Preparation method of modified epoxy resin material

An epoxy resin and modification technology, which is applied in the field of preparation of modified epoxy resin materials, can solve the problems of low shrinkage, high brittleness, insufficient curing, etc., to overcome the decrease in adhesion, improve heat resistance, and good curing effect Effect

Inactive Publication Date: 2018-08-21
嘉兴立一新材料股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Simple resins can no longer meet the application of copper clad laminates. Even cyanate resins with better heat resistance have excellent dielectric properties (dielectric coefficient: 2.8-3.2; dielectric loss factor: 0.002-0.003), high Heat resistance (glass transition temperature: 280-295°C), and cyanate ester resin also has low shrinkage, excellent mechanical properties and bonding properties, etc., but it has not been widely used due to defects such as insufficient curing and high brittleness.

Method used

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  • Preparation method of modified epoxy resin material
  • Preparation method of modified epoxy resin material
  • Preparation method of modified epoxy resin material

Examples

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Embodiment 1

[0024] A preparation method of modified epoxy resin material, comprising the following steps:

[0025] (1) Disperse the nano-silica foam in toluene, then add vinyl propionate, tert-butyl diazoacetate and allyl aralkylphenol; stir at 110°C for 30 minutes; then add tetramethylethyl ether Diamine, disperse evenly and then add dibutylzinc dilaurate, reflux reaction for 7 hours, finally add acetone to obtain modified silica with a solid content of 40%; nano silica foam, vinyl propionate, diazo The mass ratio of tert-butyl acetate, allyl aralkylphenol, tetramethylethylenediamine, and dibutylzinc dilaurate is 1: 1: 0.5: 1.5: 0.5: 0.008; the present invention uses vinyl propionate Esters, tert-butyl diazoacetate, allyl aralkylphenol, and tetramethylethylenediamine monomers treat nano-silica foam, which weakens the reactivity of fillers and improves the dispersion of fillers in organic matter. Play a role in hot pressing curing;

[0026] (2) At room temperature, mix 3,3'-dithiodiprop...

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PUM

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Abstract

The invention relates to a preparation method of a modified epoxy resin material. The preparation method comprises the following steps: adding modified silicon dioxide into a bifunctional epoxy system, adding a mono-functional epoxy system and a nanometer polytetrafluoroethylene particle to obtain a glue solution, regulating the solid content of the glue solution to 50% through propylene glycol methyl ether acetate, dipping a glass cloth into the glue solution, heating, and drying to obtain the modified epoxy resin material, and the modified epoxy resin material has an excellent flame retardant property and an excellent heat resisting property, and the abrasive resistance is particularly prominent.

Description

technical field [0001] The invention belongs to the technical field of electronic composite materials, and in particular relates to a preparation method of a modified epoxy resin material. Background technique [0002] With the continuous development of science and technology, the application of polymer matrix composites is becoming more and more extensive. At the same time, various application fields also put forward higher requirements for different materials, such as high temperature resistance, ablation resistance, wear resistance, etc. With the emphasis on flame retardancy, products are required to have flame retardancy. Flame retardancy has grade requirements, which are UL94 V-2, UL94 V-1 and UL94 V-0 grades, of which UL94 V-0 grade is the existing International standard for determining whether a substance is flame retardant. Finding a balance between fire protection and environmental protection is an important node in the development of future flame retardant produc...

Claims

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Application Information

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IPC IPC(8): C08J5/04C08J5/10C08L63/00C08L27/18C08L71/02C08K13/06C08K9/04C08K3/36C08K3/04C08G59/22C08G59/24
CPCC08G59/223C08G59/245C08J5/043C08J5/10C08J2363/00C08J2427/18C08J2463/00C08J2471/02C08K3/042C08K3/36C08K9/04C08K13/06C08K2201/011
Inventor 王志龙韩建梁国正
Owner 嘉兴立一新材料股份有限公司
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