Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

A kind of preparation method of perovskite film layer and perovskite light-emitting diode device

A light-emitting diode and perovskite technology, applied in the field of electroluminescent diode devices, can solve the problems of low perovskite film coverage, affecting device performance, and low raw material utilization, and achieve easy operation, improved luminous intensity, and coverage large effect

Active Publication Date: 2020-03-20
NANJING UNIV OF POSTS & TELECOMM
View PDF2 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Evaporation method is rarely used because of its expensive equipment and low utilization of raw materials, which makes the cost high
However, the perovskite film prepared by the general solution method has a low coverage and many small holes, which lead to direct contact between the electrons on the upper and lower layers of the light-emitting layer and the hole transport layer, and the shunt is serious, which seriously affects the performance of the device.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A kind of preparation method of perovskite film layer and perovskite light-emitting diode device
  • A kind of preparation method of perovskite film layer and perovskite light-emitting diode device
  • A kind of preparation method of perovskite film layer and perovskite light-emitting diode device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] A perovskite light-emitting diode device is prepared with a structure such as figure 1 As shown, wherein the light-emitting layer is a perovskite film layer prepared by multiple spin coating methods; the preparation method of the perovskite light-emitting diode device includes the following steps:

[0030] 1) The transparent conductive glass substrate 1 is processed, wherein the transparent conductive glass substrate 1 is a smoked tin oxide (ITO) substrate.

[0031] First, rinse the transparent ITO conductive glass substrate in deionized water, then scrub it with acetone, ethanol, and deionized water, then use an ultrasonic instrument to ultrasonicate it in acetone, ethanol, and deionized water for 10 minutes, and finally bake it in a clean environment until Removes moisture completely.

[0032] 2) Preparation of the hole transport layer 2 .

[0033] Put the cleaned and dried transparent ITO conductive glass substrate in a UV ozone cleaner for 10 minutes, then spin-co...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
Login to View More

Abstract

The invention discloses a method for preparing a perovskite film layer and a perovskite light-emitting diode device, comprising the following steps: 1) drying a transparent conductive glass substrate after standardized cleaning; 2) placing the substrate in ultraviolet ozone Irradiate under the lamp for 10 minutes, and then spin-coat the hole transport material on the transparent conductive glass to form a hole transport layer; 3) spin-coat the perovskite precursor solution by using multiple spin coating methods, and spin-coat the hole transport layer to form perovskite 4) Vacuum-evaporating electron transport materials on the perovskite luminescent layer to form an electron transport layer; 5) Vacuum-evaporating electron injection materials and metals on the electron transport layer to form an electron injection layer and a cathode layer, Obtain a perovskite light-emitting diode device; 6) package the light-emitting device in a glove box with an inert gas atmosphere. The multi-spin coating method provided by the invention can inhibit the crystallization of the perovskite, make the perovskite film more compact and uniform, have a large coverage, enhance PL, and help improve the performance of the light-emitting diode device.

Description

technical field [0001] The invention relates to a perovskite film layer and a method for preparing a perovskite light-emitting diode device, belonging to the technical field of electroluminescent diode devices. Background technique [0002] Organic light-emitting diodes (OLEDs) have attracted widespread attention due to their many advantages such as simple fabrication process, fast response, no need for backlight and flexible bending. In recent years, perovskite materials have attracted extensive attention because they have the characteristics of both organic and inorganic semiconductor materials. The unique advantages of halide perovskite materials such as high carrier mobility, low exciton binding energy, and wide absorption spectrum make them widely used in photovoltaic cells, electroluminescent devices, and photodetectors. Optoelectronic devices have a wide range of applications. In addition, the advantages of perovskite materials, such as low-temperature, solution met...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L51/50H01L51/56
CPCH10K71/12H10K50/11H10K71/00
Inventor 陈淑芬冯增勤于洪涛黄维
Owner NANJING UNIV OF POSTS & TELECOMM
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products