Piezoresistive electronic skin having pit structures and preparation method thereof

An electronic skin and piezoresistive technology, applied in the field of sensors, can solve the problems of high cost, unfriendly environment, and long production cycle, and achieve the effects of low cost and energy consumption, excellent stability, and high production efficiency

Active Publication Date: 2019-02-22
SICHUAN UNIV
View PDF11 Cites 7 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, these methods have the following defects: the application and wearable electronic skin needs to use a flexible substrate with a certain deformation ability to adapt to changes such as human body movement, but the electrode layer and the deposited and etched inorganic sensing layer are flexible and elastic. Poor, which reduces the overall flexibility of the electronic skin, limiting its performance and application fields; and for the electronic skin with flexible and elastic electrodes and sensing layers, the flexible and elastic sensing array is generally prepared by the solution template method, which is expensive , the environment is not friendly, the production cycle is long, the yield is low, and continuous large-scale industrial production cannot be realized

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Piezoresistive electronic skin having pit structures and preparation method thereof
  • Piezoresistive electronic skin having pit structures and preparation method thereof
  • Piezoresistive electronic skin having pit structures and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0034] The preparation method of the electronic skin with pit microstructure of the present invention can be carried out in the following embodiments:

[0035] (1) First mix high-density polyethylene (HDPE) with silica microspheres (SiO 2 ) for melt blending to obtain HDPE / SiO 2 Blends; SiO 2 The mass fraction is 40-80wt.%;

[0036] (2) Melt-blending the elastomer and carbon nanotubes (CNT) to obtain the elastomer / CNT blend; the mass fraction of the CNT is 10 to 25wt.%; the steps (1) and (2) used The melt blending temperature is 180-200°C, the mixing speed is 80rpm, and the mixing time is 5-10min;

[0037] (3) Pulverize the blend raw materials prepared in step (1) and step (2) at room temperature to obtain HDPE / SiO with a particle size distribution of 80 to 500 mesh 2 The blend particles and the elastomer / CNT blend particles are dried;

[0038] (4) Use the elastomer / CNT blend particles prepared in step (3) as a single injection raw material for multi-melt multiple injecti...

Embodiment 1

[0044] The electronic skin is prepared by the following steps:

[0045] (1) Firstly high density polyethylene (high density polyethylene, HDPE, trade mark DGDA-6098, produced by China Qilu Petrochemical Company; weight average molecular weight 5.63×10 5 g / mol, number average molecular weight 6.75×10 4 g / mol, melt flow rate (MFR) is 0.09g / 10min (190℃ / 2.16kg, ASTM D1238), density 0.953g / cm 3 ) and silica microspheres (silica powder, SiO 2 , produced by Aladdin in China; real density 2.20g / cm 3 , with an average diameter of 85 μm) were blended in a torque rheometer, and the blending ratio was HDPE / SiO 2 =33.4 / 66.6wt.%, the blending temperature is preferably 200°C, the blending time is 8min, and the mixing speed is 80rpm.

[0046] (2) Next, ethylene-1-octene block copolymer (ethylene-α-octene block copolymer, OBC, trade mark infuse 9807, produced by U.S. DuPont; MFR=0.853g / 10min (190 ℃ / 2.16Kg, ASTMD1238 ), density 0.960g / cm 3 ) and carbon nanotubes (carbon nanotube, CNT, gra...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention, which belongs to the field of sensors, in particular relates to an electronic skin and a preparation method thereof. The invention provides a piezoresistive electronic skin comprising asensing layer; and sides with pit structures of two elastomer films having pit structures are laminated and assembled in opposite to assemble the sensing layer. According to the invention, since thesensing layer has a unique laminated pit micro structure, the sensitivity of the electronic skin is enhanced based on the micro structure; and the electronic skin has excellent stability and is capable of detecting various signals like a sound signal and a sliding signal as well as a body motion state and a physiological signal and the like. The electronic skin has the potential of application tobody health management.

Description

technical field [0001] The invention belongs to the field of sensors, in particular to an electronic skin and a preparation method thereof. Background technique [0002] In recent years, wearable electronic devices integrating various sensors and signal collection systems have emerged rapidly as mobile smart terminals, promoting the intelligent development of production in the home, medical and health and industrial fields. As a kind of wearable device, electronic skin has the characteristics of good adaptability, high sensitivity, small size, light weight and low energy consumption. It can imitate some or some sensing functions of human skin and be used in biological monitoring sense and human-computer interaction. The current electronic skin can usually monitor the movement state and health status of the human body, such as sensing different movements of different parts of the human body, monitoring human body health and physiological indicators such as human breathing, h...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): G01D5/16A61B5/0205
CPCA61B5/02A61B5/0205A61B5/024A61B5/08G01D5/16
Inventor 刘正英黄炎昊杨鸣波郑少笛杨伟
Owner SICHUAN UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap