Cross-linked graphene heat insulating board preparation method

A thermal insulation board and graphene technology, applied in the field of materials, can solve the problems of poor compatibility between inorganic fillers and polymer matrix, and reduced stability of finished products, so as to improve dispersion compatibility, increase mechanical strength, and good UV resistance Effect

Inactive Publication Date: 2018-09-14
温州市赢创新材料技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, at present, in order to improve the self-strength and thermal insulation properties of polystyrene insulation materials, inorganic fillers are usually introduced. However, the compatibility of inorganic fillers with polymer matrix is ​​poor, which easily leads to a decrease in the stability of the finished product.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] A kind of cross-linked graphene insulation board, it is made up of the raw material of following weight part:

[0025] Divinyl benzene 1, ethylene bis stearamide 0.8, graphene 16, sodium antimonate 1, phosphocellulose 4, diethylene glycol dibenzoate 2, styrene 110, sodium peroxide 2, sol dispersion 20.

[0026] Described sol dispersion liquid is made up of the raw material of following parts by weight:

[0027] Binaphthol 0.7, tetraethyl orthosilicate 40, alkylphenol polyoxyethylene ether 1, benzotriazole 0.5.

[0028] The preparation method of described sol dispersion liquid, comprises the following steps:

[0029] (1) Take benzotriazole, add it to absolute ethanol 10 times its weight, add ethyl naphthol, keep stirring at 50°C for 3 minutes, and obtain an alcohol dispersion;

[0030] (2) Take ethyl orthosilicate, add it to deionized water 25 times its weight, mix with the above alcohol dispersion, add dropwise ammonia water with a concentration of 10%, adjust the pH...

Embodiment 2

[0039] A kind of cross-linked graphene insulation board, it is made up of the raw material of following weight part:

[0040] Divinylbenzene 2, ethylene bisstearamide 1, graphene 20, sodium antimonate 2, phosphocellulose 5, diethylene glycol dibenzoate 4, styrene 120, sodium peroxide 4, sol dispersion 30.

[0041] Described sol dispersion liquid is made up of the raw material of following parts by weight:

[0042] Binaphthol 1, tetraethyl orthosilicate 50, alkylphenol polyoxyethylene ether 2, benzotriazole 1.

[0043] The preparation method of described sol dispersion liquid, comprises the following steps:

[0044] (1) Take benzotriazole, add it to 14 times the weight of absolute ethanol, add ethyl naphthol, keep stirring at 60°C for 10 minutes, and obtain an alcohol dispersion;

[0045] (2) Take ethyl orthosilicate, add it to deionized water 30 times its weight, mix with the above alcohol dispersion, add dropwise ammonia water with a concentration of 12%, adjust the pH to ...

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Abstract

The invention discloses a cross-linked graphene heat insulating board which comprises, by weight, 1-2 parts of divinyl benzene, 0.8-1 part of ethylene bis-stearamide, 16-20 parts of graphene, 1-2 parts of sodium antimonite, 4-5 parts of phosphorylated cellulose, 2-4 parts of diethylene glycol dibenzoate, 110-120 parts of vinyl benzene, 2-4 parts of sodium peroxide and 20-30 parts of sol dispersion. According to the board, fibers and the graphene are blended and dispersed into amide water solution, the water solution serves as a solvent, vinyl benzene serves as a monomer, polymerization under the action of an initiator is achieved, so that the dispersion compatibility of the fiber graphene between polyvinyl benzene is improved, and the mechanical strength of a finished product board is improved.

Description

technical field [0001] The invention belongs to the field of materials, and in particular relates to a method for preparing a cross-linked graphene insulation board. Background technique [0002] Polystyrene has good electrical insulation, colorless and transparent, second only to plexiglass in light transmittance, coloring and water resistance, good chemical stability, average strength, but brittle and prone to stress brittle cracking. Polystyrene resin compositions are widely used in the field of office equipment housings such as printers, copiers, computers or household appliances due to their excellent processability, mechanical properties and heat resistance; the uses of expanded polystyrene resins are also very Widely, because of its high strength, light weight, excellent thermal insulation performance and high energy absorption capacity, it can be used as packaging materials for various instruments, valuables, precision instruments, vegetables, fruits and aquatic prod...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L25/08C08L1/16C08K13/06C08K3/36C08K9/02C08K3/04C08K5/20C08F212/08C08F212/36
CPCC08F212/08C08L25/08C08L2201/08C08L1/16C08K13/06C08K3/36C08K9/02C08K3/042C08K5/20C08F212/36
Inventor 张德胜
Owner 温州市赢创新材料技术有限公司
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