Silane grafted POE adhesive film for photovoltaic encapsulation and preparation method
A technology of silane grafting and adhesive film, which is applied in the direction of grafting polymer adhesives, adhesives, film/sheet adhesives, etc., which can solve the problem of poor thermal creep resistance and inability to apply traditional crystalline silicon photovoltaic modules, etc. Problems, achieve the effect of preventing delamination, shortening the lamination time of components, and increasing the melting temperature
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Embodiment 1
[0030] (1) Put 95 parts of POE resin (melt flow rate is 16g / 10min, light transmittance> 91%, volume resistivity> 1.0×10 15 , Melting temperature 76℃), 0.3 parts of vinyl trimethoxy silane, 0.05 parts of dicumyl peroxide, 10 parts of polyurethane elastomer resin (transmittance> 90%, volume resistivity> 1.0×10 15 , The melting temperature is 145℃), 0.1 part of tripropenyl isocyanurate, 0.5 part of POE grafted maleic anhydride, mixed uniformly, poured into a twin-screw extruder, 160-220℃ to prepare graft masterbatch, Standby; (2) Put 5 parts of POE resin (melt flow rate is 16g / 10min, light transmittance> 91%, volume resistivity> 1.0×10 15 , Melting temperature 76℃), 0.1 part of 3,5-di-tert-butyl-4-hydroxy-benzoic acid cetyl ester, 0.1 part of 2-benzotriazol-2-yl-4,6-di-tert Butylphenol and 0.1 part of β-(3,5-di-tert-butyl-4-hydroxyphenyl) n-octadecyl propionate are mixed uniformly, poured into a twin-screw extruder, and prepared at 160-220℃ Auxiliary masterbatch, ready for use; (3)...
Embodiment 2
[0033] (1) Put 95 parts of POE resin (melt flow rate is 16g / 10min, light transmittance> 91%, volume resistivity> 1.0×10 15 , The melting temperature is 76℃), 0.5 parts of γ-methacryloxypropyl trimethoxysilane, 0.5 parts of vinyl trimethoxysilane, 0.1 parts of tert-butyl peroxide-2-ethylhexyl carbonate, 20 Parts of styrene-ethylene-butylene-styrene block copolymer elastomer resin (transmittance>90%, volume resistivity>1.0×10 15 , The melting temperature is 155℃), 0.1 part of tripropenyl isocyanurate, 0.1 part of divinylbenzene, 1.5 part of POE grafted maleic anhydride, mixed uniformly, poured into the twin-screw extruder, 160-220℃ Prepare the graft masterbatch for later use; (2) Put 5 parts of POE resin (melt flow rate is 16g / 10min, light transmittance>91%, volume resistivity>1.0×10 15 , The melting temperature is 76℃), 0.05 parts of bis(2,2,6,6-tetramethylpiperidinyl) sebacate, 0.05 parts of 2-hydroxy-4-n-octyloxybenzophenone, 0.6 One part of four [β-(3,5-di-tert-butyl-4-hydroxy...
Embodiment 3
[0036] (1) Mix 95 parts of POE resin (melt flow rate is 3g / 10min, light transmittance>85%, volume resistivity>1.0×10 14 , The melting temperature is 97℃), 3 parts of vinyl triethoxy silane, 0.25 parts of di-tert-butyl diisopropyl benzene, 5 parts of polyurethane elastomer resin (light transmittance> 90%, volume resistivity> 1.0×10 15 , Melting temperature is 145℃), 5 parts of styrene-ethylene-butylene-styrene block copolymer elastomer resin (transmittance>90%, volume resistivity>1.0×10 15 , Melting temperature is 155℃), 0.2 parts of trimethylolpropane triacrylate, 2.5 parts of POE grafted maleic anhydride, 1.5 parts of POE grafted glycidyl methacrylate, mixed uniformly, and poured into the twin-screw extruder , 160-220℃ to prepare the grafting masterbatch, ready for use; (2) 5 parts of POE resin (melt flow rate is 3g / 10min, light transmittance>85%, volume resistivity>1.0×10 14 , The melting temperature is 97℃), 0.3 parts of bis(1-octyloxy-2,2,6,6-tetramethyl-4-piperidinyl) sebaca...
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