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Combined treatment method for HEDP copper plating wastewater

A treatment method and wastewater technology, which are applied in metallurgical wastewater treatment, water/sewage treatment, neutralization water/sewage treatment, etc., can solve the problems of large equipment area and complicated HEDP copper plating wastewater treatment process, and achieve equipment occupying Small land area, good market application prospects, and strong practicability

Active Publication Date: 2018-08-10
GUANGZHOU ULTRA UNION CHEM LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] Based on this, in order to overcome the defects of the above-mentioned prior art, the present invention provides a combined treatment method of HEDP copper plating wastewater, which is simple and can effectively solve the problems of complex treatment process of HEDP copper plating wastewater and large equipment footprint

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  • Combined treatment method for HEDP copper plating wastewater
  • Combined treatment method for HEDP copper plating wastewater

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] Embodiment 1: Regulate pH treatment HEDP copper plating wastewater with lime emulsion

[0040] Step 1. Precipitation

[0041] Treat HEDP copper-plating wastewater containing 300 mg / L copper, 5000 mg / L HEDP, and 200 mg / L potassium sodium tartrate, and store the wastewater in the HEDP copper-plating wastewater regulating tank. The wastewater flows from the HEDP copper plating wastewater adjustment tank into the precipitation reaction tank A, stirs the tank liquid, adds lime emulsion to adjust the pH of the wastewater to 10-12, and adds 30 L of calcium chloride solution to each ton of wastewater; the wastewater flows from the precipitation reaction tank A Flow into the precipitation reaction tank B, and then add 2 L of sodium diethyldithiocarbamate solution per ton of waste water under stirring.

[0042] Step 2, Sediment Separation

[0043] The wastewater flows from the sedimentation reaction tank B into the flocculation tank, and the flocculant is added under the stirri...

Embodiment 2

[0050] Embodiment 2: Regulate pH with sodium hydroxide and process HEDP copper plating wastewater

[0051] Step 1. Precipitation

[0052] Treatment of HEDP copper plating wastewater containing copper 150 mg / L, HEDP 2500 mg / L, potassium sodium tartrate 100 mg / L. The wastewater flows from the HEDP copper plating wastewater adjustment tank into the precipitation reaction tank A, stirs the tank liquid, adds sodium hydroxide solution to adjust the pH of the wastewater to 10-12, and adds 40 L of calcium chloride solution to each ton of wastewater; the wastewater from the precipitation reaction Pool A flows into precipitation reaction pool B, and then add 2 L of sodium dimethyl dithiocarbamate solution per ton of waste water under stirring.

[0053] Step 2, Sediment Separation

[0054] The wastewater flows from the sedimentation reaction tank B into the flocculation tank, and the flocculant is added under the stirring condition. The amount of the flocculant added can make the sedim...

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Abstract

The invention discloses a treatment method for 1-hydroxyethylidene-1,1-diphosphonic acid (HEDP) copper plating wastewater. The method comprises the following steps: adjusting a pH of the HEDP copper plating wastewater to 10-12 by using a lime emulsion or sodium hydroxide, adding calcium chloride to precipitate HEDP and a potassium sodium tartrate complexing agent, and enabling most of copper ionsto be converted into a 1-hydroxyethylidene-1,1-copper diphosphonate precipitate or a copper hydroxide precipitate; adding sodium diethyldithiocarbamate or sodium dimethyldithiocarbamate to precipitateresidual copper, and enabling released HEDP and tartrate ions to form precipitates with calcium ions; adding a flocculant to make precipitated particles aggregated, and performing filtration separation on the precipitate; and enabling treatment results of copper, total phosphorus and COD in a supernatant to satisfy requirements of a table 3 of GB 21900-2008 (discharge standard for pollutants fromelectroplating). The treatment method for the HEDP copper plating wastewater provided by the invention has the advantages of a simple process, a small equipment floor space, low processing costs, high practicability and better market prospects.

Description

technical field [0001] The invention belongs to the technical field of wastewater treatment, in particular to a combined treatment method for HEDP copper plating wastewater. Background technique [0002] The Chinese name of HEDP is 1-hydroxyethylidene-1,1-diphosphonic acid. The HEDP copper plating system has attracted widespread attention because of its environmental protection, non-toxicity and direct electroplating on steel substrates. HEDP copper plating can obtain copper with good performance. It is a cyanide-free pre-copper plating process that is very promising to replace cyanide pre-plating copper. The wastewater produced by this process mainly contains the main complexing agent HEDP and its complexes with copper ions, and also contains other organic pollutants such as potassium sodium tartrate and other auxiliary complexing agents, grain refiners, etc. Because the C-P bond in the HEDP molecule is firm, the bond energy is 246 kJ / mol, the chemical properties are stabl...

Claims

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Application Information

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IPC IPC(8): C02F9/04C02F101/20C02F103/16
CPCC02F1/52C02F1/5236C02F1/54C02F1/56C02F1/66C02F2101/20C02F2103/16
Inventor 郭崇武李小花赖奂汶
Owner GUANGZHOU ULTRA UNION CHEM LTD
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