Unlock instant, AI-driven research and patent intelligence for your innovation.

A modified epoxy acrylate, solder resist containing the modified epoxy acrylate

A technology of epoxy acrylate and solder resist, which is applied in the direction of modified epoxy resin adhesive, epoxy resin coating, photoplate making process of pattern surface, etc., can solve the problem of reducing the use range, hardness and heat resistance, etc. performance degradation, etc.

Active Publication Date: 2020-01-21
JIANGNAN UNIV
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The currently used chemical modification method mainly introduces some flexible chain structures into the main chain structure of carboxylated epoxy acrylate, but the hardness and heat resistance of the system are reduced to varying degrees, thereby reducing its scope of use

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A modified epoxy acrylate, solder resist containing the modified epoxy acrylate
  • A modified epoxy acrylate, solder resist containing the modified epoxy acrylate
  • A modified epoxy acrylate, solder resist containing the modified epoxy acrylate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0070] Embodiment 1: the synthesis of modified epoxy acrylate

[0071] (1) Synthesis of epoxy acrylate (EA)

[0072] 1036.48g of o-cresol epoxy resin, 4.9g of triphenylphosphine (TPP) and 0.8g of p-hydroxyanisole were added into a 500ml three-necked flask, and the temperature was raised to 95°C. Add 90g of acrylic acid, naturally exotherm, after the end of exotherm, the temperature is raised to 108°C, and the temperature is kept for 2 hours. Add a certain amount of acrylic acid and a polymerization inhibitor, raise the temperature to 115°C, and keep the temperature for 3 hours. Add a certain amount of acrylic acid, keep the temperature at 115°C, and react until the acid value at the end is <1;

[0073] (2) Synthesis of carboxylated epoxy acrylate (anhydride-modified epoxy acrylate) (EAT)

[0074] Add 199 g of high boiling point solvent mixed dibasic acid ester (DBE), and lower the temperature to 95°C. Add 1.04g of polymerization inhibitor p-hydroxyanisole and 315.68g of te...

Embodiment 2

[0084] Embodiment 2: the synthesis of modified epoxy acrylate

[0085] (1) Synthesis of epoxy acrylate

[0086] 1036.48g of o-cresol epoxy resin, 4.9g of triphenylphosphine (TPP) and 0.8g of p-hydroxyanisole were added into a 500ml three-necked flask, and the temperature was raised to 95°C. Add 90g of acrylic acid, naturally exotherm, after the end of exotherm, the temperature is raised to 108°C, and the temperature is kept for 2 hours. Add a certain amount of acrylic acid and a polymerization inhibitor, raise the temperature to 115°C, and keep the temperature for 3 hours. Add a certain amount of acrylic acid, keep the temperature at 115°C, and react until the acid value at the end is <1;

[0087] (2) Synthesis of carboxylated epoxy acrylate (anhydride-modified epoxy acrylate)

[0088] Add 199 g of high boiling point solvent mixed dibasic acid ester (DBE), and lower the temperature to 95°C. Add 1.04g of polymerization inhibitor p-hydroxyanisole and 365.18g of tetrahydropht...

Embodiment 3

[0092] Embodiment 3: the synthesis of modified epoxy acrylate

[0093] (1) Synthesis of epoxy acrylate

[0094] 1036.48g of o-cresol epoxy resin, 4.9g of triphenylphosphine (TPP) and 0.8g of p-hydroxyanisole were added into a 500ml three-necked flask, and the temperature was raised to 95°C. Add 90g of acrylic acid, naturally exotherm, after the end of exotherm, the temperature is raised to 108°C, and the temperature is kept for 2 hours. Add a certain amount of acrylic acid and a polymerization inhibitor, raise the temperature to 115°C, and keep the temperature for 3 hours. Add a certain amount of acrylic acid, keep the temperature at 115°C, and react until the acid value at the end is <1;

[0095] (2) Synthesis of carboxylated epoxy acrylate (anhydride-modified epoxy acrylate)

[0096] Add 199 g of high boiling point solvent mixed dibasic acid ester (DBE), and lower the temperature to 95°C. Add 1.04g of polymerization inhibitor p-hydroxyanisole and 365.18g of tetrahydropht...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
acid valueaaaaaaaaaa
Login to View More

Abstract

The present invention discloses modified epoxy acrylates and the solder resist containing the epoxy modified acrylates, belonging to the synthetic resin field. In this invention, modified epoxy acrylates are prepared by introducing long fatty hydrocarbon chain as the branched chain into the carboxylated epoxy acrylates. The as-prepared solder resist containing this modified epoxy acrylates maintains the excellent property of photosensitive solder resist such as good adhesion, hardness, solvent resistance and weather resistance which facilities sensitivity and alkaline development during exposure simultaneously. This has led to good water resistance, electrical insulation of the cured products. Furthermore, the cured product also shows good flexibility which improves its application in photosensitive imaging ink materials.

Description

technical field [0001] The invention relates to a modified epoxy acrylate and a solder resist containing the modified epoxy acrylate, belonging to the technical field of synthetic resins. Background technique [0002] At present, the solder resist used in printed circuit boards has the characteristics of high precision and high density. After the liquid developing type solder resist is irradiated with ultraviolet rays, an image can be formed through development, and finally cured by heat or light irradiation. However, in consideration of environmental issues, an alkali-developable liquid solder resist using a dilute alkaline aqueous solution as a developer has become the mainstream. [0003] Currently commonly used solder resist is mainly carboxylated epoxy acrylate. Carboxylated epoxy acrylate is an important component of photosensitive imaging ink. Due to the phenolic structure in its molecular structure, it exhibits excellent thermal stability, mechanical properties, di...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): C08G59/42C08G59/16C08G59/17C08G59/62C09D163/10G03F7/004C09J163/10C08L63/10
CPCC08G59/145C08G59/1466C08G59/4215C08G59/62C08L63/10C09D163/10C09J163/10G03F7/004G03F7/0388G03F7/031
Inventor 刘仁许阳阳李治全张丽萍
Owner JIANGNAN UNIV