Resin composition and resin-coated copper foil made of resin composition

Abstract

The invention relates to a resin composition and a resin-coated copper foil made of the resin composition. The resin composition comprises an organic resin component and an inorganic filler, wherein the organic resin component comprises epoxy resin, 20-100 weight parts of active polyethersulfone relative to 100 weight parts of epoxy resin, 10-20 weight parts of phenoxy resin relative to 100 weightparts of epoxy resin; the inorganic filler is nanometer silicon dioxide, and relative to 100 weight parts of the organic resin component, the nanometer silicon dioxide is 2-10 weight parts. The resincomposition and the resin-coated copper foil made of the resin composition, provided by the invention, have the benefits that the epoxy resin is jointly enhanced and toughened by adopting the polyethersulfone, the nanometer silicon dioxide and the phenoxy resin, so that the resin-coated copper foil made of the resin composition has high Tg, high heat resistance, high thermal decomposition temperature, good size stability, excellent flame retardance and no powder falling and can meet the use requirements of higher-performance and high-density interconnecting PCB.

Description

technical field [0001] The invention relates to the technical field of electronic products, in particular to a resin composition used for printed circuit boards and a resin-coated copper foil produced therefrom. Background technique [0002] With the miniaturization and multi-functionalization of electronic equipment, high-density and high-performance printed circuit boards (PCBs) are required, and high-density interconnection technology is developing faster and faster, while resin-coated copper foil (RCC) does not contain glass fibers. , Compared with the bonding sheet (prepreg), the dielectric constant is lower, the signal transmission is faster, and it is more suitable for laser drilling, so it is widely used in high-density interconnect (HDI) printed circuit boards. At present, the Tg of RCC commonly used is below 155°C, the heat resistance is insufficient, and the dimensional stability is also relatively poor; while some RCCs with high Tg are brittle and have problems s...

AI Technical Summary

Problems solved by technology

At present, the Tg of RCC commonly used is below 155°C, the heat resistance is insufficient, and the dimensional stability is also relatively poor; while some RCCs with high Tg are brittle and have problems such as more powder shedding, which is difficult to meet the needs of higher performance HDI PCBs. Require

[0003] Chinese patent application CN102311612A uses phenol oxygen and core-shell resin (CSR) to toughen epoxy to make RCC. Although the Tg of this RCC is high and the powder drop is good, the heat resistance can also be passed by ordinary lead-free reflow soldering (max. temperature 260°C, less than 6 times), but if the number of original lead-free reflow soldering is increased to more than 10 times, or the maximum temperature of lead-free reflow soldering is increased to 280°C, the number of reflow soldering passes is lower, and it may even fail ; At the same time, the modulus of the RCC of the patent application is also relatively low, especially at a high temperature of 100 ° C, the RCC modulus drops more significantly, and there are deficiencies in the thinning HDI production process

In addition, the coefficient of thermal expansion (CTE) of the RCC of this patent application is also relatively large, which cannot meet the application requirements of any layer of high-density interconnection PCB

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