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Solvent-free ultraviolet light dual-curing hot melting pressure-sensitive adhesive

A hot-melt pressure-sensitive adhesive, dual-curing technology, used in pressure-sensitive films/sheets, monocarboxylate copolymer adhesives, adhesives, etc. Coating practicality and other issues

Active Publication Date: 2019-01-01
SHENZHEN GUANGYE ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the cationic UV curing process is greatly affected by the humidity in the air, and the degree of curing is difficult to control.
Especially when the humidity in the air is relatively high, the product is difficult to cure effectively, resulting in very low holding power
In addition, acrylate copolymers containing epoxy functional groups may be pre-reacted and crosslinked under high temperature conditions, which limits the practicability of high temperature hot melt coating

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] Preparation of free-radically UV-curable (meth)acrylate copolymers:

[0029] Weigh 350 g of ethyl acetate, 200 g of propylene isooctyl, 150 g of methyl acrylate, 0.5 g of VAZO 64, and 3 g of 4-methacryloxybenzophenone into a 2-liter four-neck glass flask . The glass reaction flask was equipped with a stirrer, water-cooled condenser and nitrogen inlet and a temperature probe mounted in the flask. Heat slowly until the caprolactone temperature in the flask reaches 80°C. The temperature was maintained at 80 °C under continuous stirring and nitrogen protection. A monomer containing 350 g of ethyl acetate, 200 g of propylene isooctyl, 150 g of methyl acrylate, 0.9 g of VAZO64, and 3 g of 4-methacryloxybenzophenone was then slowly dropped over 2 hours. mixture. The temperature in the flask was kept constant at 80°C during the dropwise addition. After the monomer addition was completed, the polymerization reaction was continued at 80° C. for 8 hours. Then the temperature...

Embodiment 2

[0031] Preparation of cationic UV-curable (meth)acrylate copolymers:

[0032]Weigh 350 g of ethyl acetate, 200 g of propylene isooctyl, 150 g of methyl acrylate, 0.5 g of VAZO 64, and 3 g of Cyclomer M100, and add them into a 2-liter four-neck glass flask. The glass reaction flask was equipped with a stirrer, water-cooled condenser and nitrogen inlet and a temperature probe mounted in the flask. Heat slowly until the caprolactone temperature in the flask reaches 80°C. The temperature was maintained at 80 °C under continuous stirring and nitrogen protection. A monomer mixture containing 350 g of ethyl acetate, 200 g of propylene isooctyl, 150 g of methyl acrylate, 0.9 g of VAZO64, and 3 g of Cyclomer M100 was then slowly dropped over 2 hours. The temperature in the flask was kept constant at 80°C during the dropwise addition. After the monomer addition was completed, the polymerization reaction was continued at 80° C. for 8 hours. Then add 1.5 grams of cationic photoinitiat...

Embodiment 3

[0034] Preparation of solvent-free UV dual-cure hot-melt pressure-sensitive adhesive:

[0035] 200 grams of radical UV-curable (meth)acrylate copolymer and 200 grams of cationic UV-curable (meth)acrylate copolymer were added to a 1 liter four-neck glass flask. The glass reaction flask was equipped with a stirrer, water-cooled condenser, nitrogen inlet, and a temperature probe mounted in the flask. After stirring for 1 hour at 130 degrees under the protection of nitrogen, a solvent-free hot-melt pressure-sensitive adhesive that can be dual-cured by ultraviolet light is prepared. The hot-melt pressure-sensitive adhesive product contains no more than 0.5% volatile matter, and the viscosity of the hot-melt adhesive at 130 degrees is 45,000 cps.

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PUM

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Abstract

The invention relates to solvent-free ultraviolet light dual-curing hot melting pressure-sensitive adhesive, which is prepared from acid-free (methyl) acrylate copolymer (A) capable of being subjectedto ultraviolet light curing by a free radical, acid-free (methyl) acrylate copolymer (B) capable of being subjected to ultraviolet light curing by a positive ion and a positive ion photoinitiator (C)which occupies 0.1-1.0% of the mass of the composite, and the ratio of a monomer A to a monomer B in the composite can be regulated at will. The pressure-sensitive adhesive formula prepared from thecomposite is subjected to the ultraviolet light curing, a peculiar high molecule interpenetrating network structure is formed, and the bonding strength and the permanent adhesion of the pressure-sensitive adhesive can be effectively improved.

Description

technical field [0001] The invention relates to a UV-curable solvent-free pressure-sensitive adhesive, in particular to an acid-free (meth)acrylate copolymer that can be cured by radical UV light and an acid-free (meth)acrylate copolymer that can be cured by cationic UV light. ) Compositions of acrylate copolymers. Background technique [0002] Ordinary hot-melt pressure-sensitive adhesives are physical blends of thermoplastic elastomers, tackifying resins, plasticizers and antioxidants as the main components. Among them, thermoplastic elastomer mainly refers to block copolymers such as SIS, SBS, SEBS, etc., tackifying resin mainly refers to rosin resin, C5 petroleum resin, C9 petroleum resin, C5 and C9 copolymerized petroleum resin, and plasticizer mainly includes naphthenic oil , white oil and low molecular weight liquid resin, etc. Compared with solvent-based pressure-sensitive adhesives and emulsion-type pressure-sensitive adhesives, there is no solvent and VOC emissio...

Claims

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Application Information

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IPC IPC(8): C09J131/04C09J7/25C09J7/38C08F218/08C08F220/18C08F220/14C08F220/30
CPCC08F218/08C09J131/04C09J2431/00C09J2467/006C09J7/255C09J7/381C09J2301/302C09J2301/304C09J2301/414C08F220/1808C08F220/14C08F220/301
Inventor 不公告发明人
Owner SHENZHEN GUANGYE ELECTRONICS TECH
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