the dispersity of the thermal conduction filler in a silica gel matrix is improved, and the thermal conduction performance of the thermal conduction potting silica gel is improved; and by adding the phase-changing microcapsule, the thermal conduction potting silica gel has the heat-storage temperature control performance. The thermal conduction potting silica gel has good thermal conduction performance and heat-storage temperature control performance.

Description

technical field [0001] The invention relates to the technical field of battery heat management, in particular to a phase-change microcapsule-based heat-conducting potting silica gel and a preparation method thereof. Background technique [0002] Batteries such as secondary batteries have been widely used as energy sources for wireless mobile devices, such as power sources for electric vehicles, hybrid electric vehicles, and plug-in hybrid electric vehicles, etc., thereby solving problems caused by vehicles using petroleum fuels. For issues such as air pollution, small wireless mobile devices may use one or more battery cells, while medium or large wireless devices such as vehicles may use medium or large battery modules that include multiple battery cells connected to each other. Or large battery modules are usually manufactured to have the smallest possible size and weight, so the battery cells stacked in these battery modules are highly integrated. [0003] During chargin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J183/07C09J11/04C09J11/08C09K5/14H01M10/625H01M10/653
CPCC08K2003/2227C08K2003/282C08K2201/011C08L2203/206C08L2205/025C09J11/04C09J11/08C09J183/04C09K5/14H01M10/625H01M10/653C08L83/04C08L91/06C08K9/00C08K3/22C08K3/28C08K7/24Y02E60/10
Inventor 张雅倩金兆国党广洲张靖驰陈建纪旭阳刘斌张天翔
Owner AEROSPACE INST OF ADVANCED MATERIALS & PROCESSING TECH
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