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Liquid metal insulation and heat-conduction material and preparation method thereof

A liquid metal, insulating and thermally conductive technology, applied in heat exchange materials, chemical instruments and methods, coatings, etc., can solve the problems of unstable product properties, restricting the development and application of liquid metal type thermal interface materials, etc., to solve leakage current. Risks, satisfying high performance, and the effect of good application prospects

Active Publication Date: 2018-06-08
YUNAN JINGCHUANG LIQUID METAL THERMAL CONTROL TECH RES & DEV CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This liquid metal-based insulating thermal interface material has the advantages of low melting point, high thermal conductivity, and good fluidity, but the product is unstable. After a period of storage, the insulating matrix material and the coated micro-droplet liquid metal Peeling occurs, and when the coating thickness is thin during use, liquid metal is easy to precipitate
These problems directly restrict the further development and application of liquid metal thermal interface materials.

Method used

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  • Liquid metal insulation and heat-conduction material and preparation method thereof
  • Liquid metal insulation and heat-conduction material and preparation method thereof
  • Liquid metal insulation and heat-conduction material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] This embodiment provides a liquid metal insulating and heat-conducting material, including liquid metal Ga 71 In 15 sn 13 Zn 1 , aluminum nitride and dimethyl silicone oil with a viscosity of 1000CS, the liquid metal Ga 71 In 15 sn 13 Zn 1 and aluminum nitride are uniformly dispersed in dimethyl silicone oil after being modified by a surface modification solution prepared by dissolving Span85 in absolute ethanol.

[0041] This embodiment also provides a preparation method for the above-mentioned liquid metal insulating and heat-conducting material, including the following steps:

[0042] (1) Weigh 71% gallium, 15% indium, 13% tin and 1% zinc by mass percentage, first put metal gallium into a beaker, heat it at 100°C, and add tin to the beaker after the gallium is completely melted and indium, after the tin and indium are melted, add zinc into the beaker, after the zinc is melted, put a magnetic stirrer, set the speed at 200r / min, stir in the air for 10min, separa...

Embodiment 2

[0053] The rest are the same as in Example 1, except for the content of liquid metal. In this embodiment, 35g of liquid metal is used to participate in the preparation.

[0054] Using SEM to observe the final product, its microscopic appearance is as follows Figure 4 and Figure 5 As shown, aluminum nitride and liquid metal present a "ball-ball" state.

[0055] Utilize the HPS68004 megger to measure the volume resistivity of the final product, the result is 4.9×10 10 Ω·m.

[0056] The thermal conductivity of the final product was measured with a HotDisk thermal constant analyzer, and the result was 4.652 W / (m·K).

[0057] The liquid metal insulating and heat-conducting material was stored at room temperature for 15 days, and there was no leakage of silicone oil and no precipitation of liquid metal.

[0058] The liquid metal insulating and heat-conducting material was applied to the surface of the electronic components of the aluminum-based material and the copper-based ma...

Embodiment 3

[0060] The rest are the same as in Example 2, except for the content of simethicone. In this example, 6g of simethicone is used to participate in the preparation.

[0061] Using SEM to observe the final product, its microscopic appearance is as follows Image 6 and Figure 7 As shown, aluminum nitride and liquid metal present a "ball-ball" state.

[0062] Utilize the HPS68004 megger to measure the volume resistivity of the final product, the result is 5.3×10 10 Ω·m.

[0063] The thermal conductivity of the final product was measured with a HotDisk thermal constant analyzer, and the result was 3.403 W / (m·K).

[0064] The liquid metal insulating and heat-conducting material was stored at room temperature for 15 days, and there was no leakage of silicone oil and no precipitation of liquid metal.

[0065] The liquid metal insulating and heat-conducting material is respectively applied to the surface of the electronic components of the aluminum-based material and the copper-bas...

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Abstract

The invention relates to a liquid metal insulation and heat-conduction material. The liquid metal insulation and heat-conduction material comprises a liquid metal and an insulation matrix material, the liquid metal is modified with a surface modification solution, and is uniformly dispersed in the insulation matrix material in a nano-level liquid droplet form, the liquid metal is metal or alloy having a melting point being 7-200 DEG C, and the surface modification solution is prepared through adding a surfactant into anhydrous ethanol. The liquid metal insulation and heat-conduction material prepared in the invention can guarantee a good insulation property, makes the volume resistivity equal to or more than 10<10> omega.m, has a high heat conduction property, allows the heat conductivityto reach 3.4 W / m.K or more, overcomes the defect of poor stability in the prior art, well meets the requirements of electronic devices for high performances and good heat dissipation property, has anexcellent application prospect, and promotes the further development and application of liquid metal thermal interface materials.

Description

technical field [0001] The invention relates to the technical field of thermal interface materials, and more specifically, to a liquid metal insulating and heat-conducting material and a preparation method thereof. Background technique [0002] With the increasing function and efficiency of microprocessors, the miniaturization and high efficiency of electronic products, the integration level and assembly density of electronic components continue to increase, which not only provides powerful functions, but also leads to its power consumption. and a sharp increase in heat generation. In the application of electronic components, if the problem of heat conduction of electronic components is not solved properly, it will directly affect the service life of the equipment, reduce the processing speed of signals, and increase the power dissipation of the equipment. At present, people have higher and higher requirements for heat dissipation of electronic components, and the overheati...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/04C08K13/06C08K9/04C08K9/10C08K3/08C08K3/28C09D183/04C09D7/62C09K5/14
CPCC08K3/08C08K3/28C08K9/04C08K9/10C08K13/06C08K2003/0893C08K2003/282C08K2201/003C08K2201/011C08K2201/014C09D183/04C09K5/14C08L83/04
Inventor 任文兵张海洋鄢顺才何霄盛磊刘静
Owner YUNAN JINGCHUANG LIQUID METAL THERMAL CONTROL TECH RES & DEV CO LTD
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