Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Preparation method of substrate film of high-frequency circuit board

A high-frequency circuit board and substrate film technology, applied in the field of fluoroplastic processing, can solve the problems of dielectric loss affecting signal transmission quality, affecting dielectric constant and dielectric loss, and large thermal expansion coefficient, etc., to achieve stable dielectric constant , wide operating temperature and low dielectric loss

Inactive Publication Date: 2018-06-29
TIANJIN TIANSU SCI & TECH GROUP
View PDF5 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] 2. Small dielectric loss; dielectric loss affects signal transmission quality
[0007] 4. Low water absorption; the high water absorption substrate film will be damp, which will affect the dielectric constant and dielectric loss and other properties
However, there are disadvantages of high cost, large coefficient of thermal expansion, and poor mechanical strength

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0063] A method for preparing a high-frequency circuit board substrate film, which is prepared by turning polytetrafluoroethylene modified blanks:

[0064]Technical characteristics of substrate film: length ≥ 6000 meters, width: ≥ 1500 meters, thickness: 0.05-0.2 mm, thickness tolerance: ≤ ± 0.002 mm. Tensile strength: ≥20 MPa, tensile strain at break: ≥200%, dielectric constant: ≤2.05, loss tangent: ≤0.00025, withstand voltage strength: 3000V / min without breakdown.

[0065] Preparation process:

[0066] 1. Raw material mixing

[0067] Polytetrafluoroethylene suspension resin and glass fiber, by mass percentage polytetrafluoroethylene 9.0%, the ratio of glass fiber 10%, mix with high-speed mixer;

[0068] Before the raw materials are mixed, the polytetrafluoroethylene suspension resin and glass fiber are left to stand for more than 8 hours in the mixing environment, the temperature of the mixing environment is 18°C, and the relative humidity is 50%;

[0069] The polytetrafl...

Embodiment 2

[0091] A method for preparing a high-frequency circuit board substrate film, which is prepared by turning polytetrafluoroethylene modified blanks:

[0092] 1. Raw material preparation: place the polytetrafluoroethylene suspension resin and glass fiber in a mixing environment for more than 8 hours. Mixing ambient temperature: 19±2°C, relative humidity: 50±5%.

[0093] 2. Mixing of raw materials: Mix the PTFE suspension resin and glass fiber at a ratio of 95:5 after standing still, put it into a high-mixer, run it at low speed for 5 minutes, run it at high speed for 15 minutes, and then run it at low speed for 5 minutes ; Take out the mixed raw materials and set aside.

[0094] 3. Pre-compacted billet: evenly introduce the mixed raw materials into the material cavity of the billet making machine, and apply pressure with a briquetting block; slowly apply pressure, and exhaust more than 3 times; the pressure is controlled at 100MPa, and the time is 40 minutes ; After holding the...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Lengthaaaaaaaaaa
Widthaaaaaaaaaa
Thicknessaaaaaaaaaa
Login to View More

Abstract

The invention relates to a preparation method of a substrate film of a high-frequency circuit board and belongs to the technical field of fluoro-plastic processing. The preparation method includes steps of: 1) raw material blending: mixing polytetrafluoroethylene suspension resin and glass fibers in a material mixer; 2) pre-pressing to manufacture a green body: feeding the mixture into a cavity ofa green body producer and applying pressure by means of an upper pressing block, wherein air exhaustion is carried out for more than 3 times during pressure application; 3) sintering of green body: sintering the green body in a sintering furnace in a gradient temperature control mode; 4) back-burning of the green body: back-burning the green body before processing the substrate film; 5) lathe turning of the basic film: fixing the back-burned green body on a fixture of a turning lathe to processing the substrate film, thickness being 20-30 [mu]m and width being not less than 1500 mm; and 6) finishing of the substrate film: cutting and splitting the substrate film. The method has simple process and convenient operation. The product is ultra-long and ultrathin, has large breadth, has uniformand compact appearance and stable dielectric constant, and is extensive in available temperature range.

Description

technical field [0001] The invention belongs to the technical field of fluoroplastic processing, and in particular relates to a preparation method of a high-frequency circuit board substrate film. Background technique [0002] With the rapid development of mobile communication and Internet of Things technology, data information transmission requires large capacity, high frequency, high speed and standardization, and high frequency of electronic communication equipment has become a development trend. As the core basic component of electronic communication equipment, high-frequency circuit boards have become the key to the development of the entire communication industry. [0003] At present, the data transmission frequency ≥ 1GHz is defined as high frequency, and the base film of high frequency circuit board mainly includes epoxy resin, PPO resin and fluorine resin. The substrate film required for the preparation of high-frequency circuit boards should meet the following con...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C08L27/18C08K7/14C08J5/18
CPCC08J5/18C08J2327/18C08K7/14
Inventor 段连群戴靖
Owner TIANJIN TIANSU SCI & TECH GROUP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com