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Neodymium compound containing soft grinding material fixing grinding tool for polishing sapphire wafer and manufacturing method of neodymium compound containing soft grinding material fixing grinding tool

A sapphire wafer and neodymium technology, which is applied in the direction of grinding tools, grinding/polishing equipment, grinding devices, etc., can solve the problems of high cost and low polishing efficiency, and achieve improved processing quality, low processing roughness, and removal rate high effect

Active Publication Date: 2018-06-01
ZHEJIANG UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to overcome the disadvantages of low polishing efficiency and high cost of existing sapphire wafers. The present invention provides a soft abrasive containing neodymium compound for polishing sapphire wafers with good surface quality, high processing efficiency and low production cost. Abrasives and their manufacturing methods

Method used

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  • Neodymium compound containing soft grinding material fixing grinding tool for polishing sapphire wafer and manufacturing method of neodymium compound containing soft grinding material fixing grinding tool

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Embodiment Construction

[0023] The present invention will be further described below in conjunction with the accompanying drawings.

[0024] refer to Figure 1 ~ Figure 3 , a fixed abrasive tool containing neodymide soft abrasives for polishing sapphire wafers, the preparation of the raw materials for the fixed abrasive tools containing neodymide soft abrasives: according to the mass percentage, 40% to 60% of nano silicon dioxide, bonded 20% to 40% of the curing agent, 10% to 15% of the curing agent, 5% to 10% of the neodymium compound, and the rest is deionized water.

[0025] Preferably, the binder is magnesium oxide.

[0026] Preferably, the curing agent is magnesium chloride, phenolic-acetal resin or phenolic-epoxy resin.

[0027] Preferably, the particle size of the nano silicon dioxide is 80-100nm.

[0028] Preferably, the neodymium compound is neodymium nitrate, neodymium chloride, neodymium oxide or neodymium fluoride, all of which are nanoscale powder particles.

[0029] A method for man...

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Abstract

The invention relates to a neodymium compound containing soft grinding material fixing grinding tool for polishing a sapphire wafer. Preparation raw materials of the neodymium compound containing softgrinding material fixing grinding tool comprise, by mass percent, 40%-60% of nanosilicon dioxide, 20%-40% of a binder, 10%-15% of a curing agent, 5%-10% of a neodymium compound and the balance deionized water. The invention provides a manufacturing method of the neodymium compound containing soft grinding material fixing grinding tool for polishing the sapphire wafer. The curing agent is added into the deionized water and is stirred to be dissolved, and then the binder, nanosilicon dioxide, the neodymium compound and the like are added and stirred uniformly; and the prepared materials are subjected to hot press forming in a mold, after demolding, thermocuring is completed, the upper end face and the lower end face are subjected to finishing, the flatness and parallelism of the upper end face and the lower end face of the grinding tool are guaranteed, and the neodymium compound containing soft grinding material fixing grinding tool is obtained. The removal rate of the sapphire wafer can be improved, roughness can be reduced, the processing efficiency can be improved, and the production cost can be reduced.

Description

technical field [0001] The invention relates to a mould, in particular to a fixed abrasive tool containing neodymium compound soft abrasive for polishing a sapphire wafer and a manufacturing method thereof. Background technique [0002] Sapphire, also known as white sapphire, has the same optical and mechanical properties as natural gemstones, has good thermal properties, excellent electrical and dielectric properties, and is resistant to chemical corrosion. It has a high transmittance to infrared rays and has great Good wear resistance, hardness second only to diamond, Mohs grade 9, still has good stability at high temperature, melting point is 2030 degrees Celsius, is widely used in industry, national defense, scientific research and other fields, more and more It is used as a manufacturing material for parts in high-tech fields such as solid-state lasers, infrared windows, substrates for semiconductor chips, and precision wear-resistant bearings, such as infrared windows ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B37/24B24D18/00
CPCB24B37/245B24D18/0009
Inventor 吕冰海张韬杰杭伟邓乾发曹霖霖陈芝向黄晟
Owner ZHEJIANG UNIV OF TECH
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