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Secondary airtightness sealing method of quantum dot On-chip white light LED

An encapsulation method and technology of quantum dots, applied in electrical components, circuits, semiconductor devices, etc., can solve the problems of poor air tightness and poor performance, achieve improved luminous efficiency, high luminous efficiency and high stability, improved luminous efficiency and The effect of stability

Inactive Publication Date: 2018-03-23
SOUTH CHINA NORMAL UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The airtightness of the current LED packaging bracket and packaging glue is relatively poor, so the stability of On-chip white light LED is worse than that of quantum dot fluorescence enhanced film and quantum dot glass guide rail.

Method used

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  • Secondary airtightness sealing method of quantum dot On-chip white light LED
  • Secondary airtightness sealing method of quantum dot On-chip white light LED
  • Secondary airtightness sealing method of quantum dot On-chip white light LED

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0044] The encapsulation of quantum dot On-chip white light LED with secondary airtight protection includes the following steps:

[0045] (1) Fix the blue light chip on the bottom of the LED bracket after crystal bonding, wire bonding, and baking in the LED bracket;

[0046] (2) Move the LED bracket with the blue chip fixed into the atomic layer deposition system, and deposit an aluminum oxide film layer at 80°C to improve the ability of the LED bracket to block water and oxygen, with a thickness of 50nm;

[0047] (3) Weigh 0.2g of component A of epoxy resin AB curing glue and 0.2g of component B of epoxy resin AB curing glue into a beaker, stir evenly to obtain encapsulation glue, add 120 μl of green light quantum dots and 20 μl of red light quantum dots , Stir and mix evenly again, put it into a vacuum oven, and vacuumize for 20 minutes to remove the air bubbles in the colloid, and obtain a uniformly dispersed quantum dot fluorescent colloid;

[0048] Move the LED bracket a...

Embodiment 2

[0051] The encapsulation of quantum dot On-chip white light LED without airtight protection in a nitrogen atmosphere includes the following steps:

[0052] (1) Fix the blue light chip on the bottom of the LED bracket after crystal bonding, wire bonding, and baking in the LED bracket;

[0053] (2) Move the LED bracket with the blue chip fixed into the atomic layer deposition system, and deposit an aluminum oxide film layer at 80°C to improve the ability of the LED bracket to block water and oxygen, with a thickness of 50nm;

[0054] (3) Weigh 0.2g of component A of epoxy resin AB curing glue and 0.2g of component B of epoxy resin AB curing glue into a beaker, stir evenly to obtain encapsulation glue, add 120 μl of green light quantum dots and 20 μl of red light quantum dots , Stir and mix evenly again, put it into a vacuum oven, and vacuumize for 20 minutes to remove the air bubbles in the colloid, and obtain a uniformly dispersed quantum dot fluorescent colloid;

[0055] Move...

Embodiment 3

[0057] The encapsulation of quantum dot On-chip white light LED without airtight protection in the air atmosphere includes the following steps:

[0058] (1) Fix the blue light chip on the bottom of the LED bracket after crystal bonding, wire bonding, and baking in the LED bracket;

[0059] (2) Move the LED bracket with the blue chip fixed into the atomic layer deposition system, and deposit an aluminum oxide film layer at 80°C to improve the ability of the LED bracket to block water and oxygen, with a thickness of 50nm;

[0060] (3) Weigh 0.2g of component A of epoxy resin AB curing glue and 0.2g of component B of epoxy resin AB curing glue into a beaker, stir evenly to obtain encapsulation glue, add 120 μl of green light quantum dots and 20 μl of red light quantum dots , Stir and mix evenly again, put it into a vacuum oven, and vacuumize for 20 minutes to remove the air bubbles in the colloid, and obtain a uniformly dispersed quantum dot fluorescent colloid;

[0061] In the ...

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Abstract

The invention discloses a secondary airtightness sealing method of a quantum dot On-chip white light LED. The method comprises steps of fixing a blue light chip on the bottom of an LED support; through the low-temperature deposition technology including the plasma enhancement chemical vapor deposition or atomic layer deposition, deposing waterproof and oxygen-proof transparent thin film layers onthe bottom and the inner side wall of the LED support; mixing quantum dots and transparent sealing glue into quantum dot sealing glue colloid and coating the interior of the LED support with the quantum dot sealing colloid; after carrying out heating solidification, gluing ultraviolet curing glue on the solidified quantum dot fluorescent colloid and covering the solidified quantum dot fluorescentcolloid with a glass sheet; and then carrying out ultraviolet curing, thereby finishing the secondary airtightness sealing of the quantum dot On-chip white light LED. According to the invention, waterand oxygen in the air can be further isolated; a problem of poor sealing airtightenss of the current LED device is effectively solved; and high light emitting efficiency and high stability of the quantum dot On-chip white light LED are achieved.

Description

technical field [0001] The invention relates to the technical field of encapsulation of quantum dot white light LEDs, in particular to a secondary airtight encapsulation method of quantum dot On-chip white light LEDs. Background technique [0002] As a solid-state semiconductor light source, white LED has the advantages of high luminous efficiency, small size, energy saving and environmental protection. In recent years, its application field and market share have been continuously expanding. At present, commercial white LED devices usually use blue LED chips to excite yellow phosphor YAG:Ce to produce white light. However, because white LED devices lack the red light spectral region, the color rendering index is generally around 70, which cannot meet the requirements of indoor lighting ( The color rendering index is generally required to be no less than 80), and at the same time, as an LCD backlight, the color gamut performance is relatively low. [0003] Quantum dots are q...

Claims

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Application Information

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IPC IPC(8): H01L33/52H01L33/50
CPCH01L33/52H01L33/502
Inventor 章勇蓝栩砚杨欣凌志聪宿世臣
Owner SOUTH CHINA NORMAL UNIVERSITY
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