Method for preparing polycrystalline black silicon suede in single-sided by a metal catalytic chemical etching method
A technology of metal catalysis and corrosion method, applied in chemical instruments and methods, single crystal growth, single crystal growth, etc., can solve the problems affecting the large-scale promotion of the dry black silicon market, the expensive dry black silicon technology equipment, and the complex process. problem, to achieve the effect of being beneficial to the formation of the back field structure, improving the quantum efficiency, and low surface reflectivity
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Embodiment 1
[0039] Example 1: A method for preparing polycrystalline black silicon suede on one side by metal-catalyzed chemical corrosion method, including the following process: loading → alkali polishing → water washing → pickling → water washing → immersion silver → digging holes → water washing → desilvering → water washing → Pickling → Reaming → Water washing → Alkali washing → Water washing → Pickling → Water washing → Fragmentation → Pickling → Water washing → Drying; Specifically:
[0040] (1) Chip loading: Stack diamond wire-cut polycrystalline original silicon wafers with a resistivity of 1-3Ω•cm and a silicon wafer thickness of 200±20μm every two pieces, and insert them into the card slot of the textured carrying box, the same card slot There are two silicon wafers bonded together;
[0041] (2) Alkali polishing: Use a potassium hydroxide solution with a mass percentage concentration of 6% to remove the damaged layer on the surface of the diamond wire-cut polycrystalline origin...
Embodiment 2
[0062] Example 2: A method for preparing polycrystalline black silicon suede on one side by metal-catalyzed chemical corrosion method, including the following process flow: chip loading → alkali polishing → water washing → pickling → water washing → immersion silver digging two-in-one → water washing → stripping Silver→washing→pickling→hole expansion→washing→slicing→desilvering and alkaline washing→washing→pickling→washing→drying; specifically:
[0063] (1) Chip loading: Stack diamond wire-cut polycrystalline original silicon wafers with a resistivity of 1-3Ω•cm and a silicon wafer thickness of 200±20μm every two pieces, and insert them into the card slot of the textured carrying box, the same card slot There are two silicon wafers bonded together;
[0064] (2) Alkali polishing: use a potassium hydroxide solution with a mass percentage concentration of 4% to remove the damaged layer on the surface of the diamond wire-cut polycrystalline original silicon wafer. The reaction tem...
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