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Dicing tape integrated adhesive sheet

A dicing sheet, integrated technology, applied in the direction of adhesive, adhesive type, electric solid device, etc., can solve the problem of inability to pick up properly, and achieve the effect of good flexibility, cost reduction, and firm fixation

Active Publication Date: 2018-04-10
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

On the other hand, when the dicing sheet is attached firmly so that the semiconductor chip does not warp, there is a problem that it may not be picked up properly this time.

Method used

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  • Dicing tape integrated adhesive sheet
  • Dicing tape integrated adhesive sheet
  • Dicing tape integrated adhesive sheet

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0194]

[0195] Heat-expandable microspheres A (Matsumoto Microsphere F-50D: manufactured by Matsumoto Yushi Pharmaceutical Co., Ltd.: average particle diameter: 13.4 μm) were prepared.

[0196] On the other hand, prepare 2-ethylhexyl acrylate-ethyl acrylate-methyl methacrylate (in terms of monomer ratio, 2-ethylhexyl acrylate: 30 parts by weight, ethyl acrylate: 70 parts by weight , methyl methacrylate: 5 parts by weight) in 100 parts by weight of copolymer-based adhesive (2 parts by weight of compounding polyurethane cross-linking agent), be compounded with the toluene solution of 30 parts by weight of the aforementioned heat-expandable microspheres A, to dry The resulting thickness was applied to a surface obtained by peeling one side of a PET film having a thickness of 50 μm so as to be 45 μm, followed by drying to obtain an adhesive layer A. The obtained pressure-sensitive adhesive layer was stuck to an 80-micrometer polyolefin film, and the dicing sheet A was obtained....

Embodiment 2

[0203]

[0204] Heat-expandable microspheres B (Matsumoto Microsphere FN-100SS: manufactured by Matsumoto Yuyu Pharmaceutical Co., Ltd.: average particle diameter: 8.5 μm) were prepared.

[0205] On the other hand, prepare 2-ethylhexyl acrylate-ethyl acrylate-methyl methacrylate (in terms of monomer ratio, 2-ethylhexyl acrylate: 30 parts by weight, ethyl acrylate: 70 parts by weight , methyl methacrylate: 5 parts by weight) 100 parts by weight of copolymer-based adhesive (2 parts by weight of compounding polyurethane cross-linking agent) is compounded with the toluene solution of 30 parts by weight of the aforementioned heat-expandable microspheres B, to dry The resulting thickness was applied to one side of a PET film having a thickness of 50 μm, which was subjected to a release treatment, and dried to obtain an adhesive layer B. The obtained pressure-sensitive adhesive layer was stuck to an 80-micrometer polyolefin film, and the dicing sheet B was obtained.

[0206]

[...

Embodiment 3

[0209]

[0210] For 100 parts of acrylic resin (trade name "SG-P3", manufactured by Nagase ChemteX Corporation, weight average molecular weight 850000), 12 parts of phenolic resin (trade name "MEH-7851-4H", manufactured by Meiwa Chemical Industry Co., Ltd.), filler (Brand name "SE-2050MC" manufactured by Admatechs Co. Ltd., average particle diameter: 0.5 μm): 170 parts were dissolved in methyl ethyl ketone to prepare an adhesive composition solution B having a solid content concentration of 18% by weight.

[0211] After applying the adhesive composition solution B to a release-treated film (release liner) formed of a polyethylene terephthalate film with a thickness of 50 μm that has been subjected to a silicone release treatment, the The drying was carried out at ℃ for 2 minutes. Thus, a die-bonding film B having a thickness (average thickness) of 10 μm was obtained.

[0212]

[0213] The PET film was peeled off from the dicing sheet A, and the die-bonding film B was attach...

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PUM

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Abstract

A dicing sheet integrated adhesive film capable of firmly fixing a semiconductor wafer at the time of stealth dicing and capable of easily peeling the semiconductor chip at the time of picking up is provided. A dicing sheet integrated adhesive film, comprises: a dicing sheet having a substrate and an adhesive layer, and an adhesive layer disposed on the adhesive layer, the adhesive layer comprisesthe acrylic polymer A and the foaming agent, the adhesive layer contains a thermoplastic resin, and the content of the thermoplastic resin is in the range of 40% by weight to 95% by weight with respect to the entire resin component of the adhesive layer. The acrylic polymer A is obtained from a monomer composition containing an acrylate represented by CH2=CHCOOR1 (wherein R1 is an alkyl group having a carbon number of 6 to 10) in a range of 50% by weight or less.

Description

technical field [0001] The present invention relates to a dicing tape-integrated adhesive sheet. Background technique [0002] Conventionally, dicing die-bonding films are sometimes used in the manufacture of semiconductor devices. Dicing Die-bonding Film The die-bonding film is provided on the dicing sheet in a peelable manner. In the manufacture of a semiconductor device, a semiconductor wafer is held on a die-bonding film for dicing the die-bonding film, and the semiconductor wafer is diced to form individual chips. Then, the chip is peeled from the dicing sheet together with the die-bonding film, and is fixed to an adherend such as a lead frame through the die-bonding film. [0003] When using a dicing die-bonding film in which a die-bonding film is laminated on a dicing sheet and dicing a semiconductor wafer while being held by the die-bonding film, it is necessary to simultaneously cut the die-bonding film and the semiconductor wafer. [0004] However, in recent yea...

Claims

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Application Information

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IPC IPC(8): C09J7/30C09J7/50H01L21/78H01L21/683
CPCH01L21/6836H01L21/78C09J2423/006C09J2203/326C09J2433/00C09J2433/003C09J2463/00H01L2224/73265H01L2224/83191C09J7/20C09J133/06C09J2301/312C09J2301/412
Inventor 福井章洋大西谦司宍户雄一郎木村雄大高本尚英
Owner NITTO DENKO CORP
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