Epoxy adhesive and preparation method thereof

An epoxy adhesive and epoxy resin technology, applied in the polymer field, can solve the problems of affecting the viscosity of the system, affecting the operability, affecting the bonding effect, etc., to achieve damage, moderate curing speed, high bonding strength and peeling strength. Effect

Inactive Publication Date: 2019-05-21
TONSAN ADHESIVES INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It is difficult for traditional epoxy adhesives to meet the above requirements at the same time
To meet the requirements of high strength and high toughness, a large amount of toughening agent needs to be added, and the addition of toughening agent will often affect the viscosity of the system, thereby affecting the operability, and the wettability of the honeycomb board, thus affecting the final product. Adhesive effect

Method used

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  • Epoxy adhesive and preparation method thereof
  • Epoxy adhesive and preparation method thereof
  • Epoxy adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0068] The present embodiment provides a kind of epoxy adhesive:

[0069] A component is made up of the material of following parts by weight:

[0070] 100 parts of bisphenol A epoxy resin, 10 parts of butanediol glycidyl ether, 10 parts of toughening agent, 2 parts of silane coupling agent, 0.1 part of wetting and dispersing agent, 10 parts of silicon micropowder, 40 parts of talc powder, calcium carbonate 15 parts, 0.3 parts of organic bentonite, and 0.3 parts of white carbon black.

[0071] Component B is made up of the following materials by weight:

[0072] 80 parts of polyamide curing agent, 20 parts of phenalkamine curing agent, 4 parts of triethylenetetramine, 2 parts of silane coupling agent; 10 parts of silicon micropowder, 65 parts of talcum powder, 5 parts of calcium carbonate, 0.3 parts of organic bentonite, white carbon Black 0.3 parts.

Embodiment 2

[0074] The present embodiment provides a kind of epoxy adhesive:

[0075] A component is made up of the material of following parts by weight:

[0076] 100 parts of bisphenol A epoxy resin, 10 parts of butanediol glycidyl ether, 15 parts of toughening agent, 2 parts of silane coupling agent, 0.1 part of wetting and dispersing agent, 10 parts of silicon micropowder, 40 parts of talc powder, calcium carbonate 10 parts, 0.3 parts of organic bentonite, and 0.3 parts of white carbon black.

[0077] Component B is made up of the following materials by weight:

[0078] 80 parts of polyamide curing agent, 20 parts of phenalkamine curing agent, 4 parts of triethylenetetramine, 2 parts of silane coupling agent; 10 parts of silicon micropowder, 65 parts of talcum powder, 5 parts of calcium carbonate, 0.3 parts of organic bentonite, white carbon Black 0.3 parts.

Embodiment 3

[0080] The present embodiment provides a kind of epoxy adhesive:

[0081] A component is made up of the material of following parts by weight:

[0082] 100 parts of bisphenol A epoxy resin, 12 parts of butanediol glycidyl ether, 15 parts of toughening agent, 2 parts of silane coupling agent, 0.1 part of wetting and dispersing agent, 10 parts of silicon micropowder, 40 parts of talcum powder, calcium carbonate 15 parts, 0.3 parts of organic bentonite, and 0.3 parts of white carbon black.

[0083] Component B is made up of the following materials by weight:

[0084] 80 parts of polyamide curing agent, 20 parts of phenalkamine curing agent, 4 parts of triethylenetetramine, 2 parts of silane coupling agent; 10 parts of silicon micropowder, 65 parts of talcum powder, 5 parts of calcium carbonate, 0.3 parts of organic bentonite, white carbon Black 0.3 parts.

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Abstract

The invention relates to the technical field of polymers, in particular to an epoxy adhesive and a preparation method thereof. The epoxy adhesive comprises a component A and a component B, wherein thecomponent A comprises the following substances in parts by weight: 80 to 100 parts of epoxy resin, 5 to 15 parts of a diluting agent, 10 to 30 parts of a toughening agent, 0 to 5 parts of a silane coupling agent, 0 to 0.5 part of a wetting dispersing agent, 0 to 30 parts of silica powder, 30 to 100 parts of talcum powder, 0 to 30 parts of calcium carbonate, and 0 to 2 parts of a thixotropic agent; the component B comprises the following substances in parts by weight: 80 to 100 parts of an amine curing agent, 0 to 6 parts of a silane coupling agent, 0 to 30 parts of silica powder, 30 to 100 parts of talcum powder, 0 to 30 parts of calcium carbonate, and 0 to 2 parts of a thixotropic agent . Compared with the epoxy adhesive with same viscosity, the epoxy adhesive of the invention is higherin adhesion strength and stripping strength, moderate in curing speed, not only capable of satisfying the large-area coating, but also capable of being used for small-area adhesion, and not only capable of being cured at the normal temperature, but also capable of being rapidly cured in a heating manner, thereby meeting the requirements of different working conditions.

Description

technical field [0001] The invention relates to the technical field of polymers, in particular to an epoxy adhesive and a preparation method thereof. Background technique [0002] Aluminum honeycomb composite panels are widely used in construction, rail transit and other industries. The bonding area of ​​aluminum honeycomb composite panels is relatively large, the honeycomb forms are various, and the process requirements are also different. This puts forward higher requirements and stronger adaptability for the adhesive, especially the rail transit industry has high requirements for bonding strength and toughness, and also requires heat resistance. It is difficult for traditional epoxy adhesives to meet the above requirements at the same time. To meet the requirements of high strength and high toughness, a large amount of toughening agent needs to be added, and the addition of toughening agent will often affect the viscosity of the system, thereby affecting the operability...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/06C09J11/04C09J11/08C08G59/60C08G59/62
Inventor 王浩师力
Owner TONSAN ADHESIVES INC
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