Preparation technology for metal thin film
A metal thin film and preparation process technology, applied in sustainable manufacturing/processing, final product manufacturing, electrical components, etc., can solve the problems of low efficiency and high preparation cost, and achieve the effect of high bonding strength, stable composition and reduced preparation cost
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Embodiment 1
[0066] Use copper foil as the base material, use organic solvent to remove the oil stain on the surface, then impregnate the copper foil with dilute hydrochloric acid to remove the oxide skin on the surface of the copper layer of the base material, rinse with deionized water to remove the copper ions and chlorine on the surface of the copper layer of the base material ions, then dry the surface with high-purity inert gas at 50-70°C, use 0.5mol / L dilute hydrochloric acid solution as the liquid, put the cleaned copper foil into it, and connect it to the negative electrode; place gallium on the copper foil Located near the negative end of the power supply; insert the platinum electrode, connect to the positive pole of the power supply, and do not contact with copper foil and gallium; control the temperature of the above dilute hydrochloric acid solution to 50°C, adjust the power supply voltage to 12V, power on for 30 minutes, power off, and take out the copper foil and wash. Afte...
Embodiment 2
[0068] Use copper-coated glass as the base material, use organic solvent to remove the oil stain on the surface, then impregnate the copper-coated glass with dilute hydrochloric acid to remove the oxide skin on the surface of the copper layer of the base material, rinse with deionized water to remove the copper ions on the surface of the copper layer of the base material and chlorine ions, then dry the surface with high-purity inert gas at 50-70°C, use 1mol / L dilute sodium hydroxide solution as the liquid, put the cleaned copper-coated glass into it, and connect it to the negative electrode; The alloy is placed on the copper-coated glass at the end close to the negative pole of the power supply; the platinum electrode is inserted and connected to the positive pole of the power supply, and is not in contact with the copper-coated glass and gallium-indium alloy; the temperature of the above dilute sodium hydroxide solution is controlled at 70°C, and the power supply voltage is adj...
Embodiment 3
[0070] Use the copper-plated polymer film as the substrate, remove the oil on the surface with an organic solvent, then impregnate the copper-plated polymer film with dilute hydrochloric acid to remove the oxide skin on the surface of the copper layer of the substrate, rinse with deionized water, and remove the copper layer of the substrate Copper ions and chloride ions on the surface, then dry the surface with high-purity inert gas at 50-70°C, use 0.6mol / L dilute sodium hydroxide solution as the liquid, put the cleaned copper-plated polymer film into it, and Connect to the negative pole; place the gallium-indium alloy on the copper-plated polymer film at the end close to the negative pole of the power supply; insert the platinum electrode and connect it to the positive pole of the power supply without contacting the copper-plated polymer film and gallium; control the above dilute sodium hydroxide solution The temperature is 20°C, the voltage is adjusted to 6V, the power is tur...
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