Epoxy resin composite insulating material and preparation method thereof

A technology of epoxy resin and composite insulation, which is applied in the field of electrical insulation and composite materials, and can solve problems such as difficulty in detection and repair of epoxy resin insulation materials, decline in insulation performance, and power outages

Inactive Publication Date: 2019-02-01
CHONGQING UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, in the actual operating environment, epoxy resin insulating materials are affected by various factors such as electricity, humidity, heat, machinery and chemistry for a long time, and the material ages, resulting in physical defects such as water branches or electric branches. Physical damage such as scratches and cracks generated during the operation will also distort the electric field, cause tree branch discharge and ot

Method used

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  • Epoxy resin composite insulating material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] 1. Preparation of UF / DCPD microcapsules

[0035] After dissolving 1 part of urea with 8 parts of deionized water, add 2.3 parts of 37% formaldehyde solution, adjust the pH to 8.5 with triethanolamine, and keep it under 400rpm magnetic stirring at 70°C for 1h, then cool to room temperature to obtain Aqueous solution A of urea-formaldehyde resin prepolymer with transparent color and certain viscosity.

[0036] Under the conditions of 40°C water bath and 400rpm mechanical stirring, mix 0.5 parts of sodium dodecylbenzenesulfonate emulsifier and 10 parts of molten dicyclopentadiene, add 100 parts of deionized water, and stir for 30 minutes to obtain a stable The core material emulsified solution B.

[0037] Under 380rpm magnetic stirring, 20 parts by weight of solution A was added dropwise to 110.5 parts by weight of emulsion B prepared above, and 3 parts of urea-formaldehyde resin curing agent ammonium chloride and 5 parts of urea-formaldehyde were added After mixing the ...

Embodiment 2

[0043] 1. Preparation of UF / DCPD microcapsules

[0044] Dissolve 1 part of urea with 8 parts of deionized water, add 2 parts of 37% formaldehyde solution, adjust the pH to 9 with triethanolamine, and keep it under 400rpm magnetic stirring at 70°C for 1h, then cool to room temperature to obtain a colorless Transparent and viscous urea-formaldehyde resin prepolymer aqueous solution A.

[0045] Under the conditions of 40°C water bath and 450rpm mechanical stirring, mix 0.5 parts of sodium dodecylbenzenesulfonate emulsifier and 10 parts of molten dicyclopentadiene, add 100 parts of deionized water, and stir for 30 minutes to obtain a stable The core material emulsified solution B.

[0046] Under 400rpm magnetic stirring, 20 parts by weight of solution A was added dropwise to 110.5 parts by weight of emulsion B prepared above, and 3 parts of urea-formaldehyde resin curing agent ammonium chloride and 5 parts of urea-formaldehyde were added After the resin water resistance modifier...

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Abstract

The invention provides an epoxy resin composite insulating material and a preparation method thereof. The epoxy resin composite insulating material is formed by preparing microcapsules, a ruthenium carbene complex catalyst, and a component including at least a bisphenol A type epoxy resin, a first curing agent, a curing accelerator, and a toughening agent. The microcapsules are formed by preparinga urea-formaldehyde resin performed polymer composition and a core material composition in the presence of a second curing agent and a modifier, the urea-formaldehyde resin performed polymer composition is formed by stirring and heating urea, formaldehyde and deionized water under alkaline conditions, and the core material composition is formed by stirring an emulsifier, dicyclopentadiene and deionized water under heating condition. The epoxy resin composite insulating material has the ability to self-repair when damaged.

Description

technical field [0001] The invention belongs to the technical field of electrical insulation and composite materials, in particular to an epoxy resin composite insulation material and a preparation method thereof. Background technique [0002] Epoxy resin materials have high dielectric strength, stable chemical properties, and excellent weather resistance. They have been used in the field of electrical insulation since the late 1940s, especially in electrical equipment as packaging and casting materials. [0003] However, in the actual operating environment, epoxy resin insulating materials are affected by various factors such as electricity, humidity, heat, machinery and chemistry for a long time, and the material ages, resulting in physical defects such as water branches or electric branches. Physical damage such as scratches and cracks caused by the operation during the process will also distort the electric field and cause tree branch discharge, which will lead to a decr...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08L61/24C08K5/12B01J13/14C08G59/46C08G59/62
CPCB01J13/14C08G59/46C08G59/623C08L63/00C08L61/24C08K5/12
Inventor 王有元李玉栋张占喜陈伟根杜林李剑周湶王飞鹏
Owner CHONGQING UNIV
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