Photosensitive resin composition, light-shielding film, liquid crystal display device, and method of manufacturing liquid crystal display device and light-shielding film

A technology for liquid crystal display devices and photosensitive resins, applied in the field of light-shielding films, can solve the problems of the influence of TFT electrical characteristics and the deterioration of display quality, and achieve the effect of excellent breaking strength

Pending Publication Date: 2018-10-23
NIPPON STEEL CHEMICALL &MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, most of the column spacers formed by photolithography are transparent, and there is a problem in such column spacers t

Method used

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  • Photosensitive resin composition, light-shielding film, liquid crystal display device, and method of manufacturing liquid crystal display device and light-shielding film
  • Photosensitive resin composition, light-shielding film, liquid crystal display device, and method of manufacturing liquid crystal display device and light-shielding film
  • Photosensitive resin composition, light-shielding film, liquid crystal display device, and method of manufacturing liquid crystal display device and light-shielding film

Examples

Experimental program
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Example Embodiment

[0087] [Example]

[0088] Hereinafter, embodiments of the present invention will be specifically described based on Examples and Comparative Examples, but the present invention is not limited thereto.

[0089] First, the synthesis example of (A) polymerizable unsaturated group containing alkali-soluble resin of this invention is shown. The evaluation of the resin in the synthesis example was performed as follows.

[0090] [Solid content concentration]

[0091] 1 g of the resin solution obtained in the synthesis example was impregnated into a glass filter [weight: W0 (g)], weighed [W1 (g)], and based on the weight [W2 (g)] after heating at 160°C for 2 hours, Calculated from the following formula.

[0092] Solid content concentration (weight %)=100×(W2-W0) / (W1-W0)

[0093] [acid value]

[0094] The resin solution was dissolved in dioxane, and it was determined by titrating with a 1 / 10 N-KOH aqueous solution using a potentiometric titration device [manufactured by Hiranuma S...

Example Embodiment

[0104] [Synthesis Example 1]

[0105] Put 116.7g (0.23mol) of BPFE, 33.1g (0.46mol) of acrylic acid, 0.60g of TPP and 161.0g of PGMEA into a 1L four-necked flask with a reflux cooler, and heat at 100°C to 105°C Under stirring for 12 hr, the reaction product was obtained.

[0106] Then, 33.8 g (0.12 mol) of BPDA and 17.5 g (0.12 mol) of THPA were added to the obtained reaction product, and stirred under heating at 115° C. to 120° C. for 6 hrs to obtain an alkali-soluble compound containing polymerizable unsaturated groups. Resin solution (A)-1. The solid content concentration of the obtained resin solution was 56.5 wt%, the acid value (solid content conversion) was 102 mgKOH / g, and the Mw by GPC analysis was 3600.

Example Embodiment

[0107] [Comparative Synthesis Example 1]

[0108] Add 51.65g (0.60mol) of methacrylic acid, 38.44g (0.38mol) of methyl methacrylate, and 38.77g (0.22mol) of methacrylic acid into a 1000ml four-necked flask with a nitrogen inlet tube and a reflux tube Benzyl ester, 5.91 g of azobisisobutyronitrile, and 370 g of diethylene glycol dimethyl ether were stirred at 80° C. to 85° C. for 8 hr under a nitrogen stream to polymerize. Furthermore, 39.23 g (0.28 mol) of glycidyl methacrylate, 1.44 g of TPP, and 0.055 g of 2,6-di-tert-butyl-p-cresol were put into the flask, and stirred at 80°C to 85°C After 16 hrs, an alkali-soluble resin solution (A)-2 was obtained. The solid content concentration of the obtained resin solution was 32 mass %, the acid value (solid content conversion) was 110 mgKOH / g, and the Mw by GPC analysis was 18100.

[0109] (Alkali-soluble resins containing polymerizable unsaturated groups)

[0110] (A)-1 component: the alkali-soluble resin solution obtained in the...

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Abstract

The present invention relates to a photosensitive resin composition for a light-shielding film having a separator function, a light-shielding film, a liquid crystal display device, and a method for producing the liquid crystal display device and the light-shielding film. The photosensitive resin composition contains (A) component to (E) component as essential components: (A) an alkali-soluble resin containing a polymerizable unsaturated group; (B) a photopolymerizable monomer having at least three ethylenically unsaturated bonds; (C) a photopolymerization initiator; (D) a film having a surfaceresistivity of 1x10 <8> Omega /sq or more, a light-shielding component containing insulating carbon black, and a light density of 4/[mu]m; and (E) a solvent; and (D) the pencil hardness of a cured product of the composition except for the components is HB or more. It is possible to obtain a separator which is excellent in spacer properties such as a compression ratio, an elastic recovery ratio, and a breaking strength; and a separator having an order aberration of Delta H and an excellent pattern shape.

Description

technical field [0001] The present invention relates to a photosensitive resin composition and a light-shielding film formed by hardening it. Specifically, it relates to a black film capable of forming a spacer function and a black matrix function in a liquid crystal display device by photolithography. A photosensitive resin composition for a column spacer, a light-shielding film, a liquid crystal display device, and a method for manufacturing the light-shielding film and the liquid crystal display device. Background technique [0002] In recent years, color liquid crystal display devices (Liquid Crystal Display, LCD) are used in all fields such as liquid crystal televisions, liquid crystal monitors, and color liquid crystal mobile phones. Among them, in order to improve the performance of LCD, the improvement of characteristics such as viewing angle, contrast, and response speed is actively carried out, and various panel structures are also being developed in thin film tran...

Claims

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Application Information

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IPC IPC(8): G03F7/004G03F7/027G02F1/1335
CPCG02F1/133512G03F7/004G03F7/027G03F7/033G03F7/0007G02B5/20G02F1/133514
Inventor 小野悠树
Owner NIPPON STEEL CHEMICALL &MATERIAL CO LTD
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