Microgroove group radiator

Abstract

The present invention provides a microgroove group radiator. The microgroove group radiator comprises a heat removing surface and a heat radiation surface of a micro-nano composite structure surface heat sink, wherein the micro-nano composite structure surface heat sink is provided with a hydrophilic nanometer coating; the heat removing surface and the heat radiation surface encircle an enclosed cavity which is internally provided with liquid working medium, and in the cavity, a high-voltage electric field is applied to the micro-nano composite structure surface heat sink to form an EHD effect. The ultrahigh surface energy of the hydrophilic nanometer coating on the micro-nano composite structure surface of the microgroove group radiator intensifies the surface energy and roughness of theliquid working medium in microgroove channels and improves the surface wetting features, an orientation traction effect is applied to the liquid working medium by employing the electric field effect to increase the quality flow of the liquid working medium, allow the heat sink to generate continuous high-intensity composite phase-change heat transfer and intensify the heat transfer capability of the radiator.

Description

technical field [0001] The disclosure belongs to the field of enhanced heat exchange and electronic cooling, and in particular relates to a micro-groove group radiator. Background technique [0002] With the rapid development of microelectronics and microelectromechanical systems, the integration and performance of chips have been continuously improved, making electronic equipment tend to be more powerful and miniaturized. As a result, the heat generated by the device is also greatly increased. If the heat cannot be discharged in time, the stability and reliability of the device and system will be seriously reduced, and even the system will collapse. Therefore, heat dissipation is a key bottleneck in the design and manufacture of high-power and high-power-density power electronic devices. When the heat flux exceeds 150W / cm2, it has exceeded the critical heat flux of pool boiling phase transformation heat on the surface of conventional size, which can be defined as ultra-hig...

AI Technical Summary

Problems solved by technology

When the power received by the device is getting higher and higher, and the heat flux density is getting higher and higher, the liquid working medium in the microgroove is very easy to dry up prematurely, which leads to the deterioration of heat transfer.

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