Quantum dot-doped functional boron nitride polymeric heat conducting compound film and preparation method thereof

Abstract

The invention discloses a quantum dot-doped functional boron nitride polymeric heat conducting compound film which is prepared from the following components in percent by weight: 1-5wt% of boron nitride quantum dots, 5-50wt% of functional boron nitride and 50-95wt% of a polymeric matrix. The invention also discloses a preparation method of the quantum dot-doped functional boron nitride polymeric heat conducting compound film. The preparation method of the quantum dot-doped functional boron nitride polymeric heat conducting compound film is reasonable in process, mild in reaction condition, favorable in production control and popularization and easy for industrial production. According to the prepared compound film, the functional boron nitride reduces the surface polarity of a nanosheet, so that the aggregation phenomenon of boron nitride is reduced. The boron nitride quantum dots are taken as filling particles among the boron nitride sheets, so that the sheets are linked more compactly, an integral efficient heat conducting network is formed by means of the boron nitride polymeric compound material, and the heat conducting property of the compound material is improved. The compound film has excellent mechanical properties, certain transparency and bending resistance.

Description

technical field [0001] The invention belongs to the field of heat-conducting composite materials, and in particular relates to a doped quantum dot functionalized boron nitride polymer heat-conducting composite film and a preparation method thereof. Background technique [0002] With the rapid development of electronic equipment towards miniaturization, high integration and high power, the strong heat generated by components will cause problems such as thermal failure, performance degradation, and shortened lifespan. The heat dissipation problem is becoming more and more serious. Polymer materials such as polyimide, polyvinyl alcohol, polypropylene, polyamide, polyethylene, polycarbonate, etc. have more excellent functions than traditional thermal conductive materials, such as high strength, light weight, easy processing, corrosion resistance, Good electrical insulation, etc., has received great attention. However, the thermal conductivity of polymer materials is generally ...

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Problems solved by technology

However, the preparation process of this method is relatively complicated, involving a variety of raw materials, and there is no matrix material that is slightly insufficient in mechanical properties, which limits its production and application.