Forming method for graphite ceramic composite pipe
A ceramic composite and tube forming technology, which is applied in the field of inorganic non-material forming and engineering applications, can solve the problems of easy cracking of graphite tubes, the influence of pore distribution on the stability of resistivity, and the difficulty of mechanical cutting, so as to improve the compactness and resistance The effect of high pressure capacity, sufficient and close contact between graphite layers, and improvement of material utilization
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0022] (1) Prepare natural flake graphite powder, thermosetting phenolic resin powder, silicon powder and silicon dioxide powder according to the following requirements (among them, the mass fraction of natural flake graphite is 60wt% (its carbon content is 99.6%, and its particle size is 150 mesh) , the mass fraction of thermosetting phenolic resin powder is 15wt% (particle size is 500 mesh), the mass fraction of silica powder is 5wt% (purity 99.5%, particle size is 500 mesh), and the rest is silicon powder (purity is 99.5%, particle size is 200 mesh) mesh).The above-mentioned powders were added in batches to a dry-process high-efficiency roller ball mill, and mechanically mixed for 6 hours at a speed of 150rpm.
[0023] (2) Fill the prepared mixed powder in batches into a metal mold with an annular cavity at a preheating temperature of 160°C. The metal mold includes an annular outer mold 401, an annular inner mold 402, and an annular cavity 403, filling once, prepressing onc...
Embodiment 2
[0028] (1) Prepare natural flake graphite powder, thermosetting phenolic resin powder, silicon powder and silicon dioxide powder according to the following requirements (the mass fraction of natural flake graphite is 60wt% (its carbon content is 99.5%, and its particle size is 200 mesh), thermosetting The mass fraction of phenolic resin powder is 20wt% (particle size is 800 mesh), the mass fraction of silica powder is 3wt% (purity is 99.5%, particle size is 600 mesh), and the rest is silicon powder (purity is 99.5%, particle size is 300 mesh) The above-mentioned powders were added in batches to a dry-process high-efficiency roller ball mill, and mechanically mixed for 5 hours at a rotational speed of 240 rpm.
[0029] (2) Fill the prepared mixed powder in batches into a metal mold with an annular cavity at a preheating temperature of 170°C. The metal mold includes an annular outer mold 401, an annular inner mold 402, and an annular cavity 403, filling once, prepressing once, r...
Embodiment 3
[0034] (1) Prepare natural flake graphite powder, thermosetting phenolic resin powder, silicon powder and silicon dioxide powder according to the following requirements (the mass fraction of natural flake graphite is 55wt% (its carbon content is 99.5%, and its particle size is 270 mesh), thermosetting The mass fraction of phenolic resin powder is 25wt% (particle size is 800 mesh), the mass fraction of silica powder is 5wt% (purity is 99.5%, particle size is 800 mesh), and the rest is silicon powder (purity is 99%, particle size is 500 mesh) ). The above-mentioned powders were added in batches to a dry-process high-efficiency roller ball mill, and mechanically mixed for 3 hours at a rotational speed of 290 rpm.
[0035] (2) Fill the prepared mixed powder in batches into a metal mold with an annular cavity at a preheating temperature of 180°C. The metal mold includes an annular outer mold 401, an annular inner mold 402, and an annular cavity 403, filling once, prepressing once,...
PUM
| Property | Measurement | Unit |
|---|---|---|
| Density | aaaaa | aaaaa |
| Resistivity | aaaaa | aaaaa |
| Density | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More - R&D
- Intellectual Property
- Life Sciences
- Materials
- Tech Scout
- Unparalleled Data Quality
- Higher Quality Content
- 60% Fewer Hallucinations
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com



