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Modified cyanate ester resin and preparation method thereof

A cyanate ester resin and cyanate ester technology are applied in the field of modified cyanate ester resin and its preparation, which can solve the problems of not being able to simultaneously reduce the curing temperature of the cyanate ester resin, improve thermal stability, etc. The effect of curing temperature and simple process

Active Publication Date: 2018-08-14
EAST CHINA UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is to overcome the defects that the modification methods in the prior art cannot simultaneously reduce the curing temperature of cyanate resin, improve thermal stability and reduce dielectric loss, and provide a modified cyanide resin Ester resin and preparation method thereof

Method used

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  • Modified cyanate ester resin and preparation method thereof
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  • Modified cyanate ester resin and preparation method thereof

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Embodiment 6

[0037] In Example 6, the cyanate ester raw material selected is bisphenol E-type cyanate ester monomer, and the product model is CE09MO, which is purchased from Yangzhou Tianqi New Materials Co., Ltd.

[0038] In the data test part, the curing reaction temperature of the modified cyanate ester resin can be tested with a differential scanning calorimeter (DSC), and the starting temperature of the curing reaction (T i ), and the curing reaction peak temperature (T p ), the end temperature of curing reaction (T f ) and the curing reaction exothermic enthalpy (ΔH). The curing process of the modified cyanate ester resin can be determined with reference to the results of the resin DSC test. The thermal stability of the thermally cured modified cyanate ester resin can be tested with a thermogravimetric analyzer (TGA) in a nitrogen atmosphere, and 5% can be obtained. Thermogravimetric temperature (T d5 ) and the residual rate at 800°C (Y r800℃ ) to reflect the thermal stability of...

Embodiment 1

[0043] Preparation of Silicon-Containing Aryne Resin Modified Cyanate Resin (BA / PSA-1)

[0044] 100g of tetrahydrofuran was weighed into a 500mL three-necked round-bottomed flask with mechanical stirring, 90g of bisphenol A cyanate monomer (BADCy) and 10g of silicon-containing arylyne resin PSA-E were added under stirring, and the solution was dissolved after stirring at room temperature for 30min. The uniform brown-yellow solution was distilled under reduced pressure at -0.09~-0.1MPa, the tetrahydrofuran solvent was removed at 50°C, the melt was poured out while hot, and after cooling, the cyanate ester resin (BA / PSA-1), carry out DSC analysis, the results are shown in the attached figure 1 And Table 1, it can be seen that the initial curing temperature of the modified cyanate resin BA / PSA-1 decreased by 73°C. The modified cyanate resin was cured at 170°C / 2h and 210°C / 2h, and then post-cured at 250°C / 4h (ie, three-stage temperature-programmed) to obtain a cured product of t...

Embodiment 2

[0050] Preparation of Silicon-Containing Aryne-Modified Cyanate Resin (BA / PSA-2)

[0051] 100g of tetrahydrofuran was weighed into a 500mL three-necked round-bottomed flask with mechanical stirring, 80g of bisphenol A cyanate monomer (BADCy) and 20g of silicon-containing arylalkyne resin PSA-E were added under stirring, and the solution was dissolved after stirring at room temperature for 60min. The uniform brown-yellow solution was distilled under reduced pressure at -0.09~-0.1MPa, the tetrahydrofuran solvent was removed at 50°C, the melt was poured out while hot, and after cooling, the cyanate ester resin (BA / PSA-2), carry out DSC analysis, the results are shown in the attached figure 1 And Table 1, it can be seen that the initial curing temperature of the modified cyanate resin BA / PSA-2 decreased by 95°C. The modified cyanate ester resin was cured at 170°C / 2h and 210°C / 2h, and then cured at 250°C / 4h to obtain a cured product of the modified cyanate ester. The TGA test was...

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Abstract

The invention discloses modified cyanate ester resin and a preparation method thereof. The preparation method comprises the following steps: uniformly mixing a solvent, cyanate ester with the mass fraction of 50 to 90 percent, silicon-containing aryne resin with the mass fraction of 10 to 50 percent; carrying out vacuum distillation after the resin is completely dissolved, thus obtaining a finished product. The sum of the mass fraction of cyanate ester and the silicon-containing aryne resin is 100 percent. The preparation method of the modified cyanate ester resin disclosed by the invention has the advantages of simple process, convenience in operation and broad application prospect in the fields of aviation, spaceflight, electronics and transportation; the curing temperature of a resin system can be effectively reduced, heat resistance of the resin is improved and dielectric loss of the resin is reduced.

Description

technical field [0001] The invention relates to the technical fields of polymer chemistry, polymer physics and polymer material modification, in particular to a modified cyanate ester resin and a preparation method thereof. Background technique [0002] Cyanate ester resin is a new type of resin that contains two or more cyanate ester functional groups in the molecule, and can directly self-polymerize to form a triazine ring structure after being heated. Cyanate ester resin exhibits heat resistance and flame retardancy due to its high regularity of structure and high crosslinking density, and has stable low dielectric constant and dielectric loss in a wide frequency range. But the high curing temperature of cyanate resin is one of its shortcomings, and reducing the curing temperature of cyanate resin is the direction of its research. Transition metal catalysts have been used in the curing reaction of cyanate esters, of which copper acetylacetonate is considered to be one of...

Claims

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Application Information

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IPC IPC(8): C08G73/06
CPCC08G73/0644C08G73/065
Inventor 袁荞龙黄发荣蔡明成杜峰可
Owner EAST CHINA UNIV OF SCI & TECH