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Spray-coating device and method for restraining secondary electron yield of solid dielectric material

A technology of secondary electrons and solid media, applied in the field of plasma, can solve the problems of high system equipment requirements, harsh processing conditions, long time, etc., and achieve the effect of expanding the processing area, enhancing the processing effect, and convenient operation

Active Publication Date: 2018-10-02
INST OF ELECTRICAL ENG CHINESE ACAD OF SCI
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

[0006] In summary, although the currently commonly used methods for suppressing secondary electron emission have a certain suppression effect, they have high requirements for system devices, relatively harsh processing conditions and a long time, low efficiency, and inflexibility.

Method used

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  • Spray-coating device and method for restraining secondary electron yield of solid dielectric material
  • Spray-coating device and method for restraining secondary electron yield of solid dielectric material
  • Spray-coating device and method for restraining secondary electron yield of solid dielectric material

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Embodiment 1

[0050] A spray coating method for suppressing secondary electron yield of solid dielectric materials, comprising the following steps:

[0051] Step 1, select 2 groups of polystyrene materials with a thickness of 2 mm, a size of 50×50 mm, and a smooth and clean surface; one group is used as an untreated sample for comparison; the other two groups are processed by the spray coating device respectively . The samples to be treated were washed and dried. Wherein, the cleaning of the sample to be treated includes: firstly use absolute ethanol or deionized water to wipe and clean, then put it into an ultrasonic cleaner for cleaning for 10-30 minutes, remove impurities and oil stains on the surface of the sample, and finally clean the sample to be treated The samples were placed in a vacuum drying oven to remove surface moisture. The drying conditions of the sample to be treated are as follows: the air pressure in the vacuum drying oven is 3000-5000 Pa, the temperature is 50-80° C.,...

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Abstract

The invention relates to a spray-coating device and a spray-coating method for restraining secondary electron yield of a solid dielectric material and belongs to the technical field of plasma. The spray-coating method comprises the following steps of: washing and drying a to-be-treated sample; building the spray-coating device for restraining the secondary electron yield of the solid dielectric material; carrying out an atmospheric plasma torch spray-coating experience; and carrying out a secondary electron yield test and material surface physical shape observation. According to the spray-coating device and the spray-coating method provided by the invention, by utilizing plasma torches generated by an atmospheric plasma spray gun, a reaction precursor reacts to generate a Ti-containing group and an N-containing group; a compact and uniform TiN film is deposited on the surface of a dielectric; specifically, a gas-carrying precursor has decomposition and polymerization reaction; polymerization, grafting and crosslinking effects are realized on the surface of the dielectric so that the deposited film forms a 'micro-trap' structure, the surface roughness is reduced, the secondary electron yield of the solid dielectric is restrained, and the surface insulation property of the dielectric is improved.

Description

technical field [0001] The invention relates to a spray coating device and method for suppressing the secondary electron yield of solid dielectric materials, and belongs to the field of plasma technology. Background technique [0002] Solid dielectric materials such as polymers (polystyrene PS), Al 2 o 3 Ceramics have good electrical insulation and mechanical properties, and are widely used in the fields of pulse power, high voltage insulation, and aerospace. However, in extreme environments such as strong electric fields or strong magnetic fields, secondary electron multiplication is prone to occur at the junction of vacuum / solid media, which induces flashover discharges on the surface of solid media, causing equipment burnout and damage. Therefore, the method of suppressing the secondary electron yield of solid dielectric materials has always been one of the key technologies for the development of pulse power drive sources, advanced power transmission and transformation ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C16/513C23C16/455C23C16/34C23C16/02
CPCC23C16/0227C23C16/34C23C16/45563C23C16/513
Inventor 孔飞邵涛任成燕章程严萍
Owner INST OF ELECTRICAL ENG CHINESE ACAD OF SCI
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