A kind of phosphorus-containing epoxy resin composition and prepreg and laminate prepared by using it
A technology of epoxy resin and prepreg, applied in synthetic resin layered products, application, lamination, etc., can solve the problems of low peel strength of DPO epoxy resin, resin reaction, poor dielectric properties, etc.
Active Publication Date: 2021-01-15
SHENGYI TECH SUZHOU
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- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
However, due to the hydrolysis problem of DOPO rings under high temperature, high humidity or alkaline conditions, the phosphoric acid produced by hydrolysis will corrode copper lines, such as P-O-C bonds in phosphorus-containing epoxy resins or phosphorus-containing flame retardants are hydrolyzed to form P-OH Bonding, the residual acid or the acid produced after hydrolysis will cause the metal surface or metal wire to corrode and cause metal ion migration, which will affect the electrical performance of the circuit board or package
[0003] Chinese invention patent application CN101357999 discloses an epoxy resin containing a DPO structure, and compared with an epoxy resin containing a DOPO structure, it is concluded that the DPO epoxy resin has better heat and humidity resistance, but found in practical applications : DPO epoxy resin has low peel strength, relatively poor flame retardancy, and slightly poor dielectric properties, which cannot meet the requirements of high-performance copper clad laminates.
[0004] On the other hand, the additive flame retardants in the prior art are all physically blended in the resin system and cannot react with the resin, resulting in high water absorption and poor heat resistance of the resin system
Method used
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Examples
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Effect test
Synthetic example 1
[0067] Add 20.2 g of DPO (structural formula 4), 20.5 g of 3-isocyanatopropyltrimethoxysilane, 70 g of dichloromethane, and 0.2 g of triethylamine into a four-port reaction kettle equipped with stirring and condensing equipment and nitrogen, Raise the temperature to 110°C, react for 8 hours, and distill off the dichloromethane under reduced pressure to obtain powder DPO-3-isocyanatopropyltrimethoxysilane.
Synthetic example 2
[0069] Add 31g of DPO-HQ (structural formula 5), 41g of 3-isocyanatopropyltrimethoxysilane, 100g of xylene, and 0.25g of triethylamine into a four-port reaction kettle equipped with stirring and condensing equipment and nitrogen, and heat up To 140°C, react for 6 hours, and distill off xylene under reduced pressure to obtain powder DPO-HQ-3-isocyanatopropyltrimethoxysilane.
Synthetic example 3
[0071] Add 36g of DPO-NQ (structural formula 6), 41g of 3-isocyanatopropyltrimethoxysilane, 100g of toluene, and 0.3g of triethylamine into a four-port reaction kettle equipped with stirring and condensing equipment and nitrogen, and heat up to 180°C, reacted for 7 hours, and distilled off the toluene under reduced pressure to obtain powder DPO-NQ-3-isocyanatopropyltrimethoxysilane.
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Abstract
The invention discloses a phosphorus-containing epoxy resin composition. The composition comprises: in parts by weight, 100 parts of (A) phosphorus compound-modified epoxy resin and 1-100 parts of (B)a curing agent. The phosphorus-containing epoxy resin composition has the characteristics of halogen-free flame retardancy, high dampness-heat resistance, low water absorption rate, high flame retardancy, high peel strength and good dielectric properties, and a prepreg and a laminated board which are prepared by using the resin composition has the characteristics of halogen-free flame retardancy,high dampness-heat resistance, low water absorption rate, high flame retardancy, high peel strength and good dielectric properties at the same time, and can be used as a printed circuit board for electronic instruments.
Description
technical field [0001] The invention relates to a phosphorus-containing epoxy resin composition and a prepreg and a laminate prepared by using the composition, belonging to the technical field of electronic materials. Background technique [0002] In the prior art, traditional brominated flame retardants such as brominated epoxy resin, tetrabromobisphenol A, etc., have excellent flame retardancy and relatively low price, and have always been the main flame retardants for ordinary FR-4 copper clad laminates. However, with the improvement of people's quality of life and safety awareness, people have higher and higher requirements for the safety of electronic products around them. Brominated flame retardants produce dioxins, polybrominated dibenzofurans and other irritating and corrosive toxic gases such as hydrogen bromide during combustion, which endanger people's health and cause pollution. In addition, due to the weak bond energy of the carbon-bromine bond in the bromine-c...
Claims
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IPC IPC(8): C08G59/14C08L63/00B32B15/092B32B27/20B32B27/38B32B33/00B32B37/06B32B37/10
CPCB32B15/092B32B27/20B32B27/38B32B33/00B32B37/06B32B37/10B32B2307/204B32B2307/306B32B2307/3065B32B2307/7246B32B2307/7265B32B2457/08C08G59/1488C08L63/00
Inventor 马建陈诚崔春梅何继亮黄荣辉杨宋储正振
Owner SHENGYI TECH SUZHOU