Flexible elastic stress sensing conductive film and preparation method thereof

A stress sensing, conductive film technology, applied in cable/conductor manufacturing, conductive layer on insulating carrier, application of piezoresistive material property force measurement, etc. Dispersion evenly, etc.

Active Publication Date: 2019-02-01
常州市利多合金材料有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

But as far as the current situation is concerned, there are various problems, the most important of which are metal conductive nanomaterials or inorganic non-metallic conductive nanomaterials, such as conductive nanotubes, graphene (nanosheets), and metal nanopowders. Or metal nanowires are difficult to disperse evenly in polymer materials and the loading capacity is small, which cannot meet the needs of broad electrical conductivity in practical use

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  • Flexible elastic stress sensing conductive film and preparation method thereof
  • Flexible elastic stress sensing conductive film and preparation method thereof
  • Flexible elastic stress sensing conductive film and preparation method thereof

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preparation example Construction

[0025] The invention provides a method for preparing a flexible elastic stress sensing conductive film, comprising the following steps:

[0026] 1) carry out surface modification after metal conductive nanoparticles are mixed with a surface modifier to obtain modified metal conductive nanoparticles; the surface modifier includes silane coupling agent, organic acid, organic acid anhydride and organic acid salt one or more;

[0027] 2) The modified metal conductive nanoparticles obtained in the step 1) are mixed with a polymer film-forming material to form a film to obtain a flexible elastic stress-sensing conductive film; the polymer film-forming material includes a film-forming polyurethane elastic body lotions, poly(meth)acrylate or polyimide resins.

[0028] In the present invention, the metal conductive nanoparticles are mixed with a surface modifying agent to perform surface modification to obtain modified metal conductive nanoparticles; the surface modifying agent includ...

Embodiment 1

[0046] Add 10 g of gold particles with a particle size of 5 nm to 20 nm into 2% (w / w) trisodium citrate solution, boil for 30 minutes, and cool at room temperature to obtain a surface-modified gold nano particle solution. The obtained above-mentioned nano-gold particle solution was added to 19.3g cationic polyurethane emulsion (solid content 25%), fully stirred, poured into a casting mold of 10cm×10cm, and after leveling, it was in a vacuum state at 40°C The solvent water is removed, and the conductive film is obtained after drying, and the conductive film is the same size as the mold. The volume fraction of gold nanoparticles in the conductive film is 10%, the conductivity reaches 0.03S / cm, the elongation at break is 35.8%, the conductive film is translucent, and the light transmittance is 75%.

[0047] The conductive film obtained in Example 1 is observed under a scanning electron microscope, and the results are as follows: figure 1 shown. Depend on figure 1 It can be see...

Embodiment 2

[0050] Add 10 g of gold particles with a particle size of 5 nm to 20 nm into 2% (w / w) trisodium citrate solution, boil for 30 minutes, and cool at room temperature to obtain a surface-modified gold nano particle solution. The above-mentioned nano-gold particle solution obtained is added in 2.6g of cationic polyurethane emulsion (solid content 25%), fully stirred, poured into a casting mold of 10cm × 10cm, and after leveling, it is in a vacuum state at 40°C Remove the solvent water and dry to obtain a conductive film with the same size as the mold. The conductive film is soft and elastic. The volume fraction of gold nanoparticles is 45%, the electrical conductivity reaches 1S / cm, the light transmittance is 80%, and the elongation at break was 33.2%.

[0051] The conductive thin film obtained in embodiment 2 is observed under scanning electron microscope, and its result is as follows: image 3 shown. image 3 The middle scale scale is 1 μm.

[0052] Depend on image 3 It can...

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Abstract

The invention provides a preparation method of a flexible elastic stress sensing conductive film and belongs to the technical field of conductive materials. According to the preparation method of theinvention, metal conductive nanoparticles are modified, so that the metal conductive nanoparticles can be uniformly dispersed in a polymer material, and the load capacity of the metal conductive nanoparticles is increased. The film provided by the invention combines the conductivity of the metal conductive nanomaterial and the flexibility of the polymer material; when the film is subjected to tensile and compressive stress, the polymer material is deformed, and therefore, the nano conductive particles move, electron delocalization occurs, and the conductivity of the film changes, and as a result, a piezoresistive effect can be directly measured according to the magnitude of the deformation. In the light of experimental data in the embodiments of the present invention, the load capacity ofthe metal conductive nanoparticles in the polymer material can reach 45%.

Description

technical field [0001] The invention relates to the technical field of conductive materials, in particular to a flexible elastic stress sensing conductive film and a preparation method thereof. Background technique [0002] The stress sensing device can monitor the change of stress / strain in the material and the surrounding environment, which is a key technology to improve the environmental perception ability of the equipment and realize the automatic control of the instrument. Therefore, stress sensors have been widely used in many industrial fields such as railway transportation, intelligent buildings, production automation, aerospace, automobiles and ships. In recent years, the emergence of emerging high-tech industries (humanoid robots, wearable electronic devices, and smart electronic products) and the intelligent development of traditional technology industries (smart manufacturing, smart vehicles, deformable aircraft, and biosensors) have imposed a new generation of s...

Claims

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Application Information

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IPC IPC(8): H01B13/00H01B5/14G01L1/18
CPCG01L1/18H01B5/14H01B13/00
Inventor 王学森王成原王金熠
Owner 常州市利多合金材料有限公司
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