The present invention relates to a 5G metal / ceramic composite circuit board and a preparation method therefor. The preparation method comprises the following steps: alternately depositing metal layers and ceramic layers on a metal substrate with a preset hole by using a PVD technique, to obtain a 5G metal / ceramic composite circuit board. According to the preparation method for a metal / ceramic composite circuit board of the present invention, the difficulties of a conventional technique (a ceramic / metal thermal diffusion bonding method) for a metal / ceramic composite circuit board, such as being complex, low in yield, high in price, low in efficiency and undeveloped in terms of technique, are avoided. In addition, according to the preparation method of the present invention, a metal substrate with a hole is selected, such that the problems of laser / mechanical composite drilling of a ceramic substrate whereby same is low in yield, large in terms of workload, and undeveloped in terms of drilling technique, are solved. In the present invention, a combined technique of a physical vapor deposition technique and a template technique is used to deposit the metal layer and the ceramic layer, all the layers in the obtained metal / ceramic composite circuit board are high in terms of bonding strength and are not prone to stripping, and the technique is simple.