Conductive fabric and preparation method thereof

A technology of conductive fabrics and fabric substrates, applied in textiles and papermaking, etc., can solve the problems of poor fabric folding resistance, washing resistance and stretch resistance, and achieve the effects of protecting structural stability, enhancing washing resistance, and avoiding electrical conductivity

Active Publication Date: 2018-04-20
BEIJING DREAM INK TECH CO LTD
View PDF7 Cites 32 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] The present invention provides a conductive fabric and a preparation method thereof which overcome the above problems or at least partly solve the above problems, so as to solve the technical problems of poor fabric folding resistance, washing resistance and stretch resistance

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Conductive fabric and preparation method thereof
  • Conductive fabric and preparation method thereof
  • Conductive fabric and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0091] see figure 1 As shown, a conductive fabric includes: an adhesion improving layer 2, a liquid metal layer 3, an oxygen barrier protective layer 4 and an encapsulation protective layer 5 attached to the surface of the fabric base 1 in sequence from the inside to the outside;

[0092] The material of the fabric base 1 is polyester; the thickness of the fabric base 1 is 300 μm;

[0093] The material of the adhesion improving layer 2 is polyacrylic acid; the thickness of the adhesion improving layer 2 is 100 microns;

[0094] The liquid metal layer 3 has only one layer, the liquid metal in which is gallium-indium alloy, and the thickness of the liquid metal layer 3 is 49 μm;

[0095] The material of the oxygen barrier protective layer 4 is polyvinyl dichloride; the thickness of the oxygen barrier protective layer 4 is 50 μm;

[0096] The material of the encapsulation protection layer 5 is soft polyurethane; the thickness of the encapsulation protection layer 5 is 180 μm. ...

Embodiment 2

[0107] A conductive fabric, comprising: an adhesion improving layer 2, a liquid metal layer 3, an oxygen barrier protection layer 4 and an encapsulation protection layer 5, which are sequentially attached to the surface of a fabric base 1 from inside to outside;

[0108] The material of the fabric base 1 is cotton; the thickness of the fabric base 1 is 1500 μm;

[0109] The material of the adhesion improving layer 2 is polyurethane; the thickness of the adhesion improving layer 2 is 90 μm;

[0110] The liquid metal layer 3 comprises two liquid metal monolayers and an isolation layer 6 between the two liquid metal monolayers; the liquid metal in the first liquid metal monolayer is bismuth indium tin alloy, and the thickness of the first liquid metal monolayer 48 μm; the second liquid metal single layer is a functional circuit formed by gallium indium alloy, temperature measuring chip, 0 ohm resistor and LED lamp; the thickness of the second liquid metal single layer is 30 μm; ...

Embodiment 3

[0124] A conductive fabric, comprising: an adhesion improving layer 2, a liquid metal layer 3, an oxygen barrier protection layer 4 and an encapsulation protection layer 5 attached to the surface of a fabric base 1 sequentially from inside to outside;

[0125] The material of the fabric base 1 is Lycra; the thickness of the fabric base 1 is 800 μm;

[0126] The material of the adhesion improving layer 2 is epoxy resin; the thickness of the adhesion improving layer 2 is 90 μm;

[0127] The liquid metal layer 3 has only one layer, and the liquid metal therein is a bismuth-indium alloy, and the thickness of the liquid metal layer 3 is 51 μm;

[0128] The material of the oxygen barrier protection layer 4 is polyvinyl alcohol; the thickness is 50 μm.

[0129] The material of the encapsulation protection layer 5 is polydimethylsilane; the thickness of the encapsulation protection layer 5 is 180 μm.

[0130] Above-mentioned conductive fabric adopts following method to prepare:

[...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
melting pointaaaaaaaaaa
melting pointaaaaaaaaaa
melting pointaaaaaaaaaa
Login to view more

Abstract

The invention provides a conductive fabric and a preparation method thereof. The conductive fabric comprises, from inside to outside, an adhesive force improving layer attached to the surface layer ofa fabric substrate, a liquid metal layer, an oxygen isolation protective layer and a packaging protective layer. The preparation method comprises: applying the adhesive force improving layer to the surface layer of a fabric substrate, coating the adhesive force improving layer with the liquid metal layer, coating the liquid metal layer with the oxygen isolation protective layer, and coating the oxygen isolation protective layer with the packaging protective layer. The coating manner includes spraying, brush coating, flow coating or printing. Compared with a conductive fabric in the prior art,the conductive fabric is excellent in conductivity, fold resistance, laundering durability and tensile property. The preparation method is simple and reliable.

Description

technical field [0001] The present invention relates to conductive materials, more specifically, to a conductive fabric and a preparation method thereof. Background technique [0002] Conductive fabric refers to the textile material with conductive function. This kind of material generally has the good flexibility, light weight, easy processing characteristics of textiles and the special functionality of conductive film materials. It can be widely used in functional clothing textiles, decorative textiles, medical textiles and industrial textiles. [0003] At present, the preparation method of conductive fabric mainly includes the following schemes: [0004] 1. Use the magnetron sputtering method to grow silver, copper and other metal layers or conductive carbon layers on the fabric to prepare conductive fabrics; [0005] 2. Use electroless plating or electroplating to deposit a conductive layer on the fabric to prepare a conductive fabric; [0006] 3. Blend conductive fib...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): D06N3/00D06N3/04D06N3/06D06N3/14D06N3/18
CPCD06N3/00D06N3/045D06N3/06D06N3/14D06N3/142D06N3/18D06N3/183D06N2201/0236D06N2205/06D06N2209/041
Inventor 董仕晋于洋刘静白安洋马少宇汪海波王召
Owner BEIJING DREAM INK TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products