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Resin composition and polyimide film and circuit board using resin composition

A resin composition, polyimide film technology, applied in printed circuit parts, compounds of periodic table Group 5/15 elements, organic chemistry, etc. The circuit board cannot achieve high-frequency signal transmission impedance matching and other problems, and achieve the effects of excellent flame retardancy, improved heat resistance, and increased cross-linking density

Inactive Publication Date: 2018-07-24
ZHEN DING TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the prior art, the polyimide film layer used in flexible printed circuit boards is generally prepared from diamine compounds and dianhydride compounds, because it contains polar functional groups, so that the dielectric constant of the film layer Often higher than 3.0, the flexible circuit board cannot achieve high-frequency signal transmission impedance matching, which affects the high-frequency and high-speed digitalization of signal transmission

Method used

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  • Resin composition and polyimide film and circuit board using resin composition
  • Resin composition and polyimide film and circuit board using resin composition
  • Resin composition and polyimide film and circuit board using resin composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] Add 4.8g of DOPO, 3.0g of p-aminoacetophenone, 4.8g of o-aminophenol, 0.19g of p-toluenesulfonic acid and 10g of dimethyl sulfoxide in the first reaction flask and stir to dissolve, then in a nitrogen atmosphere The chemical structural formula is prepared by heating at 100 degrees Celsius for 12 hours of the first product.

[0033] Add 1.0g of the first product, 0.7g of pyromellitic dianhydride, 6.8g of N-methylpyrrolidone and 3.4g of xylene in the second reaction flask and stir to dissolve, and then in a nitrogen atmosphere at 140 degrees Celsius Heated for 20 hours to reflux and remove water to prepare the chemical structural formula as of the second product.

[0034] In the third reaction flask, add 10g of the second product, 3.5g of 2-methacrylic anhydride, 0.1g of sodium acetate and 100g of N,N-dimethylacetamide and stir to dissolve, and then in a nitrogen atmosphere at 80 The chemical structural formula is prepared by heating at a temperature of 12 degrees Ce...

Embodiment 2

[0037] The pyromellitic dianhydride of described 0.7g in embodiment 1 is replaced with the 4 of 0.7g, and the 4'-oxygen diphthalic anhydride and other conditions are constant preparation chemical structural formula is modified polyimide polymer compound (II).

[0038] Add 100g modified polyimide macromolecular compound (II) successively in the reaction bottle, and the chemical structural formula that is 1 with the molar ratio of described modified polyimide macromolecular compound (II) is The epoxy resin and 100g of N,N-dimethylacetamide were stirred and dissolved to complete the resin composition. The viscosity of the resin composition is 40000cps.

Embodiment 3

[0040] The pyromellitic dianhydride of described 0.7g in embodiment 1 is replaced with 0.7g 3,4,3 ', 4'-biphenyltetracarboxylic dianhydride and other conditions are constant preparation chemical structural formula is modified polyimide polymer compound (III).

[0041] Add 100g modified polyimide macromolecular compound (III) successively in reaction flask, the chemical structural formula that is 1 with the molar ratio of described modified polyimide macromolecular compound (III) is: The epoxy resin and 100g of N,N-dimethylacetamide were stirred and dissolved to complete the resin composition. The viscosity of the resin composition is 48000cps.

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Abstract

A resin composition comprises a modified polyimide polymer compound, epoxy resin and a solvent, wherein the chemical structure formula of the modified polyimide polymer compound is as shown in the specification, wherein Ar' group is at least one selected from the group consisting of a phenyl group, a diphenyl ether group, a biphenyl group, a diphenylhexafluoro-isopropane group, diphenyl ketone group and diphenyl sulfone group, the resin composition comprises 100 parts by weight of the modified polyimide polymer compound, and the molar ratio of the epoxy resin to the modified polyimide polymercompound is 0.1-1. Further, the present invention provides a polyimide film using the resin composition and a circuit board produced by applying the resin composition.

Description

technical field [0001] The invention relates to a resin composition, a polyimide film and a circuit board using the resin composition. Background technique [0002] In the era of big data, the information processing of electronic products is constantly developing in the direction of high-frequency signal transmission and high-speed digitalization. To ensure that electronic products have good signal transmission quality under the condition of high-frequency signal transmission, the transmission line in the conductive copper foil of the flexible circuit board and the connected electronic components need to be in an impedance matching state to avoid signal reflection, Phenomena such as scattering, attenuation, and delay. The dielectric constant and dielectric loss factor of the material of the adhesive layer in contact with the conductive circuit in the flexible circuit board are an important factor affecting the matching of high-frequency transmission impedance. In the prior...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/10C08L79/08C08L63/00C08J5/18C08K7/26C07F9/6574H05K1/02
CPCC08G73/1067C07F9/65744C08G73/1071C08J5/18C08J2363/00C08J2379/08C08J2463/00C08J2479/08C08K7/26C08L63/00C08L79/08C08L2201/02C08L2201/08C08L2203/16C08L2203/20C08L2312/00H05K1/02
Inventor 何明展徐茂峰向首睿黄楠昆高郁雯滕家吟林庆炫
Owner ZHEN DING TECH CO LTD