A method of preparing high-strength, high-conductivity ultra-fine wire alloy material by directional solidification

Abstract

The invention discloses a method for preparing high-strength and high-electroconductivity superfine wire alloy materials by directional solidification. The method for preparing the high-strength and high-electroconductivity superfine wire alloy materials by directional solidification comprises the following steps that raw materials are prepared according to alloy compositions, the raw materials are placed in a vacuum induction melting furnace, the raw materials are subjected to isothermal refining for 20-60min under the conditions that the vacuum degree is 10<-3>-10<-2> Pa and the temperatureis at 1200-1500 DEG C, a dummy bar is adopted for directional solidification forming under the conditions that the drawing speed is 0.1-4mm / min and the cooling water temperature is 15-35 DEG C to obtain a rob balk with phi3-8mm, and finally the alloy rob balk is drawn to obtain the superfine wire alloy materials with the size of phi0.03 mm or below. The method for preparing the high-strength and high-electroconductivity superfine wire alloy materials by directional solidification effectively shortens the process flows such as traditional vacuum melting, forging and blank-opening, wire blank rolling and wire blank drawing; and meanwhile, the prepared alloy materials have small wire breakage rate, few inclusions, ordered arrangement of crystal grains, high strength and high electroconductivity.

Description

technical field [0001] The invention belongs to the field of preparation of ultra-fine wire alloy materials, in particular to a method for preparing high-strength and high-conductivity ultra-fine wire alloy materials by directional solidification. Background technique [0002] Special ultra-fine alloy materials mainly refer to ultra-fine copper and precious metal wires. This type of alloy wire belongs to the integrated material of structure and function, and is urgently needed in the new generation of weapons and equipment such as rockets, aircraft and missiles. The domestic development of ultra-fine copper and precious metal wires started in the mid-1960s. Studies have shown that when the diameter of such ultra-fine metal wires is less than or equal to 0.05mm, the mechanical, physical properties, dimensional accuracy and surface There are obvious problems in the matching of performance, which inhibits the further refinement of the wire material and the reliability of its us...

AI Technical Summary

Problems solved by technology

The domestic development of ultra-fine copper and precious metal wires started in the mid-1960s. Studies have shown that when the diameter of such ultra-fine metal wires is less than or equal to 0.05mm, the mechanical, physical properties, dimensional accuracy and surface There are obvious problems in the matching of performance, which inhibits the further refinement of the wire material and the reliability of its use in weaponry. Through microscopic measurement and analysis, it can be seen that the superfine wire materials developed in the early stage generally have surface scratches and burr defects. The depth of scratches and burr defects is between 2-3μm, which makes the effective working wire diameter of ultra-fine wire lose 30-50%

Therefore, the breaking force of ultra-fine wire material products decreases, the volume resistance increases, and because of the uneven distribution of defects on the surface of ultra-fine wires, there are also large differences in the performance of components made of the same batch of filaments. Thus affecting the overall performance of the weapon equipment

[0003] The current experimental research shows that the defects of ultra-fine wire products are mainly caused by: excessive impurities and gas content during alloy smelting, micro-shrinkage during alloy solidification, adhesion traces during alloy disc annealing, and lubrication during the drawing process of alloy filaments. Conditions, as well as factors such as lack of control of environmental conditions in the fine processing process, which lead to broken wires in the later drawing, and the surface is observed by scanning electron microscopy, and it is found that it is a brittle fracture

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