A kind of preparation method of piezoelectric composite material and driver

Abstract

The invention discloses a preparation method of a piezoelectric composite material and a driver. The preparation method comprises the following steps of pasting a piezoelectric material on a cutting board; cutting the piezoelectric material into a laminar piezoelectric material with a first set thickness by adopting a wire cutting machine, and recording the material as a first laminar piezoelectric material; performing polishing and grinding on the first laminar piezoelectric material to acquire a laminar piezoelectric material with the second set thickness, and recording the material as the second laminar piezoelectric material; pasting the second laminar piezoelectric material on a cutting carrier film, and conducting fixing by adopting a tightening disk; performing mechanical cutting onthe second laminar piezoelectric material borne on the cutting carrier film, and manufacturing a piezoelectric array with the continuously adjustable piezoelectric phase volume fraction; pouring theclearance between the piezoelectric phases in the piezoelectric array by adopting a polymer matrix, and curing and forming; taking off the cutting carrier film to obtain the piezoelectric composite material. The preparation method of the piezoelectric composite material and the driver provided by the invention has the features of being simple in preparation process and high in efficiency.

Description

technical field [0001] The invention relates to the technical field of preparation of piezoelectric composite materials, in particular to a preparation method of a piezoelectric composite material and a preparation method of a driver using the piezoelectric composite material. Background technique [0002] Piezoelectric composite materials are multi-phase materials composed of piezoelectric ceramics, single crystals, polymers, and metals. They combine the characteristics of piezoelectric ceramics and substrates, and have small dielectric constants, low densities, and good toughness. Features. Since the concept of piezoelectric composite materials was proposed by Newnham of the Materials Laboratory of Pennsylvania State University in the United States in 1978, piezoelectric composite materials have experienced more than 40 years of development history. At present, their theory, preparation technology and application development have made great progress. , by selecting differ...

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Problems solved by technology

[0004] Among the above three common preparation methods, the preparation process of the arrangement-casting method is complicated, and the loss rate caused by the brittleness of the piezoelectric ceramic phase is high, and it is not easy to mass-produce; the casting-lamination method has many processes and a high loss rate during the stacking process. , the two-phase interface of the finished product is not well bonded, and it is difficult to sinter the ceramic flakes prepared by tape casting, and the flatness of the flakes is difficult to determine

Although the cutting-casting-thinning method has the advantages of simple process and large-scale production, it also has obvious disadvantages: if the piezoceramic is completely cut through when cutting, the piezoceramic columns will be scattered when removed, and manual rearrangement is required ; If it is not cut through, cutting after pouring the polymer matrix will cause problems in the interface between the piezoelectric phase and the polymer phase due to the large mechanical shock and vibration during the cutting process, and it will not be possible to cut a large piece of complete piezoelectric ceramics / Polymer composite materials, and it is impossible to make thinner piezoelectric composite materials. At the same time, the increased subsequent thinning process will complicate the entire preparation process, reduce efficiency, and waste raw materials

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