Semiconductor package structure with pin sidewall tin climbing function and its manufacturing process
A technology of packaging structure and manufacturing process, which is applied in semiconductor/solid-state device manufacturing, semiconductor devices, semiconductor/solid-state device components, etc., can solve problems such as delamination, improve soldering performance, improve soldering reliability, and increase bonding area effect
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[0059] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments.
[0060] Such as figure 2 , image 3 As shown, in this embodiment, a semiconductor package structure with the function of climbing tin on the side wall of the pins includes a base island 1 and pins 2, and the base island 1 and pins 2 are metal circuit layers formed by electroplating. The pin 2 is arranged around the base island 1, the pin 2 includes a plane portion 2.1 and a side wall portion 2.3, the side wall portion 2.3 is located outside the plane portion 2.1, and the side wall portion 2.3 includes a plurality of side wall surfaces , the planar part 2.1 and the multiple side wall surfaces of the side wall part 2.3 are transitionally connected by an arc part 2.2, the convex surface of the arc part 2.2 faces the outer lower side, and the front of the base island 1 is connected by a bonding substance or The solder 3 is provided with a chip 4...
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