Outer plugging resin and preparation method thereof

Abstract

The invention provides an outer plugging resin. The outer plugging resin comprises, by weight, 30 to 60 parts of modified epoxy resin, 40 to 60 parts of a filler, 1 to 10 parts of a curing agent, 0.5to 2 parts of an accelerator, 0.05 to 0.2 parts of a defoaming agent, 0.05 to 0.2 parts of a coupling agent and 0.5 to 2 parts of an antioxidant. The modified epoxy resin is 4-benzamido-2-hydroxybenzoic acid-modified tetrabromobisphenol A type epoxy resin.

Description

technical field [0001] The invention relates to the technical field of resin, in particular, the invention relates to an outer layer plugging resin and a preparation method thereof. Background technique [0002] In the early 1990s, Japan and the United States pioneered the application of High Density Interconnect Technology (High Density Interconnect Technology, HDI), which introduced blind buried holes and fine line width and line spacing in conventional PCBs, so that it can manufacture Thin, multi-layer, stable, high-density interconnection, high-definition, high-reliability and low-cost PCBs that cannot be realized by conventional multi-layer board technology adapt to electronic products that are lighter, smaller, thinner, and more reliable. The requirements for higher direction development meet the needs of the new generation of electronic packaging technology to continuously improve the packaging density. High-speed interconnection is one of the common goals pursued by...

AI Technical Summary

Problems solved by technology

But these characteristics make further processing or metal plating on such boards difficult

[0003] At present, the plugging resin has the following problems: (1) There are a large number of holes in the type of plugging holes that require resin, and the distribution of hole diameter types in the same drawing number / layer is scattered, and 0.1mm to 1.0mm may exist, which is prone to uneven plugging and lead to The problem of unclean grinding. The specific performance is that the surface of the board is uneven or the overall amount of oil is large; (2) When the grinding plate is not clean, it generally needs to be regrinded 1 to 3 times, and in severe cases, it needs to be regrinded more than 4 times (In addition, there are as many times as normal grinding boards); (3) After the number of grinding boards increases, the following problems will occur: affecting the production capacity of grinding boards, board deformation and hidden dangers of insufficient copper thickness; (4) For boards with a thickness greater than 2.0mm or more For the type with a ratio > 8, the plug hole is prone to serious blind hole depression and incompleteness

[0004] In addition, the dielectric constant of the common resin used for plugging is low, so that the dielectric constant of the plugging resin is also low, and the insulation of the plugging resin is also poor.

As the flexible printed circuit board continues to become thinner, the plug hole resin with poor insulation is easy to form a path between the two circuit layers of the circuit board that do not need to be connected, so that it is easy to electrically connect the electronic components that do not need to be electrically connected, thereby affecting to the normal operation of each electronic component on the circuit board

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