Preparation method for carbon/carbon composite material hollow plate
A carbon composite material, hollow board technology, applied in chemical instruments and methods, lamination devices, lamination auxiliary operations and other directions, can solve the problems of increasing the cost and difficulty of preparation, heavy weight, etc., to reduce material and production costs, The effect of light overall weight and stable product quality
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0042] refer to Figure 1-Figure 9 , the preparation method of the carbon / carbon composite material hollow plate of the present embodiment comprises the following steps:
[0043](1) Raw materials and mold preparation: Prepare the upper panel green body 11, the core body 211, the lower panel green body 31, and the resin binder; prepare the mold frame 4 and the core rod 41; Figure 1-Figure 4 As shown; the blank material of the upper panel blank 11, the core blank 211 and the lower panel blank 31 is a three-dimensional needle-punched felt, and the needle-punched density of the three-dimensional needle-punched felt is 30 needles / cm², the bulk density of the three-dimensional needle felt is 0.5g / cm³; the cross section of the core body 211 is in the shape of "H"; the resin binder is furan resin, the curing agent of the furan resin Adopt p-benzenemethanesulfonic acid, the mass fraction of described curing agent consumption is 5%.
[0044] (2) Blank making: (a) uniformly brush the...
Embodiment 2
[0055] The difference between this embodiment and embodiment 1 is only:
[0056] The needle-punched density of the three-dimensional needle-punched felt in step (1) is 50 needles / cm², and the volume density of the three-dimensional needle-punched felt is 0.6g / cm³; the resin binder is a phenolic resin, and the phenolic resin The curing agent adopts phosphoric acid, and the mass fraction of described curing agent consumption is 10%;
[0057] The curing temperature described in step (3) is 200°C, and the holding time is 0.5h;
[0058] The temperature of the carbonization treatment in step (4) is 950°C, and the temperature is kept for 5 hours;
[0059] The temperature of the high temperature treatment in step (5) is 1600°C, and the temperature is kept for 20 hours;
[0060] In step (6), the resin impregnation-curing-carbonization-high temperature cycle process is used to densify the green body, and the resin impregnation-cure-carbonization-high temperature cycle process is to pu...
Embodiment 3
[0063] The difference between this embodiment and embodiment 1 is only:
[0064] The needle-punched density of the three-dimensional needle-punched felt in step (1) is 10 needles / cm², and the volume density of the three-dimensional needle-punched felt is 0.4g / cm³; the curing agent of the furan resin is benzenesulfonic acid, and the The mass fraction of curing agent consumption is 1%;
[0065] The curing temperature described in step (3) is 250°C, and the holding time is 3 hours;
[0066] The temperature of the carbonization treatment in step (4) is 650°C, and the temperature is kept for 20 hours;
[0067] The temperature of the high temperature treatment in step (5) is 2200°C, and the temperature is kept for 5 hours;
[0068] In step (6), a combined process of chemical vapor deposition and resin impregnation-curing-carbonization-high temperature cycle is used to densify the green body. The temperature of the chemical vapor deposition is 1600°C, the carbon source gas is natur...
PUM
Property | Measurement | Unit |
---|---|---|
density | aaaaa | aaaaa |
length | aaaaa | aaaaa |
density | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com