Processing method for copper bonding wire for encapsulation

A processing method, copper wire technology, applied in the direction of electrical components, circuits, electrical solid devices, etc., can solve the problems of insufficient conductivity of copper wire palladium plating, easy oxidation of copper wire, insufficient conductivity of palladium, etc., to improve the oxidation resistance , eliminate residual stress, good electrical conductivity

Active Publication Date: 2018-06-29
安徽晋源铜业有限公司
View PDF15 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, copper wires are prone to oxidation, corrosion, high hardness, and poor weldability, which have also become difficulties and challenges for copper wire bonding technology.
[0003] China's authorized patent CN102130067B improves the oxidation resistance of copper wires by plating a layer of relatively cheap palladium on copper wires, but the conductivity of palladium is insufficient
Chinese patents CN103219312A and CN103219311A respectively disclose a double-coated bonding copper wire, that is, a palladium layer is plated on the surface of the copper wire, and a gold layer or a silver layer is plated on the surface of the palladium layer, which solves the problem of easy oxidation of the copper wire and insufficient conductivity of the palladium-plated copper wire. problem, but its preparation is complicated and the cost is high

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] The present invention proposes a processing method of bonding copper wire for encapsulation, comprising the following steps:

[0022] S1. Add Cu99.09wt% and Li0.05wt% according to weight percentage, under the protection of nitrogen, melt in a melting furnace at a temperature of 1210 ° C, then add La 0.13wt%, Ce 0.1wt% for melting, and then add Ag 0.45wt% , Sr 0.15wt%, Sn 0.03wt% smelting, through directional solidification to obtain an oxygen-free copper rod;

[0023] S2, cooling the S1 oxygen-free copper rod at minus 45°C for 10 hours;

[0024] S3. Add the oxygen-free copper rod treated by S2 into the drawing machine, and after rough drawing at a speed of 350m / min, under nitrogen protection and annealing temperature of 580°C, anneal for 1.5 hours to obtain a thick copper wire;

[0025] S4. Put the S3 thick copper wire into the drawing machine, finish drawing 3 times at a speed of 140m / min, and anneal for 1 hour under nitrogen protection and annealing temperature of 50...

Embodiment 2

[0027] The present invention proposes a processing method of bonding copper wire for encapsulation, comprising the following steps:

[0028] S1. Add Cu99.24wt% and Li0.03wt% according to weight percentage, under the protection of nitrogen, melt in a melting furnace at a temperature of 1205 ° C, then add La0.12wt%, Ce0.1wt% for melting, and then add Ag0.4wt% , Sr0.1wt%, Sn0.01wt% were smelted, and oxygen-free copper rods were obtained through directional solidification;

[0029] S2, cooling the S1 oxygen-free copper rod at minus 40°C for 11 hours;

[0030] S3. Add the oxygen-free copper rod treated by S2 into the drawing machine, and after rough drawing at a speed of 300m / min, anneal treatment for 1.7 hours under nitrogen protection and annealing temperature of 550° C. to obtain a thick copper wire;

[0031] S4. Put the S3 thick copper wire into the drawing machine, finish drawing 3 times at a speed of 80m / min, and anneal for 1.2 hours under nitrogen protection and annealing t...

Embodiment 3

[0033] The present invention proposes a processing method of bonding copper wire for encapsulation, comprising the following steps:

[0034] S1. Add Cu98.91wt% and Li0.05wt% according to weight percentage, under the protection of nitrogen, melt in a melting furnace at a temperature of 1200 ° C, add La0.15wt%, Ce0.1wt% to continue smelting, and then add Ag0.56wt% , Sr0.2wt%, Sn0.03wt% continue to smelt, and make an oxygen-free copper rod through directional solidification;

[0035] S2, cooling the S1 oxygen-free copper rod at minus 35°C for 11 hours;

[0036] S3. Add the oxygen-free copper rod treated by S2 into the drawing machine, and after rough drawing at a speed of 330m / min, under nitrogen protection and annealing temperature of 540°C, anneal treatment for 1.2 hours to obtain a thick copper wire;

[0037] S4. Put the S3 copper wire into the drawing machine, finish drawing 3 times at a speed of 100m / min, and anneal for 1.2 hours under nitrogen protection and annealing temp...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a processing method for a copper bonding wire for encapsulation. The method comprises the following steps: adding Cu and Li in percentage by weight into a smelting furnace under nitrogen protection to be smelted, adding La and Ce to be smelted continuously, and then adding Ag, Sr and Sn to be smelted continuously, and directionally condensing the mixture to obtain an oxygen-free copper rod; and adding the cooled oxygen-free copper rod into a stretcher, and roughly stretching, finely stretching and annealing the cooled oxygen-free copper rod to obtain the copper bondingwire for encapsulation. From the aspect of oxidization resistance, corrosion resistance and conductive property of the copper wire, the type and content of alloy elements of the copper wire are designed reasonably, and the copper bonding wire for encapsulation which is excellent in performance is prepared by combining a proper processing technology.

Description

technical field [0001] The invention relates to the technical field of integrated circuit packaging, in particular to a method for processing bonding copper wires for packaging. Background technique [0002] In the packaging of semiconductor integrated circuits, the chip and the lead frame are connected by wire bonding technology. At present, the connecting wires used for wire bonding are mainly pure gold wires, because gold has oxidation resistance and high conductivity, and can be easily Easily bonded in place by thermocompression and ultrasonic welding techniques. However, in recent years, as the price of gold continues to rise and the price of electronic products continues to decrease, finding other more suitable metals to replace gold wires has become an urgent problem to be solved. The cost of copper wire is lower, and it has better electrical and thermal conductivity than gold wire. People gradually use copper wire instead of gold wire to reduce material costs. Howe...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H01L21/48H01L21/60C22F1/08C22C9/00C22C1/02
CPCH01L24/43H01L24/45H01L21/4889C22C1/02C22C9/00C22F1/08H01L2224/43H01L2224/45147H01L2224/43848
Inventor 潘加明
Owner 安徽晋源铜业有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap