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Copper foil chromium-free passivation solution and preparation method thereof

A chromium-free passivation and copper foil technology, applied in the field of materials, can solve the problems of increasing process complexity, polluting the environment, carcinogenicity, etc., and achieve better oxidation resistance, strong hydrophilicity, and reduced internal resistance.

Inactive Publication Date: 2019-01-11
苏州吉之美新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This approach increases the complexity of the process
[0005] In addition, the traditional chromate passivation solution contains heavy metal hexavalent chromium. Because hexavalent chromium causes cancer and pollutes the environment, it has been clearly stipulated by EU RoHS that the content of hexavalent chromium should not exceed 0.1%. China has also issued corresponding supporting instructions.

Method used

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  • Copper foil chromium-free passivation solution and preparation method thereof
  • Copper foil chromium-free passivation solution and preparation method thereof
  • Copper foil chromium-free passivation solution and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0029] This embodiment provides a copper foil chromium-free passivation solution, in parts by weight, the raw material components of the copper foil chromium-free passivation solution include:

[0030] Silane coupling agent: 2.8 parts of γ-mercaptopropyltrimethoxysilane, 2.8 parts of 3-(2,3-epoxypropoxy)propyltriethoxysilane),

[0031]

[0032] The copper foil chromium-free passivation solution of the present embodiment is prepared by the following preparation method:

[0033] Mixing a silane coupling agent, an organic solvent and part of water (20 parts) to obtain a first solution;

[0034] Mixing the vanadium compound, the rest of the water, and the silica sol to obtain a second solution;

[0035] The first solution and the second solution were mixed, and the pH value was adjusted to 4.8 with glacial acetic acid to obtain a chromium-free passivation solution for copper foil.

Embodiment 2

[0037] This embodiment provides a copper foil chromium-free passivation solution, in parts by weight, the raw material components of the copper foil chromium-free passivation solution include:

[0038] Silane coupling agent: 1 part of γ-mercaptopropyltriethoxysilane or 1.5 parts of 2-(3,4-epoxycyclohexyl) ethyltrimethoxysilane,

[0039]

[0040] The copper foil chromium-free passivation solution of the present embodiment is prepared by the following preparation method:

[0041] Mixing a silane coupling agent, an organic solvent and part of water (6 parts) to obtain a first solution;

[0042] Mixing the vanadium compound, the rest of the water, and the silica sol to obtain a second solution;

[0043] The first solution and the second solution were mixed, and the pH value was adjusted to 4.8 with glacial acetic acid to obtain a chromium-free passivation solution for copper foil.

Embodiment 3

[0045] This embodiment provides a copper foil chromium-free passivation solution, in parts by weight, the raw material components of the copper foil chromium-free passivation solution include:

[0046] Silane coupling agent: 7 parts of γ-mercaptopropylmethyldimethoxysilane and 8 parts of 3-(2,3-epoxypropoxy)propylmethyldiethoxysilane,

[0047]

[0048] The copper foil chromium-free passivation solution of the present embodiment is prepared by the following preparation method:

[0049] Mixing a silane coupling agent, an organic solvent and part of water (20 parts) to obtain a first solution;

[0050] Mixing the vanadium compound, the rest of the water, and the silica sol to obtain a second solution;

[0051] The first solution and the second solution were mixed, and the pH value was adjusted to 4.8 with glacial acetic acid to obtain a chromium-free passivation solution for copper foil.

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Abstract

The invention provides a copper foil chromium-free passivation solution. The copper foil chromium-free passivation solution comprises the following raw materials of, in parts by weight, 1.5-15 parts of a silane coupling agent, 0.05-0.5 part of a vanadium compound, 0-15 parts of a silica sol, 25-75 parts of an organic solvent, and 5-40 parts of water. The invention further provides a preparation method of the copper foil chromium-free passivation solution. According to the copper foil chromium-free passivation solution and preparation method thereof, compared with a traditional chromate passivation technology, the copper foil chromium-free passivation solution is better in oxidation resistance; the conductivity of the copper foil negative current collector is not influenced, the internal resistance is reduced, the battery capacity is improved; the passivation film is high in hydrophilicity and can be removed, and the manufacturing of the circuit board is not affected; due to the fact that no heavy metal hexavalent chromium is contained, so that no toxic and harmful substances are discharged, and European union ROHS instructions are met; the preparation and passivation processes aresimple, the operability is high, and the method is green and non-toxic.

Description

technical field [0001] The invention relates to a chromium-free passivation solution for copper foil and a preparation method thereof, belonging to the technical field of materials. Background technique [0002] At present, during the transportation, storage and production operation of the negative electrode copper foil collector in the lithium-ion battery, due to the pollution of external water vapor, dust, oxidation, and even fingerprints, the surface of the copper foil will be oxidized and discolored, which not only affects The appearance of copper foil, more importantly, affects the performance of the battery, such as increasing the internal resistance, affecting the conductivity; reducing the mechanical properties of the negative electrode material. [0003] In the production process of printed circuit boards, the surface of copper foil is easily oxidized to form discoloration spots, which will affect the solderability of the copper surface, affinity with ink, and adhes...

Claims

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Application Information

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IPC IPC(8): C23C22/52
CPCC23C22/52C23C2222/20
Inventor 范素华周自强
Owner 苏州吉之美新材料有限公司
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