UV viscosity reducing composition, UV viscosity reducing film and preparation method thereof

Abstract

The invention relates to the technical field of protective films, in particular to an UV viscosity reducing composition, an UV viscosity reducing film and a preparation method thereof. The UV viscosity reducing composition is prepared from the following main raw materials in percent by weight: 20-50% of high temperature-resistant acrylate pressure-sensitive adhesive resin, 1-30% of a polyfunctional oligomer and/or polyfunctional monomer, 0.3-2% of a crosslinking agent, 0.1-5% of an antistatic agent, 0-2% of a dispersant, 0.2-2% of a leveling agent, 0.5-5% of a photoinitiator and 25-60% of a solvent. The UV viscosity reducing film comprises a substrate layer, an UV viscosity reducing layer coated thereon and a release film layer. The UV viscosity reducing composition has an excellent adhesive force, has a high adhesive force and a high release force before UV irradiation, has a low adhesive force, a low release force and a good antistatic effect after UV irradiation, and can resist 120DEG C high temperature for 30 minutes without an adhesive residue.

Description

technical field [0001] The invention relates to the technical field of protective films, in particular to a UV viscous reducing composition, a UV viscous reducing film and a preparation method thereof. Background technique [0002] In the semiconductor manufacturing process, when cutting and polishing semiconductor wafers, in order to reduce the defect density of silicon thin layers, wafer cutting and adhesion-reducing protective films are often used. Anti-adhesive protective film means that the adhesive force is strong when it is used, and the adhesive force is weakened for peeling in the later peeling process. [0003] At present, most of the anti-adhesive protective films on the market are UV anti-adhesive protective films, which means that they have high adhesive force and good adhesion before UV irradiation, and the adhesive force decreases significantly after UV irradiation and is easy to peel off. In the domestic market, most of the UV viscosifying adhesives used for...

AI Technical Summary

Problems solved by technology

In the domestic market, most of the UV viscosifying adhesives used for wafer cutting and picking process protection are mainly in Japan and Taiwan, China. There are also several domestic UV viscosifying adhesives that are developing and promoting, but their performance is not yet fully stable.

Moreover, the base material of the UV anti-adhesive protective film is prone to static electricity due to friction during use, and its use in the field of electronic parts with high static requirements is limited, such as easy to absorb dust, and then transferred to the attached product The surface, or the electrostatic voltage is too high, resulting in defective parts, etc.

In addition, after the current anti-viscosity protective film is used at high temperature, it is easy to cause residual glue that is difficult to remove

Images