Ge/GeSn heterojunction laser and preparation method thereof
A laser and heterojunction technology, applied in lasers, laser parts, semiconductor lasers, etc., can solve the problems of many high-reflection coating layers, difficult process, easy to fall off, etc., to improve the limiting factor, simple process, Loss factor reduction effect
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Embodiment 1
[0048] In order to solve the problem that the luminous efficiency of the traditional Ge-based laser is not high, the threshold current density is relatively large, and its preparation process is difficult, this embodiment provides a method for preparing a Ge / GeSn heterojunction laser and the Ge / GeSn heterojunction laser prepared by this method. GeSn heterojunction lasers.
[0049] See figure 1 and figure 2 , figure 1 It is a schematic cross-sectional view of a Ge / GeSn heterojunction laser of the present invention, figure 2 It is a schematic top view of the Ge / GeSn heterojunction laser of the present invention. The Ge / GeSn heterojunction laser structure of the present invention is as follows from bottom to top: substrate 1, first Bragg mirror layer 2, first n-type Ge layer 3, second n-type Ge layer 4, GeSn layer 5, The first p-type Ge layer 6, the second p-type Ge layer 7, the second Bragg mirror layer 8; the second Bragg mirror layer 8 is columnar, the first n-type Ge la...
Embodiment 2
[0085] See 4(a) to 4(h), and figure 1 In this embodiment, on the basis of the above-mentioned embodiments, the preparation method of the Ge / GeSn heterojunction laser and the prepared Ge / GeSn heterojunction laser of the present invention are described in detail as follows:
[0086] Step (1), please refer to Fig. 4 (a), select the silicon material on the insulator or the bulk silicon material as the substrate, usually the substrate 1 is rectangular, and use plasma enhanced chemical vapor deposition (PECVD) to grow the first Si / SiO 2 film layer.
[0087] The switch of the mass flowmeter is controlled by the computer, so that the reaction gas in the reaction chamber alternates in the SiH 4 (+Ar) and O 2 Exchange between, so that the decomposition of SiH 4 Deposition of polysilicon film and pure oxygen layer-by-layer plasma oxidation are carried out alternately.
[0088] The substrate 1 temperature was kept at 250°C, Si and SiO 2 The thicknesses are 143nm and 233nm respectiv...
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