Adhesive and preparation method

A technology of adhesives and silica gel, applied in the direction of adhesives, adhesive types, conductive adhesives, etc., can solve the problems of poor weather resistance, high hardness of conductive adhesives, etc., and achieve the effects of reducing costs, dispersing stress well, and reducing hardness

Inactive Publication Date: 2018-09-04
点馨(上海)实业有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In view of this, the present invention aims to propose an adhesive and a preparation method, based on the adh

Method used

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Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0035] The preparation method that is used to make adhesive: this method comprises the following steps:

[0036] Step 1: Pre-dry the multiple components of the adhesive to remove the moisture in the components for later use;

[0037] Step 2: weighing multiple components according to the weight of the adhesive;

[0038] Step 3: Add multiple components into the stirring tank for stirring, so that multiple components are fully fused to form a mixed colloid;

[0039] During the stirring process of the stirred tank, the vacuum treatment is carried out simultaneously.

[0040] By pre-drying the filler, removing the moisture in multiple fillers, avoiding weighing errors, using the stirring tank to stir the filler while vacuuming, avoiding the generation of air bubbles in the adhesive, and the processing is convenient and fast.

[0041] The technology is described in detail below:

Embodiment 1

[0043] Adhesive, which includes the following components: silica gel base: 10-90 parts by weight, modified epoxy adhesive base: 10-90 parts by weight and acrylate glue: one or more of 10-90 parts by weight; crosslinking agent : 0-20 parts by weight; platinum compound: 0-10 parts by weight; additives: 0-15 parts by weight; reaction inhibitor: 0-10 parts by weight; reinforcing material: 0-50 parts by weight; conductive filler: 150-500 parts by weight parts by weight.

[0044] In this embodiment, optionally, the silica gel matrix is ​​one or more of methyl vinyl silicone rubber, silicone gel and silicone resin. By selecting the silica gel matrix, the hardness of the adhesive can be reduced, and at the same time, it has good The advantage of dispersing stress is that it has excellent adhesion and protection for low-strength bonded materials.

[0045] The silicone resin is one or more of polyester modified silicone resin, alkyd modified silicone resin, epoxy modified silicone resi...

Embodiment 2

[0065] Adhesive, which includes the following components: silica gel base: 10-90 parts by weight, modified epoxy adhesive base: 10-90 parts by weight and acrylate glue: one or more of 10-90 parts by weight; crosslinking agent : 0-20 parts by weight; platinum compound: 0-10 parts by weight; additives: 0-15 parts by weight; reaction inhibitor: 0-10 parts by weight; reinforcing material: 0-50 parts by weight; conductive filler: 150-500 parts by weight Parts by weight; Modified epoxy glue base: 10-90 parts by weight; Curing agent: 1-10 parts by weight; Accelerator: 1-10 parts by weight; Modifier: 1-50 parts by weight; Polyurethane glue: 10-90 parts by weight parts by weight; catalyst: 1-10 parts by weight; dehydrating agent: 1-30 parts by weight; coupling agent: 1-15 parts by weight.

[0066] In this embodiment, optionally, the curing agent is one of mercaptan curing agent, amine curing agent, modified amine curing agent, acid anhydride curing agent, imidazole curing agent and lat...

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PUM

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Abstract

The invention relates to the technical field of adhesives, in particular to an adhesive. The adhesive is prepared from the following components: one or more of 10 to 90 weight parts of a silica gel substrate, 10 to 90 weight parts of a modified epoxy glue substrate and 10 to 90 weight parts of acrylate adhesive; 0 to 20 weight parts of a crosslinking agent, 0 to 10 weight parts of a platinum compound, 0 to 15 weight parts of an additive, 0 to 10 weight parts of a reaction inhibitor, 0 to 50 weight parts of a reinforcing material and 150 to 500 weight parts of a conductive filler. By selectionof one or more of the silica gel substrate, the modified epoxy glue substrate and the acrylate adhesive, the hardness of the adhesive can be reduced, and the weather fastness of the adhesive can be improved; meanwhile, the adhesive has the advantage of high disperse stress and is excellent in adhesiveness and protectiveness for an adhered material with low intensity. Furthermore, by use of the conductive filler, the cost of the adhesive can be effectively reduced.

Description

technical field [0001] The invention relates to the field of adhesives, in particular to an adhesive and a preparation method. Background technique [0002] At present, this type of adhesive is mainly conductive silver paste, which is based on epoxy glue, and epoxy glue has high hardness, strong rigidity, and poor weather resistance. Therefore, this conductive adhesive has the disadvantages of high hardness and poor weather resistance. , In addition, the cost is high. When bonding some low-strength materials, the stress cannot be dispersed and the bonded materials will be damaged. Contents of the invention [0003] In view of this, the present invention aims to provide an adhesive and a preparation method. Based on the adhesive, the problems of high hardness and poor weather resistance of the conductive adhesive can be effectively solved. [0004] In order to achieve the above object, the first aspect of the present invention provides an adhesive, which includes the follo...

Claims

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Application Information

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IPC IPC(8): C09J183/04C09J183/07C09J183/05C09J163/00C09J133/04C09J11/06C09J11/04C09J11/08C09J9/02
CPCC08K2003/0812C08K2003/0831C08K2003/085C08K2003/0862C08K2003/2227C08K2003/265C08K2201/001C08L2205/025C08L2205/035C09J9/02C09J11/04C09J11/06C09J11/08C09J133/04C09J163/00C09J183/04C08L63/00C08L33/04C08L83/04C08K13/02C08K5/544C08K5/5435C08K5/55C08K3/36C08K3/26C08K3/22C08K3/08C08K3/04
Inventor 王金波项炯华
Owner 点馨(上海)实业有限公司
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