47results about How to "Precise and controllable size" patented technology

The invention discloses an unmanned aerial vehicle body integrated molding technology. Carbon fiber prepreg and lightweight foam are used as raw materials, are paved on the inner wall of a double-female mold combination mold by adopting a prepreg lapping joint integral layering technology, and then are integrally solidified and molded by adopting an autoclave molding technology. The unmanned aerial vehicle body integrated molding technology has the beneficial effects that the technology is simple and is easy to operate; the molding time is short; the product size is accurate and controllable;and a manufactured unmanned aerial vehicle body has high strength, good rigidity, light dead weight and a smooth and fat surface, is easy to maintain routinely and is suitable for large batch production.

The invention discloses a method for manufacturing an uncooled infrared focal plane array pixel with a silicon-germanium film. The method includes the steps of transferring the silicon-germanium film to a CMOS wafer from an SOI wafer, etching the silicon-germanium film to form a channel, forming a metal top electrode with a lift-off method, etching the silicon-germanium film to form a sensitive block, depositing a silicon nitride supporting film with a PECVD method, carrying out electroplating to grow metal electrode columns, sputtering TiW to form a circuit, sputtering an infrared absorption layer, etching a silicon nitride layer, a TiW layer and the like, forming an L-shaped cantilever beam and the like. According to the method, silicon-germanium/silicon quantum well materials are successfully applied to the field of micrometering bolometers, and the range of sensitive materials capable of being used for making an uncooled infrared focal plane is expanded; it is considered that the silicon-germanium/silicon quantum well materials are three-dimensional electric conducting materials, a U-shaped loop is formed in the mode of etching the channel, and the resistance of the sensitive area is improved; the silicon nitrogen film is introduced, a lambda/4 resonance infrared absorption cavity is formed in the sensitive area, the size of the infrared absorption cavity is accurately controlled, and the infrared absorption rate is effectively improved.

The invention relates to a method for preparing a single-electron transistor by assembling gold particles on a PS microsphere template. According to the method, a silicon dioxide substrate is formed on the surface of a silicon base sheet; a coulomb island and an electrode are arranged on the silicon dioxide substrate in an integrated manner; an evenly and compactly-arranged PS microsphere single-layer film template is prepared on the silicon dioxide substrate; an electric beam evaporation coating method is utilized to plate a gold film on the surface of the PS microsphere single-layer film template; a chemical etching method and post-treatment are adopted, so that a gold nanoparticle array is obtained; an aluminum oxide barrier layer is formed on the gold nanoparticle array by using atomic layer deposition; the electrode is prepared by using electron beam exposure, electron beam evaporation coating and/or peeling methods; and an aluminum oxide protective layer is prepared on the electrode and the aluminum oxide barrier layer through using atomic layer deposition. The coulomb island is a size-controllable array, and therefore, positioning and batch preparation can be facilitated; and the size of the barrier between the coulomb island and the electrode can be precisely controlled. The method can be widely applied to fields such as photon, electronics, environment and security fields.

The invention discloses a preparation method of a continuous fiber enhanced thermoplastic resin composite paddle. The method comprises the following steps: preparing a continuous fiber enhanced thermoplastic resin unidirectional prepreg tape; clipping the unidirectional prepreg tape into two types of master slices along a 0-degree direction and a 90-degree direction, alternately stacking master slice groups formed by the two types of master slices in an orthometric manner, laying a core model in the middle of the master slice groups, transferring the master slice groups into a paddle die, performing hot press molding, and then performing machining trimming treatment, so as to obtain the paddle. The preparation method adopts hot-pressing technology, realizes one-step molding, is short in molding time, and ensures that product size is accurate and controllable; the formed paddle is excellent in mechanical property, anti-fatigue performance and corrosion-resistant performance, is light inweight and recyclable, and can be machined repeatedly.

The invention discloses a preparation method of myocardial tissue sensor and a myocardial tissue chip, and belongs to the technical fields of tissue engineering, biomedicine engineering and sensor. The myocardial tissue sensor comprises a myocardial tissue chip and auxiliary parts, wherein the auxiliary parts include an upper die, a lower die, an upper electrode, a lower electrode, a sensitive plate, a parallel light source and a data acquisition system. According to the invention, myocardial cells are sequentially printed on a glass sheet coated with N-isopropylacrylamide and polydimethylsiloxane by virtue of a cell printing technology so as to prepare the myocardial tissue chip; the myocardial tissue chip is kept in the auxiliary parts and is subjected to pulsatile cultivation to form myocardial tissues consistent in beating rhythm, and then the myocardial tissues are kept in a culture solution containing a medicine and undergo electrical stimulation; and a contractile change signal is collected to evaluate the effect of the medicine on cardiac muscle, so as to achieve the purposes of drug screening, testing and the like. The myocardial tissue sensor disclosed by the invention has the advantages of simple device, wide scope of testing medicine, easy detection and processing of signal, and the like.

The invention discloses a porous liquid guiding, heating and atomizing assembly with a supporting shell. The assembly includes a porous liquid guide body used for absorbing and transferring liquid, one or more supporting shells used for supporting the porous liquid guide body, an electric heating track used for heating, evaporating and atomizing the liquid after being powered on, and one or moreoil inlet holes which are through front and back are formed in each supporting shell. The invention provides a porous liquid guiding, heating and atomizing assembly with a supporting shell and a preparation method thereof. The porous liquid guide body and a mold injection molding process are creatively combined, the problems that the porous liquid guide body is poor in strength, large in dimensional tolerance, rough in surface and prone to damage are solved on the basis that the liquid guide characteristic of the porous liquid guide body is guaranteed, the strength of the porous liquid guide body is good, the size is accurate and controllable, and large-batch automatic production is facilitated.

A preparation method of an optical waveguide sensing chip comprises immersing a gold film substrate in an organic solution of mercapto silance to be processed, processing the processed gold film substrate by utilizing an acid solution, pasting a porous anodic aluminum oxide film to a surface of a gold film, immersing the aluminum oxide film pasted to the surface of the gold film in a mixed solution of cetyltrimethyl ammonium bromide (CTAB), water, ethyl alcohol, concentrated ammonia liquor and tetraethyl orthosilicate (TEOS) and standing for a period of time, and processing the processed product by utilizing an acid solution to remove the porous aluminum oxide film. The invention discloses the optical waveguide sensing chip and use of the optical waveguide sensing chip for non-labeled optical biological detection or heavy metal ion detection. The optical waveguide sensing chip is an optical waveguide sensing chip prepared by the method based on a nano-column array film. The optical waveguide sensing chip can be used to perform the high-sensitivity non-labeled optical biological detection or the high-sensitivity heavy metal ion detection.

The invention relates to a method for fabricating n-MOSFET with composite double-layer epitaxy by boron implantation before epitaxy which includes carry out p-type island photolithography and boron implantation before epitaxy process, and carrying out buffer lay epitaxy and voltage-resistant layer epitaxy after junction substrate material is selected and epitaxy process is carried out. The subsequent process is the same as that of conventional power MOSFETs. The implantation window size of p-type island and the implantation dose of boron are strictly controlled to ensure that the device is inunipolar mode when conducting. At that same time, when the device is in the blocking state, the p-type island pair buffer layer The electric field near the high and low junctions of the substrate canbe adjusted to improve the electric field distribution near the high and low junctions and to increase the single event burnout threshold of the device.

The invention discloses a preparation method of a piezoelectric composite material and a driver. The preparation method comprises the following steps of pasting a piezoelectric material on a cutting board; cutting the piezoelectric material into a laminar piezoelectric material with a first set thickness by adopting a wire cutting machine, and recording the material as a first laminar piezoelectric material; performing polishing and grinding on the first laminar piezoelectric material to acquire a laminar piezoelectric material with the second set thickness, and recording the material as the second laminar piezoelectric material; pasting the second laminar piezoelectric material on a cutting carrier film, and conducting fixing by adopting a tightening disk; performing mechanical cutting onthe second laminar piezoelectric material borne on the cutting carrier film, and manufacturing a piezoelectric array with the continuously adjustable piezoelectric phase volume fraction; pouring theclearance between the piezoelectric phases in the piezoelectric array by adopting a polymer matrix, and curing and forming; taking off the cutting carrier film to obtain the piezoelectric composite material. The preparation method of the piezoelectric composite material and the driver provided by the invention has the features of being simple in preparation process and high in efficiency.

The invention belongs to the technical field of refractory materials, and particularly relates to a method for preparing an yttrium oxide refractory material product through gel casting and a crucible. Aiming at the problem that pure-phase yttrium oxide is only suitable for preparing a crucible with a relatively small size and cannot meet the smelting and casting requirements of a large-size cast ingot, the invention provides the method for preparing the yttrium oxide refractory material product, which is simple in preparation process, controllable in size and excellent in performance, and four kinds of Y2O3 particles or micron fine powder with different sizes are adopted; y2O3 with different sizes is added according to a reasonable sequence and proportion, and the obtained product has good mechanical properties and thermal shock resistance at the same time. Meanwhile, by combining the reasonable selection of the dispersing agent and the suspending agent and the precise system of glue discharging and sintering, the finally obtained product, especially the yttrium oxide crucible, has excellent comprehensive performance.

The invention discloses a preparation method of a microporous atomizing sheet, wherein the atomizing sheet is used as a base material. The method includes that a thin film is deposited on a microporous pore channel inner wall and the surface of the base material, and the base material deposited with the thin film is cured. The invention also discloses the microporous atomizing sheet and a microporous atomization device.

The invention discloses a method for preparing a large-size, high-purity and high-density molybdenum trioxide target material. The method comprises the specific steps: 1, carrying out roasting treatment on ammonium molybdate to obtain high-purity molybdenum trioxide powder; 2, carrying out ball milling treatment on the high-purity molybdenum trioxide powder; 3, adding a certain amount of forming agent to the molybdenum trioxide powder subjected to ball milling treatment to be uniformly mixed; 4, pressing the uniformly mixed molybdenum trioxide powder into a blank; 5, drying the molybdenum trioxide blank, putting the molybdenum trioxide blank into a sheath to be vacuumized, welded and sealed, then carrying out hot isostatic pressing treatment, and removing the sheath to obtain a molybdenumtrioxide target material crude product; and 6, machining and cleaning the obtained molybdenum trioxide target material crude product to finally obtain the high-purity and high-density molybdenum trioxide target material. According to the method for preparing the large-size, high-purity and high-density molybdenum trioxide target material, the large-size, high-purity and high-density molybdenum trioxide target material can be prepared, and the preparation rate is high.