Quantum dot-doped functional boron nitride polymeric heat conducting compound film and preparation method thereof

A thermally conductive composite, boron nitride technology, applied in chemical instruments and methods, heat exchange materials, etc., can solve the problems of limited production application, complex preparation process, insufficient mechanical properties, etc., to reduce agglomeration phenomenon, reasonable process, excellent The effect of mechanical properties

Active Publication Date: 2019-01-11
SHANGHAI UNIV
View PDF13 Cites 10 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the preparation process of this method is relatively complicated, involving a variety of raw materials, and there

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] The doped quantum dot functionalized boron nitride polymer heat-conducting composite film provided in this embodiment, the heat-conducting composite film includes the following components in weight percentage:

[0027] Boron nitride quantum dots 1~5wt%,

[0028] Functionalized boron nitride 5~50wt%,

[0029] Polymer matrix 50-95wt%;

[0030] The sum of the weight percentages of the above components is 100wt%

[0031] The doped quantum dot functionalized boron nitride polymer heat conduction composite film, the particle size of the functionalized boron nitride is 50-200nm, and the particle size of the boron nitride quantum dot is 2-50nm.

[0032] Doped with quantum dots functionalized boron nitride polymer heat conduction composite film, the polymer matrix is ​​one or more of polyimide, polyvinyl alcohol, polypropylene, polyamide, polyethylene, polycarbonate mixed.

[0033] The preparation method of the doped quantum dot functionalized boron nitride polymer heat-condu...

Embodiment 2

[0042] The doped quantum dot functionalized boron nitride polymer heat-conducting composite film provided in this embodiment is basically the same as in Example 1, except that the mass fraction of boron nitride quantum dots in the composite film is 1%. The mass fraction of functionalized boron nitride nanosheets is 5%, and the mass fraction of polyimide is 94%.

[0043] The preparation method of the doped quantum dot functionalized boron nitride polymer heat-conducting composite film in this embodiment includes the following steps:

[0044] (1) Preparation of functionalized boron nitride: h-BN and urea are sand-milled according to a mass ratio of 1:20, and ground for 2 hours; after filtration, the resulting boron nitride powder is dispersed into 100ml of dimethylformamide ( DMF), ultrasonically dispersed for 10 hours to obtain a boron nitride nanosheet dispersion; finally, the boron nitride nanosheet dispersion was subjected to solvothermal reaction at 100°C for 24 hours, and ...

Embodiment 3

[0051] The doped quantum dot functionalized boron nitride polymer heat-conducting composite film provided in this embodiment is basically the same as that of Examples 1 and 2, except that the quality of the boron nitride quantum dots of the composite film in this embodiment The fraction is 3%, the mass fraction of functionalized boron nitride nanosheets is 5%, and the mass fraction of polyimide is 92%.

[0052] Its preparation method comprises the following steps:

[0053] (1) Preparation of functionalized boron nitride: h-BN and urea are sand-milled according to a mass ratio of 1:20, and ground for 10 h; after filtration, the boron nitride powder obtained is dispersed into 100 ml of dimethylformamide ( DMF), ultrasonically dispersed for 24 hours to obtain a boron nitride nanosheet dispersion; finally, the boron nitride nanosheet dispersion was subjected to solvothermal reaction at 200°C for 12 hours, and the lower layer dispersion was the functionalized boron nitride dispersi...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
Particle sizeaaaaaaaaaa
Particle sizeaaaaaaaaaa
Thermal conductivityaaaaaaaaaa
Login to view more

Abstract

The invention discloses a quantum dot-doped functional boron nitride polymeric heat conducting compound film which is prepared from the following components in percent by weight: 1-5wt% of boron nitride quantum dots, 5-50wt% of functional boron nitride and 50-95wt% of a polymeric matrix. The invention also discloses a preparation method of the quantum dot-doped functional boron nitride polymeric heat conducting compound film. The preparation method of the quantum dot-doped functional boron nitride polymeric heat conducting compound film is reasonable in process, mild in reaction condition, favorable in production control and popularization and easy for industrial production. According to the prepared compound film, the functional boron nitride reduces the surface polarity of a nanosheet, so that the aggregation phenomenon of boron nitride is reduced. The boron nitride quantum dots are taken as filling particles among the boron nitride sheets, so that the sheets are linked more compactly, an integral efficient heat conducting network is formed by means of the boron nitride polymeric compound material, and the heat conducting property of the compound material is improved. The compound film has excellent mechanical properties, certain transparency and bending resistance.

Description

technical field [0001] The invention belongs to the field of heat-conducting composite materials, and in particular relates to a doped quantum dot functionalized boron nitride polymer heat-conducting composite film and a preparation method thereof. Background technique [0002] With the rapid development of electronic equipment towards miniaturization, high integration and high power, the strong heat generated by components will cause problems such as thermal failure, performance degradation, and shortened lifespan. The heat dissipation problem is becoming more and more serious. Polymer materials such as polyimide, polyvinyl alcohol, polypropylene, polyamide, polyethylene, polycarbonate, etc. have more excellent functions than traditional thermal conductive materials, such as high strength, light weight, easy processing, corrosion resistance, Good electrical insulation, etc., has received great attention. However, the thermal conductivity of polymer materials is generally ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): C08L79/08C08L29/04C08L23/12C08L77/00C08L23/06C08L69/00C08K3/38C08K9/04C08K7/00C08J5/18C09K5/14
CPCC08J5/18C08J2323/06C08J2323/12C08J2329/04C08J2369/00C08J2377/00C08J2379/08C08K7/00C08K9/04C08K2003/385C08K2201/011C09K5/14
Inventor 丁鹏周帅帅宋娜施利毅
Owner SHANGHAI UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap