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A kind of transparent conductive film, conductive structure and preparation method thereof

A technology of transparent conductive film and conductive structure, applied in the direction of cable/conductor manufacturing, conductive layer on insulating carrier, circuit, etc., can solve problems such as poor adaptability, conductivity and light transmittance of transparent conductive film need to be improved, and achieve Reduce thickness, smooth surface, good conductivity

Active Publication Date: 2020-11-20
深圳市善柔科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the conductivity and light transmittance of the transparent conductive film prepared in this way still need to be improved.
In addition, the transparent conductive films prepared in the above two ways can only be used for specific needs, and the adaptability is poor, and the transparent substrate itself (transparent resin substrate or glass substrate) usually has a thickness of 50-100 microns, which is very difficult for current electronic devices. The demand for thinner and lighter equipment has great limitations

Method used

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  • A kind of transparent conductive film, conductive structure and preparation method thereof
  • A kind of transparent conductive film, conductive structure and preparation method thereof
  • A kind of transparent conductive film, conductive structure and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0048] The conductive material used in this experiment is silver nanowires with a diameter of 25-30 nm and a length of 20-30 μm. The release film is polymethyl methacrylate coated with silicone (purchased from DuPont Teijin Melinix, thickness 100 μm). The formula of the polymer resin mixture in the middle layer is: 10 parts of polyvinyl alcohol, 0.5 parts of trishydroxymethylaminomethane, 78.5 parts of pure water, 10 parts of N-methylpyrrolidone, and 1 part of BYK-163 dispersant.

[0049] (1) The nano-silver wire dispersion is evenly coated on the surface of the release film by spraying to construct a conductive layer.

[0050] (2) Fully mix the components in the resin mixture, and use a wire bar to coat the conductive layer to form a resin layer with a thickness of 5 microns.

[0051] (3) Bake at 100°C for 25 minutes to fully dry the resin layer on the surface.

[0052] (4) Cover one layer of PE protective film to prepare transparent conductive film sample 1.

[0053] The e...

Embodiment 2

[0061] The conductive material used in this experimental example is nano-copper wire with a diameter of 90-100 nm and a length of 10-20 μm. The release film is polycarbonate coated with silicone (purchased from DuPont Teijin Melinix, thickness 90 μm). The formula of the polymer resin mixture in the middle layer is: 5 parts of polyvinyl butyral, 0.25 parts of dimethylol dihydroxy ethylene urea, 73.75 parts of ethanol, 20 parts of diphenyl ether, and 1 part of BYK-354 dispersant.

[0062] (1) The dispersion liquid of nano copper wire is evenly coated on the surface of the release film by scraping to construct a conductive layer.

[0063] (2) Fully mix the components in the resin mixture, and use a wire bar to coat the conductive layer to form a resin layer with a thickness of 2 microns.

[0064] (3) Bake at 80°C for 25 minutes to fully dry the resin layer on the surface.

[0065] (4) Cover one layer of PE protective film to prepare transparent conductive film sample 2.

[0066...

experiment example 3

[0074] The conductive material used in this experimental example is nano-copper wire with a diameter of 10-20 nm and a length of 20-30 μm. The release film is polyamide with a thickness of 100 μm. The formula of the polymer resin mixture in the middle layer is: 15 parts of polyacrylic acid, 0.3 part of dimethylol propionic acid, 73.7 parts of ether, 10 parts of diphenyl ether, and 1 part of LK-233 additive.

[0075] (1) The nano-copper wire dispersion liquid is evenly coated on the surface of the release film by spraying to construct a conductive layer.

[0076] (2) Fully mix the components in the resin mixture, and use a wire bar to coat the conductive layer to form a resin layer with a thickness of 3 microns.

[0077] (3) Bake at 50°C for 25 minutes to fully dry the resin layer on the surface.

[0078] (4) Cover one layer of PE protective film to prepare transparent conductive film sample 3.

[0079] The optical microscope photograph of transparent conductive film sample 3...

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Abstract

The invention discloses a transparent electricity-conducting film, an electricity-conducting structure and a preparation method of the transparent electricity-conducting film. The preparation method includes S1, spreading organosilicone or fluorine-containing release agents onto a first release film; S2, preparing electricity-conducting material dispersing liquid from an electricity-conducting material, evenly spreading the electricity-conducting material dispersing liquid onto the first release film subjected to treatment of the step1, and creating an electricity-conducting layer on the firstrelease film; S3, preparing a resin mixture, wherein the resin mixture comprises resin with a hydroxyl, carboxyl, epoxy or amino structure, a cross-linking agent with a hydroxymethyl structure, a main solvent, a high-boiling-point solvent and an assistant; S4, spreading the resin mixture onto the electricity-conducting layer evenly to obtain a resin layer, and subjecting the resin layer to heat treatment at the temperature of 40-100 DEG C for 1-120 minutes; S5, covering the resin layer, subjected to treatment of the step 4, with a second release film. The obtained transparent electricity-conducting film has high light transmission, high electrical conductivity and wide application range.

Description

【Technical field】 [0001] The invention relates to a preparation process of a transparent conductive film, in particular to a transparent conductive film which can be bonded to different substrates and a preparation method thereof. 【Background technique】 [0002] With the rapid growth of people's demand for thinner, lighter and lower-cost optoelectronic devices and related electronic display equipment, especially in the photovoltaic industry and touch display applications, such as mobile phones, notebook computers, All-In-One computers, etc., The market for transparent conductive film materials is expanding rapidly. Transparent conductive films (TCFs) refer to thin film materials with high light transmittance in the visible light range (λ=380-780nm) and excellent electrical conductivity (square resistance is generally lower than 1000Ω / sq). For a long time, ITO has been the most widely used transparent conductive film material in the optoelectronic industry. However, ITO has...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01B5/14H01B13/00G06F3/041
CPCG06F3/0412H01B5/14H01B13/00
Inventor 杨诚李子衡吴铛
Owner 深圳市善柔科技有限公司