Epoxy resin containing TCPD structure, epoxy resin composition, prepreg, laminated board and printing circuit board

A technology of epoxy resin and novolac epoxy resin, which is applied in the field of laminates, can solve the problems of low dielectric constant, heat resistance to be further improved, low dielectric loss factors, etc.

Active Publication Date: 2018-11-23
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The invention uses dicyclopentadiene-type benzoxazine resin combined with epoxy resin, active ester curing agent and phosphorus-containing flame retardant to make prepregs and laminates with low dielectric constant, low dielectric loss factor, low Water absorption and good flame retardancy, but its glass transition temperature can only reach 153-172°C, and the heat resistance needs to be further improved

Method used

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  • Epoxy resin containing TCPD structure, epoxy resin composition, prepreg, laminated board and printing circuit board
  • Epoxy resin containing TCPD structure, epoxy resin composition, prepreg, laminated board and printing circuit board
  • Epoxy resin containing TCPD structure, epoxy resin composition, prepreg, laminated board and printing circuit board

Examples

Experimental program
Comparison scheme
Effect test

preparation example 1

[0099] Preparation example 1: the synthesis of the epoxy resin of formula I structure

[0100] Add 54.4g of phenol and toluene into a four-necked flask (500mL) equipped with a stirrer, a thermometer, and a condensing reflux device, dissolve in a water bath, weigh 1.4g of boron trifluoride diethyl ether complex, and add In the flask, add 39.6g TCPD into the dropping funnel, control the dropping speed so that all the TCPD is added dropwise within 2 hours, raise the temperature to 100-120°C, keep it warm for 5 hours, after the reaction is over, wash with water, filter, recrystallize, vacuum Dry to obtain the phenolic resin containing TCPD structure.

[0101] Put the 25g phenolic resin containing the TCPD structure obtained in the previous step into a four-necked flask, then weigh 100g epichlorohydrin and add slowly, after it dissolves, start to heat up, and add 1mol of mass fraction in the dropping funnel to be 33% NaOH solution, control the speed so that it can be added dropwis...

preparation example 2

[0103] Preparation example 2: the epoxy resin synthesis of formula II structure

[0104] Add 136.8g of bisphenol A into a four-neck flask (500mL) equipped with a stirrer, a thermometer, and a condensing reflux device, and toluene as a solvent, dissolve in a water bath heating, weigh 1.4g of boron trifluoride etherate complex, add In the four-neck flask, add 39.6g TCPD into the dropping funnel, control the dropping speed so that all the TCPD is added dropwise within 2 hours, raise the temperature to 100-120°C, keep it warm for 5 hours, after the reaction is over, wash with water, filter, and recrystallize , and dried in vacuum to obtain a phenolic resin containing TCPD structure.

[0105] Put the 25g phenolic resin containing the TCPD structure obtained in the previous step into a four-necked flask, then weigh 100g epichlorohydrin and add slowly, after it dissolves, start to heat up, and add 1mol of mass fraction in the dropping funnel to be 33% NaOH solution, control the spee...

preparation example 3

[0107] Preparation example 3: the epoxy resin synthesis of formula I structure

[0108] Add 108g of o-cresol and toluene as a solvent in a four-neck flask (500mL) equipped with a stirrer, a thermometer, and a condensing reflux device, dissolve in a water bath heating, weigh 1.4g of boron trifluoride diethyl ether complex, add four In the flask, add 39.6g TCPD to the dropping funnel, control the dropping speed so that all the TCPD is added dropwise within 2 hours, raise the temperature to 100-120°C, keep it warm for 5 hours, after the reaction is over, wash with water, filter, and recrystallize. Vacuum drying to obtain the phenolic resin containing TCPD structure.

[0109]Put the 25g phenolic resin containing the TCPD structure obtained in the previous step into a four-necked flask, then weigh 100g epichlorohydrin and add slowly, after it dissolves, start to heat up, and add 1mol of mass fraction in the dropping funnel to be 33% NaOH solution, control the speed so that it can ...

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Abstract

The invention relates to an epoxy resin containing a TCPD structure, an epoxy resin composition, a prepreg, a laminated board and a printing circuit board. The laminated board manufactured by the epoxy resin containing the TCPD structure or the epoxy resin composition has the advantages of high glass-transition temperature, high thermal decomposition temperature, low thermal expansion coefficients, low dielectric constant, low dielectric loss factors, and low water absorption rate.

Description

technical field [0001] The invention belongs to the technical field of laminated boards, and relates to an epoxy resin containing a TCPD structure, an epoxy resin composition and prepregs, laminated boards and printed circuit boards using the same. Background technique [0002] In recent years, with the development of high-performance, high-functionality and networking of information and communication equipment, in order to transmit and process large-capacity information at high speed, the operation signal tends to be high-frequency. At the same time, in order to meet the development trend requirements of various electronic products , the circuit board is developing towards the direction of high multi-layer and high wiring density, which requires the substrate material not only to have good dielectric constant and dielectric loss factor to meet the needs of high-frequency signal transmission, but also to have good heat resistance to Meet the needs of multilayer printed circu...

Claims

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Application Information

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IPC IPC(8): C08G59/08C08L63/04C08L79/04B32B15/14B32B17/04B32B17/06B32B5/26
CPCB32B5/26B32B15/14B32B2260/021B32B2260/046B32B2262/02B32B2262/06B32B2262/10B32B2262/101B32B2307/306B32B2307/7265B32B2457/08C08G59/08C08K2201/003C08L63/04C08L79/04C08L2201/02C08L2201/08
Inventor 何烈相曾宪平许永静
Owner GUANGDONG SHENGYI SCI TECH
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