A kind of neurosynaptic device based on a-tsc:o ceramic film and its preparation method
A technology of ceramic thin film and neural synapse, which is applied in the direction of electrical components, can solve the problems of research reports on the application of optoelectronics field, and achieve the effect of large-scale production, good resistive properties, and simple preparation process
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[0031] This embodiment provides a neurosynaptic device, such as figure 1 As shown, its structure from bottom to top is "ITO slide 1, high oxidation a-TSC:O film 2, low oxidation a-TSC:O film 3, a-TSC film 4" vertical four-layer structure, "high Oxygenated / low-oxidized a-TSC:O thin film 3" double-layer structure serves as a double barrier layer (i.e., the dielectric layer of a synaptic device).
[0032] This embodiment provides a method for preparing the above-mentioned synaptic device, and the preparation process includes the following steps:
[0033] Step A: prepare the ITO glass slide 1 as a transparent substrate with a bottom electrode, and perform cleaning and drying according to a standard process;
[0034] Step B: Using Ti 3 SiC 2 Polycrystalline powder is used as the raw material target, oxygen and argon are used as the working gas, and the ratio of oxygen and argon is 4:75, and a-TSC:O thin film 2 is deposited on the ITO glass slide 1 by reactive radio frequency spu...
Embodiment 2
[0058] This embodiment provides a method for preparing a synapse device, and the preparation process includes the following steps:
[0059] Step A: Prepare a K9 glass substrate as a transparent substrate, and perform cleaning and drying according to standard processes; then deposit an ITO film on it as a bottom electrode;
[0060] Step B: Using Ti 3 SiC 2 Polycrystalline powder is used as the raw material target, oxygen and argon are used as the working gas, and the ratio of oxygen and argon is 4:75, and a-TSC:O thin film 2 is deposited on the ITO glass slide 1 by reactive radio frequency sputtering as the first resistive layer , the specific operation is as follows:
[0061] B1: Target preparation:
[0062] Ti 3 SiC 2 Add the powder into deionized water and stir evenly to obtain Ti 3 SiC 2 dispersion, and then the Ti 3 SiC 2 Put the dispersion liquid into an aluminum tray with a diameter of 90 mm and a thickness of 3 to 4 mm, and then put the aluminum tray in a vacuu...
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