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A kind of high-performance sintered conductive silver paste and its preparation method and sintering method

A conductive silver paste, high-performance technology, applied in the direction of equipment for manufacturing conductive/semiconductive layers, cable/conductor manufacturing, conductive materials dispersed in non-conductive inorganic materials, etc., can solve tailing, phase separation, Problems such as hindering development, to achieve high electrical and thermal conductivity, high connection strength, and high reliability

Active Publication Date: 2019-08-06
重庆邦锐特新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Usually the silver content in the silver paste is very high, when it is used, the silver is very easy to settle, this problem has been hindering its development
Common problems faced by conductive silver pastes on the market today: 1. Ag Separation is severe, and it needs to be remixed before use. Even if it is mixed evenly and then sprayed, it is very easy to have serious phase separation during the spraying process.
Leading to difficulties in workability and low reliability of products
[0005] In addition, in the sintering process, due to problems such as air in the glue or low viscosity of the glue, glue dripping will occur; due to the low thixotropic index of the glue, tailing will occur; Discontinuous coating will occur due to problems such as temporary blockage of air or pinholes

Method used

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  • A kind of high-performance sintered conductive silver paste and its preparation method and sintering method
  • A kind of high-performance sintered conductive silver paste and its preparation method and sintering method
  • A kind of high-performance sintered conductive silver paste and its preparation method and sintering method

Examples

Experimental program
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Effect test

preparation example Construction

[0039] Preparation example of nano silver powder:

[0040] The PVP of 0.2mol / L (Polyvinyl pyrrolidone, povidone, chemical name is polyvinylpyrrolidone, dosage is PVP / AgNO 3 =0.9 (mass ratio)) dissolved in deionized water, adding HNO 3 Adjust the pH to 2~3, then add AgNO at a concentration of 0.1mol / L 3 and 1.8.mol / L 2,3-dihydroxysuccinic acid (amount of 1mol:2mol), stirred at 1200r / min for 40min to obtain a white precipitate dispersion, and dried the precipitate dispersion in a vacuum environment Then pour the dry precipitate into a stainless steel autoclave lined with tetrafluoroethylene, heat the autoclave to 120°C with a tubular heating mantle, finish the reaction after 15 hours, stop heating, take out the autoclave, and let it cool naturally to room temperature. Under vacuum conditions, centrifuge at a speed of 1500r / min for 60 minutes, then wash, filter, and dry to remove organic matter, repeating 4 to 5 times, and finally add distilled water to obtain an aqueous solut...

Embodiment 1

[0070] Prepare 100g of organic carrier: heat the ethanol water bath to 60°C, slowly add 40g of terpineol, 27g of octanoic acid, 15g of polyvinyl butyral, 5g of dibutyl phthalate, 5g of polyamide wax, polyethylene glycol 2g of alcohol, 3g of γ-aminopropyltriethoxysilane, 3g of rhodium resinate, mechanically stirred for 60min~90min and set aside.

[0071] Preparation of mixed silver powder: Place the nano-silver powder, micro-silver powder, and silver nanowire prepared in the above examples in an oven at 220°C for 1 hour, and after cooling to room temperature, pour the nano-silver powder and micro-silver powder into terpineol / polyvinyl alcohol condensation Butyraldehyde solution, heated to 40°C and stirred for 10 minutes, heated to 60°C and stirred for 20 minutes, heated to 90°C and stirred for 30 minutes, filtered, rinsed with deionized water for 20 minutes, then baked at 60°C for 1 hour, heated to 100°C and baked Bake for 1 hour, then mix nano-silver powder, micro-silver powde...

Embodiment 2

[0087] Prepare 100g of organic carrier: heat the ethanol water bath to 60°C, slowly add 20g of terpineol, 45g of octanoic acid, 24g of polyvinyl butyral, 2g of dibutyl phthalate, 2g of polyamide wax, polyethylene glycol 1g of alcohol, 5g of γ-aminopropyltriethoxysilane, 1g of rhodium resinate, mechanically stirred for 60min~90min and set aside.

[0088] Preparation of mixed silver powder: Place the nano-silver powder, micro-silver powder, and silver nanowire prepared in the above examples in an oven at 220°C for 1 hour, and after cooling to room temperature, pour the nano-silver powder and micro-silver powder into terpineol / polyvinyl alcohol condensation Butyraldehyde solution, heated to 40°C and stirred for 10 minutes, heated to 60°C and stirred for 20 minutes, heated to 90°C and stirred for 30 minutes, filtered, rinsed with deionized water for 20 minutes, then baked at 60°C for 1 hour, heated to 100°C and baked Bake for 1 hour, then mix nano-silver powder, micro-silver powde...

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Abstract

The invention discloses high-performance sintered conductive silver paste and a preparation method and sintering method thereof. The conductive silver paste is prepared from, by weight, 70%-90% of mixed silver powder, 10%-20% of an organic carrier, no more than 10% of glass powder and no more than 10% of a metal silver compound, wherein the mixed silver powder is prepared from nano silver powder,micron silver powder and silver nanowires, and the organic carrier is prepared from an organic solvent, a surfactant and a thixotropic agent. The conductive silver paste has the high performance and cannot generate silver separation while achieving the low melting point, the high connection strength, the high electric conductivity and heat conductivity and the high weldability, therefore, the conductive silver paste is easy to construct and high in reliability and cannot generate the phenomena of dispensing, trailing and discontinuous coating.

Description

technical field [0001] The invention relates to the technical field of conductive materials, in particular to a high-performance sintered conductive silver paste, a preparation method and a sintering method thereof. Background technique [0002] Semiconductor integrated circuits are developing in the direction of high density, miniaturization, and high power. The degree of circuit integration is getting larger and higher, and the power is getting higher and higher. It has become a bottleneck restricting the development of integrated circuits. For the heating problem of power electronic devices, the key to solving the problem lies in the heat dissipation of the device, especially the heat dissipation performance of the connecting materials of each chip. [0003] In order to meet the performance requirements of high-power semiconductor devices, sintered conductive silver paste is generally used for connection. This conductive paste is generally composed of silver powder, glass...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01B1/22H01B1/16H01B13/00
CPCH01B1/16H01B1/22H01B13/00H01B13/0026
Inventor 张佳邱承林
Owner 重庆邦锐特新材料有限公司