Method for processing quartz resonator wafer

Abstract

The invention discloses a method for processing a quartz resonator wafer. The quartz wafer is processed by the following steps: I, plating a metal film, namely totally plating chromium on a wafer board by using a film plating machine, plating gold, and finally depositing the gold on the surface of the wafer board in a film form, wherein the vacuum degree of the film plating machine is 0.35-0.45Pa,the sputtering power of the gold is 0.65kW, and the sputtering power of chromium is 0.4kW; II, performing spray gluing; III, performing soft baking; IV, performing mask alignment and exposure; V, baking after exposure; VI, developing; VII, performing hard baking; VIII, removing the metal film; IX, performing BOE corrosion; X, removing photoresist; XI, repeating the steps II-VIII; XII, splitting;and XIII, etching, and cleaning, namely placing the wafer into an etching machine, etching by an etching solution, flushing and drying. According to the method disclosed by the invention, the mechanical grinding wafer thickness limit of 30 microns is broken through, the power is about 55MHz, and the etching effect is excellent.

Description

technical field [0001] The invention relates to the technical field of wafer processing, in particular to a processing method for a quartz resonator wafer. Background technique [0002] In the existing quartz wafer processing, the frequency limit for batch and stable production by mechanical grinding is about 55 MHz with the fundamental wave starting, and the thickness of the quartz wafer is 30 μm. If it is desired to use an AT-type quartz crystal to obtain a frequency greater than the above-mentioned limit, it is necessary to use a high-order vibration vibration mode. [0003] Therefore, in order to obtain high frequencies, it is necessary to use complex circuits to control vibration modes such as third harmonics. However, it still cannot meet the characteristic requirements of high-frequency traction. The higher the frequency of the quartz wafer, the higher the requirement for parallelism. However, in the traditional quartz wafer etching process, the spread of the quart...

AI Technical Summary

Problems solved by technology

However, in the traditional quartz wafer etching process, the spread of the quartz wafer is not very good, there is overlap between the wafers, and the parallelism is not good, resulting in inconsistent corrosion of the etched surface of the wafer, which can only meet ordinary quartz with a base frequency of 55MHz and below. The processing requirements of wafers cannot meet the processing requirements of high fundamental frequency wafers

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