Hole transmission material used for polymer solar cell
A hole transport material and technology for solar cells, applied in the field of solar cells, can solve problems such as difficulty in meeting commercialization needs, easy corrosion of conductive glass, complex preparation process, etc. simple effect
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Embodiment 1
[0022] The preparation process of the polymer solar cell containing the hole transport layer involved in the present invention is as follows (all operations are completed under nitrogen protection):
[0023] (1) Substrate pretreatment: Divide the ITO conductive glass to a size of 15mm*15mm, use detergent, deionized water, acetone, and ethanol to sonicate three times, each time for 30 minutes, then use deionized water to sonicate the substrate for 30 minutes, and rinse completely ;Finally blow dry completely with nitrogen for use;
[0024] (2) Preparation of the hole transport layer: 55 parts by weight of polyvinyl carbazole, 22 parts by weight of tricresyl phosphate and 20 parts by weight of isoviolanthrone were mixed uniformly in 300 parts by weight of toluene solution to obtain the hole-filling layer. Organic components, adding a filler component composed of 45 parts by weight of polynitrogen sulfide, 30 parts by weight of coking polyacrylonitrile fibers and 22 parts by weig...
Embodiment 2
[0027] The preparation of the hole transport layer in step (2) of Example 1 is adjusted as follows: 50 parts by weight of polyvinylcarbazole, 20 parts by weight of tricresyl phosphate and 18 parts by weight of isoviolanthrone are mixed in 300 parts by weight of toluene solution Uniform, to obtain the organic component of the hole-filling layer, to which is added a particle size smaller than The 5nm filler component was mixed evenly by ultrasonic to obtain the stock solution of the hole transport layer, and then the stock solution of the hole transport layer was spin-coated on the ITO glass substrate with a thickness of about 70nm, and then dried at 120°C for use.
[0028] That is, only the content of the components in the hole transport layer was adjusted, and the rest of the preparation process was the same as in Example 1.
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Abstract
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