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A method for manufacturing cem‑1 type copper-clad laminate base paper

A manufacturing method, CEM-1 technology, applied in the direction of chemical instruments and methods, lamination, layered products, etc., can solve the problem of poor tracking resistance, peeling resistance, cracking resistance, etc. of copper clad laminate base paper Poor impact performance, no ultraviolet light blocking and other problems, to achieve the effect of improving peel strength, improving glue toughness and reducing curing time

Active Publication Date: 2017-05-24
忠信(太仓)绝缘材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] (1) When not toughened, the cured product is generally brittle, with poor peeling, cracking and impact resistance
[0008] (2) Low adhesion to materials with low polarity (such as polyethylene, polypropylene, fluoroplastics, etc.)
[0009] (3) Some raw materials such as reactive diluents, curing agents, etc. have varying degrees of toxicity and irritation
[0012] However, the high-performance resin-modified epoxy resin used, but due to the presence of a large number of benzene rings, the base paper of the copper-clad laminate has poor tracking resistance.
Moreover, the use of such a modified epoxy resin requires a higher curing temperature when processing the board; in addition, the triazine-modified nitrogen-containing phenolic resin curing agent will react slowly at room temperature, so that the storage period of the adhesive sheet made In addition, the system does not have the function of blocking ultraviolet light

Method used

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  • A method for manufacturing cem‑1 type copper-clad laminate base paper
  • A method for manufacturing cem‑1 type copper-clad laminate base paper
  • A method for manufacturing cem‑1 type copper-clad laminate base paper

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0072] Add tetrabromobisphenol A and epichlorohydrin to the reaction kettle, stir at room temperature for 25 minutes, heat to 60°C, add dropwise 20% NaOH aqueous solution, dropwise addition is completed within 30 minutes, and rise to 70 ℃, react for 2h, add distilled water and toluene, stir to dissolve, separate liquids, and vacuum distill to obtain the brominated bisphenol A epoxy resin;

Embodiment 2

[0074] Add tetrabromobisphenol A and epichlorohydrin to the reaction kettle, stir at room temperature for 30 minutes, heat up to 50°C, add 20% NaOH aqueous solution dropwise, add dropwise within 60 minutes, and increase the temperature to 80 ℃, react for 1.5h, add distilled water and toluene, stir to dissolve, separate liquids, and vacuum distill to obtain the brominated bisphenol A epoxy resin;

Embodiment 3

[0076] Add tetrabromobisphenol A and epichlorohydrin to the reaction kettle, stir at room temperature for 28 minutes, heat up to 60°C, add 20% NaOH aqueous solution dropwise, drop in within 50 minutes, and then rise to 75 ℃, react for 2h, add distilled water and toluene, stir to dissolve, separate liquids, and vacuum distill to obtain the brominated bisphenol A epoxy resin;

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Abstract

The invention provides a manufacturing method for a CEM-1 type copper clad laminate. The method comprises the steps of: 1) preparing a fabric impregnation glue solution; 2) preparing a core material impregnation glue solution; 3) making the fabric; 4) making the core material; 5) stacking the obtained fabric and core material, then covering the stacked several substrates' upper surface with a copper foil, putting a layer of release film under the undersurface, then putting the materials between two stainless steel plates; 6) putting the product into a laminating machine to conduct heating and pressurization treatment, with the temperature being 170-175DEG C and the pressure being 1-2MPa, maintaining the pressure for 10-15min, then taking the product out, and carrying out cutting and inspection, thus obtaining the CEM-1 type copper clad laminate finished product. The method employs specially-made brominated bisphenol A epoxy resin and a plurality of preparations to cooperate to form the flue solution, and through optimized combination of the manufacturing process and manufacturing conditions, twice glue impregnation, and impregnation of two glue solution, the strength of the core material is ensured, and the high temperature resistant and high flame retardant copper clad laminate can be obtained.

Description

Technical field [0001] The invention relates to a method for manufacturing CEM-1 type copper-clad laminated board base paper. Background technique [0002] Copper Clad Laminate (CCL), also known as copper clad laminate base paper, is an electronic fiberglass cloth or other reinforcing material impregnated with resin, one or both sides are covered with copper foil and hot pressed And a kind of plate-shaped material made is called copper clad laminate for short. Various printed circuit boards of different forms and functions are selectively processed, etched, drilled, and copper-plated on the copper clad board to make different printed circuits. The printed circuit board mainly plays the role of interconnection, insulation and support, and has a great impact on the transmission speed, energy loss and characteristic impedance of the signal in the circuit. Therefore, the performance, quality, and manufacturing of the printed circuit board The processability, manufacturing level, ma...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B37/06B32B37/10B32B29/02D06M15/55
CPCB32B29/02B32B37/06B32B37/10B32B2260/021B32B2260/028B32B2260/046B32B2307/306B32B2307/3065B32B2457/08D06M15/55D06M2200/30
Inventor 张国强
Owner 忠信(太仓)绝缘材料有限公司
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