Medical conductive adhesive and preparation method thereof
A conductive adhesive and glue technology, applied in conductive adhesives, adhesives, grafted polymer adhesives, etc., can solve problems such as affecting product performance, insufficient viscosity, shrinkage, etc., to achieve easy operation, transparent and strong viscosity , the effect of good mutual solubility
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Embodiment 1
[0019] A medical conductive adhesive, comprising a basic glue and a thickener in a weight ratio of 10:2; the basic glue includes the following components by weight percentage: 2% acrylic acid; 10% hydroxyethyl acrylate; PEG400 10 %; Glycerin 25%; NaOH1-5%; NaCl 0.1%; N-N'-methylenebisacrylamide 0.1%; .
[0020] The thickener comprises the following components by weight percentage: 17% of acrylic acid; 8% of NaOH; 15% of glycerin; 0.4% of azobisisobutylamidine hydrochloride; 2 S 2 o 8 0.1%;Na 2 SO 3 0.1%; the balance of pure water.
[0021] The preparation method of above-mentioned medical conductive glue, comprises the following steps:
[0022] (1) Preparation of basic glue: add acrylic acid and NaCl to dissolve in pure water to obtain a mixed solution a; then add NaOH to the mixed solution a, cool to room temperature to obtain a neutralized solution a; add acrylic acid hydroxyl to the neutralized solution a in turn Ethyl ester, PEG400, glycerin, N-N'-methylenebisacry...
Embodiment 2
[0026] A medical conductive adhesive, comprising a basic glue and a thickener in a weight ratio of 10:3; the basic glue includes the following components by weight percentage: 25% methacrylic acid; 15% hydroxyethyl acrylate; PEG600 15%; Glycerin 25%; KOH 5%; KCl 0.2%; N-N'-methylenebisacrylamide 0.2%; Benzoin dimethyl ether 0.4%;
[0027] The thickener comprises the following components by weight percentage: 16% of acrylic acid; 15% of NaOH; 20% of glycerin; 0.4% of azobisisobutylamidine hydrochloride; 2 S 2 o 8 0.1%;Na 2 SO 3 0.1%; the balance of pure water.
[0028] The preparation method of above-mentioned medical conductive glue, comprises the following steps:
[0029] (1) Preparation of basic glue: Add methacrylic acid and KCl to dissolve in pure water to obtain a mixed solution a; then add KOH to the mixed solution a, cool to room temperature to obtain a neutralized solution a; add in sequence to the neutralized solution a Hydroxyethyl acrylate, PEG600, glycerin,...
Embodiment 3
[0033] A medical conductive adhesive, comprising a basic glue and a thickener in a weight ratio of 10:3.5; the basic glue comprises the following components by weight percentage: 30% acrylic acid; 20% hydroxypropyl acrylate; PEG600 20%; Glycerin 35%; NaOH 4%; NaCl 0.5%; Trimethylolpropane Trimethacrylate 1%; 2-Hydroxy-2-methyl-1-phenylacetone 0.5%;
[0034] Thickener, including the following components by weight percentage: Acrylic acid 20%; NaOH 15%; Glycerin 25%; Azobisisobutylimidazoline hydrochloride 0.4%; 2 S 2 o 8 0.1%;Na 2 SO 3 0.1%; the balance of pure water.
[0035] The preparation method of above-mentioned medical conductive glue, comprises the following steps:
[0036] (1) Preparation of basic glue: add acrylic acid and NaCl to dissolve in pure water to obtain a mixed solution a; then add NaOH to the mixed solution a, cool to room temperature to obtain a neutralized solution a; add acrylic acid hydroxyl to the neutralized solution a in turn Propyl ester, PE...
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More