Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Outer plugging resin and preparation method thereof

A technology of plug hole and resin, which is applied in the field of resin, can solve the problems of affecting the production capacity of the grinding plate, the grinding is not clean, the copper thickness of the plate is deformed, etc.

Active Publication Date: 2018-12-18
广东科鼎新材料股份有限公司
View PDF4 Cites 6 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But these characteristics make further processing or metal plating on such boards difficult
[0003] At present, the plugging resin has the following problems: (1) There are a large number of holes in the type of plugging holes that require resin, and the distribution of hole diameter types in the same drawing number / layer is scattered, and 0.1mm to 1.0mm may exist, which is prone to uneven plugging and lead to The problem of unclean grinding. The specific performance is that the surface of the board is uneven or the overall amount of oil is large; (2) When the grinding plate is not clean, it generally needs to be regrinded 1 to 3 times, and in severe cases, it needs to be regrinded more than 4 times (In addition, there are as many times as normal grinding boards); (3) After the number of grinding boards increases, the following problems will occur: affecting the production capacity of grinding boards, board deformation and hidden dangers of insufficient copper thickness; (4) For boards with a thickness greater than 2.0mm or more For the type with a ratio > 8, the plug hole is prone to serious blind hole depression and incompleteness
[0004] In addition, the dielectric constant of the common resin used for plugging is low, so that the dielectric constant of the plugging resin is also low, and the insulation of the plugging resin is also poor.
As the flexible printed circuit board continues to become thinner, the plug hole resin with poor insulation is easy to form a path between the two circuit layers of the circuit board that do not need to be connected, so that it is easy to electrically connect the electronic components that do not need to be electrically connected, thereby affecting to the normal operation of each electronic component on the circuit board

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Outer plugging resin and preparation method thereof
  • Outer plugging resin and preparation method thereof
  • Outer plugging resin and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0031] The preparation steps of described modified epoxy resin are as follows:

[0032] (1) preparation of tetrabromobisphenol A type epoxy resin:

[0033] Add tetrabromobisphenol A, epichlorohydrin, and 80% isopropanol aqueous solution into the reactor, under nitrogen protection, stir until completely dissolved, then add dropwise 50% sodium hydroxide aqueous solution, The temperature is raised to 55°C, and the heat preservation reaction is carried out for 1 hour. The weight ratio is 1: 1.3: 3: 0.002; the temperature is raised to 65°C, and an aqueous sodium hydroxide solution with a mass fraction of 50% is added dropwise, and the heat preservation reaction is carried out for 1 hour. The tetrabromobisphenol A and the hydrogen with a mass fraction of 50% are The weight ratio of the sodium oxide aqueous solution is 1:0.002; the temperature is raised to 75° C., and the sodium hydroxide aqueous solution with a mass fraction of 50% is added dropwise, and the heat preservation react...

Embodiment 1

[0067] Calculated in parts by weight, the outer layer plugging resin includes:

[0068]

[0069] Wherein, the modified epoxy resin is 4-benzamide-2-hydroxybenzoic acid modified tetrabromobisphenol A type epoxy resin; the filler is modified talcum powder, modified carbon nanotube, modified nano Calcium carbonate, the weight ratio of the modified talcum powder to the modified carbon nanotubes and the modified nano-calcium carbonate is 1:2.4:0.8; the curing agent is a latent curing agent, and the latent curing The agent is diaminodiphenylmethane; the accelerator is 2-ethylimidazole; the defoamer is polydimethylsiloxane; the coupling agent is KH560; the antioxidant is 3- Hydroxy-3-methyl-2-butanone oxime;

[0070] The preparation method of the outer layer plugging resin comprises the following steps:

[0071] Put the modified epoxy resin, filler, curing agent, accelerator, defoamer, coupling agent, and antioxidant in a disperser and stir for 1 hour in parts by weight, mix eve...

Embodiment 2

[0077] Calculated in parts by weight, the outer layer plugging resin includes:

[0078]

[0079]Wherein, the modified epoxy resin is 4-benzamide-2-hydroxybenzoic acid modified tetrabromobisphenol A type epoxy resin; the filler is modified talcum powder, modified carbon nanotube, modified nano Calcium carbonate, the weight ratio of the modified talcum powder to the modified carbon nanotubes and the modified nano-calcium carbonate is 1:2.4:0.8; the curing agent is a latent curing agent, and the latent curing The agent is diaminodiphenylmethane; the accelerator is 2-ethylimidazole; the defoamer is polydimethylsiloxane; the coupling agent is KH560; the antioxidant is 3- Hydroxy-3-methyl-2-butanone oxime;

[0080] The preparation method of the outer layer plugging resin and the preparation steps of the modified epoxy resin are the same as in Example 1.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
particle diameteraaaaaaaaaa
particle diameteraaaaaaaaaa
Login to View More

Abstract

The invention provides an outer plugging resin. The outer plugging resin comprises, by weight, 30 to 60 parts of modified epoxy resin, 40 to 60 parts of a filler, 1 to 10 parts of a curing agent, 0.5to 2 parts of an accelerator, 0.05 to 0.2 parts of a defoaming agent, 0.05 to 0.2 parts of a coupling agent and 0.5 to 2 parts of an antioxidant. The modified epoxy resin is 4-benzamido-2-hydroxybenzoic acid-modified tetrabromobisphenol A type epoxy resin.

Description

technical field [0001] The invention relates to the technical field of resin, in particular, the invention relates to an outer layer plugging resin and a preparation method thereof. Background technique [0002] In the early 1990s, Japan and the United States pioneered the application of High Density Interconnect Technology (High Density Interconnect Technology, HDI), which introduced blind buried holes and fine line width and line spacing in conventional PCBs, so that it can manufacture Thin, multi-layer, stable, high-density interconnection, high-definition, high-reliability and low-cost PCBs that cannot be realized by conventional multi-layer board technology adapt to electronic products that are lighter, smaller, thinner, and more reliable. The requirements for higher direction development meet the needs of the new generation of electronic packaging technology to continuously improve the packaging density. High-speed interconnection is one of the common goals pursued by...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L83/04C08K3/34C08K3/04C08K3/26
CPCC08K2003/265C08K2201/011C08L63/00C08L83/04C08K3/34C08K3/041C08K3/26
Inventor 聂雪峰
Owner 广东科鼎新材料股份有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com